Abstract: The present disclosure is directed to organotin cluster compounds having formula (I) and their use as photoresists in extreme ultraviolet lithography processes.

Abstract: A wide-angle lens assembly includes a first lens including negative refractive power and a concave surface, a second lens including a meniscus lens with negative refractive power, a third lens, a fourth lens including positive refractive power and a convex surface, a fifth lens including a biconvex lens, a sixth lens including a biconvex lens, a seventh lens including positive refractive power and a convex surface, an eighth lens including a biconcave lens, a ninth lens including negative refractive power, and a stop disposed between the fourth lens and the sixth lens. The eighth lens is disposed between the fifth and seventh lenses and is cemented with at least one lens. The ninth lens is disposed between the fifth lens and an image side. The wide-angle lens assembly satisfies 1.3<A/IH<2.1 where A is a diameter of the stop and 1H is a maximum image height of the wide-angle lens assembly.

Abstract: An application and network analytics platform can capture telemetry from servers and network devices operating within a network. The application and network analytics platform can determine an application dependency map (ADM) for an application executing in the network. Using the ADM, the application and network analytics platform can resolve flows into flowlets of various granularities, and determine baseline metrics for the flowlets. The baseline metrics can include transmission times, processing times, and/or data sizes for the flowlets. The application and network analytics platform can compare new flowlets against the baselines to assess availability, load, latency, and other performance metrics for the application. In some implementations, the application and network analytics platform can automate remediation of unavailability, load, latency, and other application performance issues.

Abstract: A fastener includes a base having a joint plate extended therefrom toward a first direction, a joint plate extended from the joint plate toward a second direction and configured to secure to an electronic base board, and a fastening member protruded thereon toward a third direction. The fastener includes an elastic compressive unit connected to the joint plate and including a pushing part configured to abut with a circuit board downwardly rotated. Subject to the stress in the first direction and applied by the circuit board, the pushing part is moved back and the elastically-compressive unit is compressed to make the circuit board rotate to the bottom side of the pushing part, and an edge of the circuit board can be inserted into and abutted thereon the fastening member, and the circuit board is accommodated in a fastening space formed on the outside of the fastening member.

Abstract: The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.

Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.

Abstract: An embodiment is an apparatus, such as a plasma chamber. The apparatus includes chamber walls and a chamber window defining an enclosed space. A chamber window is disposed between a plasma antenna and a substrate support. A gas delivery source is mechanically coupled to the chamber window. The gas delivery source comprises a gas injector having a passageway, a window at a first end of the passageway, and a nozzle at a second end of the passageway. The nozzle of the gas delivery source is disposed in the enclosed space. A fastening device is mechanically coupled to the gas delivery source. The fastening device is adjustable to adjust a sealing force against the gas injector.

Abstract: Methods and apparatus of processing cube face images are disclosed. According one method, each set of six cubic faces is converted into one rectangular assembled image by assembling each set of six cubic faces to maximize a number of continuous boundaries and to minimize a number of discontinuous boundaries. Each continuous boundary corresponds to one boundary between two connected faces with continuous contents from one face to another face. Each discontinuous boundary corresponds to one boundary between two connected faces with discontinuous contents from one face to another face. The method may further comprise applying video coding to the video sequence outputting the compressed data of the video sequence. According to another method, a fully-connected cubic-face image representing an unfolded image from the six faces of the cube is generated and the blank areas are filled with padding data to form a rectangular assembled image.

Abstract: A lid detecting system includes a first lid screwing device, a second lid screwing device, a scanning device and a removing device. The first lid screwing device is configured for positioning a lid of a container on a body of the container and rotationally tightening the lid of the container to the body of the container by a pre-screwing torque. The second lid screwing device is configured for rotationally tightening the lid of the container to the body of the container by a screwing torque. The scanning device is disposed between the first lid screwing device and the second lid screwing device and configured for scanning a top surface of the lid of the container so as to obtain a detecting value. The removing device is configured for removing the container when the detecting value is greater than a predetermined value.

Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.

Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

Abstract: A light generation system is provided. The light generation system includes a vaporization device, a laser device and a lens structure. The vaporization device is configured to vaporize a metal-nonmetal compound to generate a metal-nonmetal precursor gas. The laser device is configured to provide laser light, and irradiate the metal-nonmetal precursor gas released from the vaporization device with the laser light to emit a light signal. The lens structure is configured to direct the light signal toward a photomask used in a lithography process.

Abstract: An application and network analytics platform can capture telemetry from servers and network devices operating within a network. The application and network analytics platform can determine an application dependency map (ADM) for an application executing in the network. Using the ADM, the application and network analytics platform can resolve flows into flowlets of various granularities, and determine baseline metrics for the flowlets. The baseline metrics can include transmission times, processing times, and/or data sizes for the flowlets. The application and network analytics platform can compare new flowlets against the baselines to assess availability, load, latency, and other performance metrics for the application. In some implementations, the application and network analytics platform can automate remediation of unavailability, load, latency, and other application performance issues.

Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.

Abstract: The wireless communication device includes one or more wireless transceivers and a controller. The one or more wireless transceivers detect(s) one or more first frequency bands of one or more cellular networks, and detect(s) one or more second frequency bands of one or more non-cellular networks. The controller selects one of the first frequency bands and one of the second frequency bands, which do not overlap, and assigns the selected first frequency band to one of the wireless transceivers, thereby enabling one of the wireless transceivers to camp on a cell on the selected first frequency band. Also, the controller assigns the selected second frequency band to one of the wireless transceivers, thereby enabling one of the wireless transceivers to connect to one of the non-cellular networks on the selected second frequency band.

Abstract: An electrical protection device used in a controller of a mechanical equipment is disclosed to include a circuit board, and a pre-stage protection circuit and a post-stage protection circuit formed on the circuit board. The pre-stage protection circuit connects a power supply and a pre-stage of the controller, providing an electrical protection condition such that when a transient surge energy of the power supply surpasses the electrical protection condition, the pre-stage protection circuit blocks the transient surge energy from entering the controller. The post-stage protection circuit connects pre-stage protection circuit and a post-stage of the controller. Further, when the transient surge energy occurs, a response speed of the post-stage protection circuit is slower than that of the pre-stage protection circuit. The electrical protection device of the invention effectively blocks transient surge energy, avoiding electronic system component damage of the mechanical equipment.

Abstract: An equalizer system includes at least one equalizer configured to equalize an input signal to generate an equalized input signal; a limiting amplifier coupled to the at least one equalizer, and configured to amplify the equalized input signal to a saturated level to generate an output signal; and a control circuit coupled to the at least one equalizer and the limiting amplifier, and configured to generate at least one control signal to the at least one equalizer according to the equalized input signal to adjust a peak gain of the at least one equalizer, wherein the peak gain of the at least one equalizer is at a Nyquist frequency.

Abstract: An electronic package is provided. The electronic package includes an encapsulating layer encapsulating a plurality of conductive pillars and an interposer board that has through-silicon vias. An electronic component is disposed on the encapsulating layer and electrically connected to the conductive pillars and the through-silicon vias. The conductive pillars act as an electric transmission path of a portion of electric functions of the electronic component. Therefore, the number of the through-silicon vias is reduced, and the fabrication time and chemical agent cost are reduced. Also, the through silicon interposer of a large area can be replaced by a smaller one, and the yield is increased. Further, a method of fabricating an electronic package is provided.