Patents by Inventor An Lin

An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190333436
    Abstract: The present invention provides a solution for a highlight or multicolor display device, in which each display cell can display high quality color states. More specifically, an electrophoretic fluid is provided which comprises three types of pigment particles, having different levels of size, threshold voltage or charge intensity.
    Type: Application
    Filed: May 15, 2019
    Publication date: October 31, 2019
    Inventors: Ming WANG, Yu LI, Hui DU, Xiaojia ZHANG, Craig LIN
  • Publication number: 20190330518
    Abstract: A CO2-sensitive fracturing and displacement fluid contains a surfactant, an auxiliary agent, water, and CO2, wherein CO2 is liquid and/or supercritical CO2. The CO2-sensitive fracturing and displacement fluid provided by the invention does not flow back after completion of fracturing construction, and the gel breaking fluid displacement is carried out after soak for a period of time to improve the tight oil recovery ratio. The CO2-sensitive fracturing and displacement fluid exerts the “one-agent multi-purpose” function of sand carrying, CO2 energization and oil displacement, surfactant imbibition and oil discharge of a fracturing-displacement system in different development and production stages, and achieves the dual goals of expanding the utilization degree of tight oil and improving the displacement efficiency of the tight oil, which can effectively reduce costs and achieve the goal of unified, highly efficient and green development of oil and gas fields.
    Type: Application
    Filed: April 23, 2019
    Publication date: October 31, 2019
    Applicants: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA), CHINA UNIVERSITY OF GEOSCIENCES (BEIJING), SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE LTD., PETRO CHINA
    Inventors: Caili DAI, Mingwei GAO, Mingwei ZHAO, Qing YOU, Guang ZHAO, Yining WU, Yongpeng SUN, Lin LI, Yifei LIU, He LIU, Xin WANG, Baoshan GUAN
  • Publication number: 20190333900
    Abstract: A package includes a first package including a device die, a molding compound molding the device die therein, a through-via penetrating through the molding compound, and a first plurality of Redistribution Lines (RDLs) and a second plurality of RDLs on opposite sides of the molding compound. The through-via electrically couples one of the first plurality of RDLs to one of the second plurality of RDLs. The package further includes a second package bonded to the first package, a spacer disposed in a gap between the first package and the second package, and a first electrical connector and a second electrical connector on opposite sides of the spacer. The first electrical connector and the second electrically couple the first package to the second package. The spacer is spaced apart from the first electrical connector and the second electrical connector.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shih Ting Lin, Shin-Puu Jeng
  • Publication number: 20190334374
    Abstract: An operation method of an uninterruptible power supply control device is described below. The uninterruptible power supply control device is electrically coupled to a voltage output terminal of a portable power device and a ground terminal of the portable power device. At least one electrical power conversion device has one end electrically coupled to the voltage output terminal and the other end electrically coupled to the ground terminal. If the portable power device's current is less than a threshold current of the portable power device and maintained for a first duration which is less than a threshold duration of the portable power device, an enabling current greater or equal to the threshold current is generated between the voltage output terminal and the ground terminal and as part of the current.
    Type: Application
    Filed: August 2, 2018
    Publication date: October 31, 2019
    Inventor: CHEN-HSIANG LIN
  • Publication number: 20190330547
    Abstract: Provided is a conversion process for an inferior oil, relating to the field of biomass utilization, energy and chemical industry. The conversion process is carried out in presence of a catalyst selected from the group consisting of an iron oxide compound, a desulfurization waste agent resulting from use of an iron oxide compound as desulfurizer, and a regeneration product of the desulfurization waste agent, under a controlled molar ratio of iron element to sulfur element. It is found that free radical condensation polymerization of inferior oil during cracking process can be blocked effectively by using carbonylation, and hydrogenation is achieved with active hydrogen produced from the conversion of CO and water. In the conversion process, inferior oil can be, directly converted, thereby increasing liquefaction yield and calorific value of the obtained oils. No large amount of waste water is generated after completion of the conversion.
    Type: Application
    Filed: May 30, 2019
    Publication date: October 31, 2019
    Inventors: Ke LIN, Lixin GUO, Yongjun CUI
  • Publication number: 20190333807
    Abstract: A semiconductor structure includes a conductive feature, a first metal-based etch-stop layer over the underlying structure, a metal-free etch-stop layer over the first metal-based etch-stop layer, a second metal-based etch-stop layer over the metal-free etch-stop layer, an interlayer dielectric layer over the second metal-based etch-stop layer, and an interconnect structure extending through the first metal-based etch-stop layer, metal-free etch-stop layer, and the second metal-based etch-stop layer, wherein a bottom portion of the conductive interconnect structure directly contacts the conductive feature. The first metal-based etch-stop layer may include a first metallic component having one of aluminum, tantalum, titanium, or hafnium, and the second metal-based etch-stop layer may include a second metallic component the same as or different from the first metallic component. The first metal-based etch-stop layer and the second metal-based etch-stop layer may both be free of silicon.
    Type: Application
    Filed: April 27, 2018
    Publication date: October 31, 2019
    Inventors: Szu-Ping Tung, Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan
  • Publication number: 20190332726
    Abstract: A checking method for checking whether a signal in a chip is interference-free, and the checking method includes the following operations: analyzing, by a processor, a netlist file to acquire a first node for outputting the signal in the chip, in which the netlist file is configured to describe a circuit architecture of the chip; searching, by the processor, candidate nodes associated with the signal according to the netlist file and the first node; and determining, by the processor, whether a first candidate node of the candidate nodes is connected to an anti-interference circuit, in order to check whether the signal is interference-free.
    Type: Application
    Filed: September 17, 2018
    Publication date: October 31, 2019
    Inventors: Shu-Yi KAO, Yu-Lan Lo, Meng-Jung Lee, Yun-Jing Lin
  • Patent number: 10461169
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a metal gate electrode structure and an insulating layer over the semiconductor substrate. The insulating layer surrounds the metal gate electrode structure. The method includes nitrifying a first top portion of the metal gate electrode structure to form a metal nitride layer over the metal gate electrode structure.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Ruei Yeh, Chih-Lin Wang, Kang-Min Kuo
  • Patent number: 10457799
    Abstract: The invention provides a composition comprising at least the following: a) a first composition comprising at least one first ethylene-based polymer, formed by high pressure, free-radical polymerization, and wherein the first composition comprises the following properties: a melt index (I2) from 1.0 to 15.0 g/10 min, and density from 0.910 to 0.940 g/cc; b) a second composition comprising at least one second ethylene-based polymer, and wherein the second composition comprises the following properties; a melt index (I2) from 1.0 to 1000 g/10 min, a density greater than 0.940 g/cc; wherein the composition comprises the following properties: melt index (I2) from 2.0 to 20.0 g/10 min, and a density from 0.915 to 0.940 g/cc; and wherein the first composition is present in an amount from 65 to 95 wt %, based on the weight of the composition.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: October 29, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Mehmet Demirors, Teresa P. Karjala, Yijian Lin, James L. Cooper
  • Patent number: 10461586
    Abstract: Methods and apparatus for cross connection detection and mitigation in wireless power transfer networks are disclosed. An example method includes receiving communication data from the second PTU, the communication data being generated by the PRU, wherein the first PTU and the second PTU are capable of providing wireless power to power receiving units; determining that the communication data is intended for the first PTU based on the connected device mapping; and transmitting the communication data to the first PTU.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: October 29, 2019
    Assignee: INTEL CORPORATION
    Inventors: Hooman Shirani-Mehr, Ahmad Farbod Khoshnevis, Xintian E. Lin, Sreenivas Kasturi
  • Patent number: 10457787
    Abstract: A first oriented film comprising a first polyethylene composition which comprises: from 20 to 50 wt % of a first linear low density polyethylene polymer having a density greater than 0.925 g/cc and an I2 lower than 2 g/10 min; and from 80 to 50 wt % of a second linear low density polyethylene polymer having a density lower than or equal to 0.925 g/cc and an I2 greater than or equal to 2 g/10 min; wherein the first polyethylene composition has an I2 from 0.5 to 10 g/10 min and a density from 0.910 to 0.940 g/cc is provided.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: October 29, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Yijian Lin, Mehmet Demirors, Jianping Pan, Xiao B. Yun
  • Patent number: 10460154
    Abstract: Methods and systems for recognizing people in images with increased accuracy are disclosed. In particular, the methods and systems divide images into a plurality of clusters based on common characteristics of the images. The methods and systems also determine an image cluster to which an image with an unknown person instance most corresponds. One or more embodiments determine a probability that the unknown person instance is each known person instance in the image cluster using a trained cluster classifier of the image cluster. Optionally, the methods and systems determine context weights for each combination of an unknown person instance and each known person instance using a conditional random field algorithm based on a plurality of context cues associated with the unknown person instance and the known person instances. The methods and systems calculate a contextual probability based on the cluster-based probabilities and context weights to identify the unknown person instance.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: October 29, 2019
    Assignee: Adobe Inc.
    Inventors: Jonathan Brandt, Zhe Lin, Xiaohui Shen, Haoxiang Li
  • Patent number: 10461808
    Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: October 29, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hank Lin, Bin-Chyi Tseng, Tsung-Chieh Yen
  • Patent number: 10462505
    Abstract: Embodiments are described herein that help allow for applying policies during playback of media. In one aspect, a method is provided that involves a computing device of a media playback system (a) receiving a request to playback one or more media items that are from a playlist associated with a controller application, (b) applying to the one or more media items one or more playback policies that are associated with the controller application, where a given playback policy restricts at least one aspect of playback of at least one of the one or more media items, and (c) causing playback of the one or more media items in accordance with the one or more playback policies.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: October 29, 2019
    Assignee: Sonos, Inc.
    Inventors: Arthur Coburn, IV, Ron Kuper, Ted M. Lin, Sherwin Liu, Luis Vega
  • Patent number: 10460617
    Abstract: A testing system includes apparatus and methods of testing a subject according to a forced-choice scheme. The scheme is based on Thurstonian Item-Response. Theory and is particularly relevant to personality assessment. The invention provides dynamic test generation and scoring for efficient testing of subjects using unique tests.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: October 29, 2019
    Assignee: SHL Group Ltd
    Inventors: Yin Lin, Kenneth Lahti, Dave Bartram, Ilke Inceoglu
  • Patent number: 10460375
    Abstract: Device and method for implementing a vehicle sharing reward program. The present invention provides for a cost-sharing plan where two or more constituencies share the rental cost associated with a user who rents a shared vehicle in a vehicle sharing program. This results in a reimbursement of the rental cost to the user. When enrolling in the vehicle sharing reward program, the user is given a health prescription to adhere to on any trip taken while using a shared vehicle. On a selected travel route, the user visits a vehicle sharing station, where the sharing station includes a kiosk that the user uses to check-in and upload relevant information such as distance traveled and locations visited. By complying with the health prescription issued to the user, the user can have its total rental cost reimbursed.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 29, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chun-Yen Chen, Jian-Ren Chen, Su-Chen Huang, June-Ray Lin
  • Patent number: 10460980
    Abstract: A method for fabricating semiconductor device comprising the steps of: forming a first trench and a second trench in a substrate; forming a liner in the first trench and the second trench; forming a first patterned mask on the substrate to cover the second trench; removing the liner in the first trench; removing the first patterned mask; and forming an insulating layer in the first trench and the second trench to form a trap rich isolation structure in the first trench and a deep trench isolation structure in the second trench.
    Type: Grant
    Filed: February 4, 2018
    Date of Patent: October 29, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Chia-Huei Lin, Kuo-Yuh Yang
  • Patent number: 10461170
    Abstract: A method includes providing a semiconductor structure that includes an epitaxial layer and a cap layer above the epitaxial layer, filling a trench above the cap layer with a sacrificial layer, and removing the sacrificial layer. As such, the cap layer is protected by the sacrificial layer during an etching process and the epitaxial layer is protected by the cap layer during another etching process.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ching-Feng Fu, Yu-Chan Yen, Chih-Hsin Ko, Chun-Hung Lee, Huan-Just Lin, Hui-Cheng Chang
  • Patent number: 10462480
    Abstract: The detailed description presents innovations in performing motion estimation during digital video media encoding. In one example embodiment, motion estimation is performed using a lower-complexity sub-pixel interpolation filter configured to compute sub-pixel values for two or more candidate prediction regions at a sub-pixel offset, the two or more candidate prediction regions being located in one or more reference frames. For a selected one of the candidate prediction regions at the sub-pixel offset, motion compensation is performed using a higher-complexity sub-pixel interpolation filter.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: October 29, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: You Zhou, Chih-Lung Lin, Binlong Li, Ming-Chieh Lee
  • Patent number: 10461080
    Abstract: A method for manufacturing a semiconductor device is provided. In the method for manufacturing a semiconductor device, at first, a semiconductor substrate of a wafer is etched to form at least one fin. Then, an insulation structure is formed around the fin. Thereafter, the fin is recessed. Then, an epitaxial channel structure is epitaxially grown over the recessed fin. Thereafter, a portion of the epitaxial channel structure over a top surface of the insulation structure is removed. Then, a non-contact-type cleaning operation is performed to clean a top surface of the wafer after removing said portion of the epitaxial channel structure. Thereafter, the top surface of the wafer is cleaned using hydrogen fluoride after removing said portion of the epitaxial channel structure. Then, the insulation structure is recessed, such that the epitaxial channel structure protrudes from the recessed insulation structure.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: October 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shen-Nan Lee, Kuo-Yin Lin, Pin-Chuan Su, Teng-Chun Tsai