Patents by Inventor An Liu

An Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250046308
    Abstract: A speech control method includes: receiving a target voice instruction; performing semantic parsing on the target voice instruction, and acquiring a semantic parsing result; and in response to that the semantic parsing result matches a keyword, responding to the target voice instruction by using an application corresponding to the keyword; or in response to that the semantic parsing result does not match a keyword, determining a target service type based on the semantic parsing result, and acquiring an application list corresponding to the target service type; determining a recommended application from the application list by using a first recommendation policy; and responding to the target voice instruction by using the recommended application.
    Type: Application
    Filed: October 16, 2024
    Publication date: February 6, 2025
    Inventors: Hang YAN, Dongsheng YANG, Biying ZHANG, Ke LIU
  • Publication number: 20250046699
    Abstract: Functional component, forming method thereof and electronic device are provided. The functional component includes a packaging substrate and a connecting wire. The packaging substrate includes a through-hole wire-bonding area including a first insulating layer and a wire-bonding electrode sequentially formed on the substrate. The first insulating layer includes a first through hole, and the wire-bonding electrode covers the first through hole. In an area corresponding to the first through hole, the packaging substrate has wire-bonding bump electrodes on a side of the wire-bonding electrode away from the first insulating layer. The connecting wire includes a wire-bonding connection portion and a wire-bonding extension portion connected to the wire-bonding connection portion. The wire-bonding connection portion is fixedly connected to the wire-bonding electrode. The wire-bonding connection portion extends to cover at least a partial area of a side of at least one of the wire-bonding bump electrodes.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 6, 2025
    Inventors: Huijun JIN, Zhen LIU, Mingyu WANG
  • Publication number: 20250044518
    Abstract: An edge coupler includes a substrate, a first cladding layer over the substrate, a core layer over the first cladding layer, and an ARC layer. The substrate has a first sidewall, the first cladding layer has a second sidewall aligned with the first sidewall, and the core layer has a third sidewall aligned with the second sidewall. The ARC layer lines the first sidewall, the second sidewall and the third sidewall. The ARC layer physically contacts and covers a surface of the substrate. A first height of the ARC layer varies along the surface of the substrate.
    Type: Application
    Filed: October 22, 2024
    Publication date: February 6, 2025
    Inventors: WEI-KANG LIU, CHIH-TSUNG SHIH, HAU-YAN LU, YINGKIT FELIX TSUI
  • Publication number: 20250046738
    Abstract: Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.
    Type: Application
    Filed: October 22, 2024
    Publication date: February 6, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Chao-Wen Shih, Tzuan-Horng Liu, Jen-Li Hu
  • Publication number: 20250042767
    Abstract: The present disclosure provides a modified monocrystal high-nickel ternary material, a preparation method therefor and use thereof. The preparation method includes: pre-sintering a high-nickel ternary hydroxide precursor under a condition of pure oxygen to obtain a pre-sintered material; fully mixing the pre-sintered material with a micro-powder of lithium hydroxide, a nano-dopant and an alumina pellet, and subjecting a mixture to a first sintering in a pure oxygen atmosphere after the alumina pellet is removed by sieving, followed by natural cooling in a pure oxygen atmosphere after the first sintering is completed to obtain a first sintered material; crushing the first sintered material, fully mixing it with a nano-coating agent, and then subjecting a mixed material to a second sintering in a pure oxygen atmosphere to obtain a second sintered material; and subjecting the second sintered material to crushing, sieving and demagnetizing to obtain the modified monocrystal high-nickel ternary material.
    Type: Application
    Filed: September 30, 2022
    Publication date: February 6, 2025
    Inventors: Yuxian GAO, Wei GAO, Daocong LI, Maoping YANG, Xing LIU, Junjun LONG
  • Publication number: 20250046574
    Abstract: A continuous processing mechanism for dual effect plasma etching used for performing a plasma etching process on a substrate includes a high-speed etching vacuum chamber and a low-speed etching vacuum chamber. The high-speed etching vacuum chamber includes a first radio frequency plasma module to carry out a high-speed plasma etching on the substrate. The low-speed etching vacuum chamber includes a first buffer area, a linear plasma area, and a second buffer area that are in communication with each other. The linear plasma area has a first linear plasma module. The substrate moves between the first buffer area, the linear plasma area, and the second buffer area, allowing the first linear plasma module to carry out a low-speed plasma etching thereon. Therefore, the present invention fulfills the requirements of the etching efficiency of the continuous processing mechanism and the fineness of the substrate surface.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 6, 2025
    Inventors: YUAN-CHI LEE, PIN-CHUN LIU, MING-CHAN TSAI
  • Publication number: 20250040465
    Abstract: Methods, apparatus, and articles of manufacture to generate a turn path for a vehicle are disclosed. An example apparatus disclosed herein includes input interface circuitry to obtain a guidance path for a vehicle, turn identification circuitry to identify a turn in the guidance path, and turn pattern selection circuitry to select, from a plurality of predetermined turn patterns, a turn pattern for the turn, wherein the turn pattern satisfies a condition.
    Type: Application
    Filed: October 15, 2024
    Publication date: February 6, 2025
    Inventors: Qiang R. Liu, Jeffrey E. Runde, Simon Schaefer
  • Publication number: 20250046602
    Abstract: A method includes obtaining a base structure of an electronic device, the base structure including at least one opening, and forming, using a reactive-ion deposition process, a dielectric material within the at least one opening.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Bhaskar Jyoti Bhuyan, Mark J. Saly, Lakmal Charidu Kalutarage, Feng Q. Liu, Jeffrey W. Anthis, Abhijit Basu Mallick, Akhil Singhal
  • Publication number: 20250040762
    Abstract: A grinding device includes a grinding assembly, a power output assembly, and a manipulation assembly. The grinding assembly includes a mounting member, a first grinding member, and a second grinding member cooperating with the first grinding member to implement grinding. The power output assembly includes a power element and a planetary gear mechanism. The planetary gear mechanism includes a sun gear, a planet gear, an internal gear ring, and a fixation frame. The sun gear is connected to the power element in a force-transfer manner. The planet gear is rotatably mounted at the fixation frame. The fixation frame includes an output member configured to output power. The manipulation assembly is connected to the mounting member. One of the first and second grinding members is connected to the output member in a force-transfer manner. Another one of the first and second grinding members is mounted at the manipulation assembly.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 6, 2025
    Inventors: Jinzhang ZHAO, Lixin LIU, Zhengjun ZHOU
  • Publication number: 20250046623
    Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 6, 2025
    Inventors: Yeong-E CHEN, Cheng-En CHENG, Yu-Ting LIU, Cheng-Chi WANG
  • Publication number: 20250040772
    Abstract: An agitator for a vacuum cleaner includes an agitator body and a resiliently deformable flap. The resiliently deformable flap includes a front face, a rear face, and one or more protrusions extending outwardly from the front face. An agitator for a vacuum cleaner includes an agitator body and a bristle strip and/or a plurality of tufts arranged in one or more rows along the agitator body. The bristle strip and/or a plurality of tufts includes a first bristle group including a plurality of nylon bristles and at least a second bristle group including a plurality of para-aramid bristles.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 6, 2025
    Inventors: Max P. LACOMA, Devan SCHAPPLER, Xavier F. CULLERE, Street BARNETT, Ryan COPELAND, Peter LIU, Ian LIU, Erick ZHANG
  • Publication number: 20250046637
    Abstract: A device and a method for robotic arm automatic correction are disclosed. A main structure includes a robotic arm including an optical photographing mechanism, and a wafer storage mechanism at one side of the robotic arm and including a graphic data code. The optical photographing mechanism is in information connection with an optical recognition module that includes a data code analysis unit, an object distance analysis unit, and a wafer center analysis unit. A user uses the optical photographing mechanism to photograph the graphic data code for implementing a first round of position correction for the robotic arm. Then, the optical photographing mechanism photographs a wafer and performs an operation of focusing for calculation of a distance between the robotic arm and a center point of the wafer by means of the object distance analysis unit in combination with the wafer center analysis unit for a second round of correction.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Cheng-Hsiang LU, Chung-Hsien LU, Yu-Hsin LIU, Jen-Wei CHANG, Jyun-Yi LU, Bo-Wen LIN
  • Publication number: 20250040718
    Abstract: A new and improved cupholder assembly, to be mounted within a powered furniture piece which is capable of being moved from an upright position to an inclined position, comprises a cupholder housing, a cupholder pivotally attached to the cupholder housing, and a counterweight fixedly attached to the cupholder. When the furniture piece is moved to the inclined position, the counterweight will maintain the cupholder at a vertical orientation such that a beverage, contained within a beverage cup which is disposed within the cupholder, will not be spilled.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Inventors: CHIH HSIUNG LIU, HAI GUO JIANG
  • Publication number: 20250046655
    Abstract: A method includes finding a first plurality of through-silicon vias from a first layout of a wafer, and finding a second plurality of through-silicon vias from the first plurality of through-silicon vias. The second plurality of through-silicon vias are connected in parallel. The second plurality of through-silicon vias are merged into a large through-silicon via to generate a second layout of the wafer.
    Type: Application
    Filed: November 30, 2023
    Publication date: February 6, 2025
    Inventors: Chao Yi Lin, Kuo-Yen Liu, Chih-Hsiang Yao
  • Publication number: 20250041282
    Abstract: Provided is a method for preventing or treating an inflammatory pulmonary disease or disorder in a subject in need thereof, including administering to the subject an effective amount of FJU-C28 or a salt thereof. Also provided is a use of an a compound of FJU-C28 or a salt thereof in the manufacture of a medicament for preventing or treating an inflammatory pulmonary disease or disorder.
    Type: Application
    Filed: September 28, 2022
    Publication date: February 6, 2025
    Inventors: Jau-Chen LIN, Guey-Mei JOW, Shang-Shing P. CHOU, Jung-Sen LIU, Chang-Lin LU, Fang JUNG, Shih-Hsing YANG, Hui-Yun TSENG
  • Publication number: 20250048107
    Abstract: According to an example of the present subject matter, a secured radio frequency identification device includes: a first radio frequency identification (RFID) tag; and a secured radio frequency identification (RFID) tag having a transmission control for selectively enabling and disabling data transmission from the secured RFID tag. The first RFID tag is to store non-sensitive data from a data set and the secured RFID tag is to store sensitive data from the same data set such that all the data of the data set is only accessible when the secured RFID tag is enabled for data transmission.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Guang Han Sui, Peng Hui Jiang, Su Liu, Jun Su
  • Publication number: 20250041961
    Abstract: A magnesium/titanium composite plate with large thickness ratios and a gradient heterothermal rolling bonding method are provided by the present disclosure, relating to the technical field of rolling bonding plates. The method includes following steps: assembling blanks according to a sequence of titanium strip, transition layer foil and magnesium alloy plate to obtain a composite blank; carrying out induction heating treatment on one side of the titanium strip of the composite blank, then rolling, and carrying out heat treatment on a composite plate blank after rolling to obtain the magnesium/titanium composite plate with large thickness ratios; and a thickness ratio of the magnesium alloy plate to the titanium strip is greater than or equal to 20:1.
    Type: Application
    Filed: March 21, 2024
    Publication date: February 6, 2025
    Inventors: Jianchao HAN, Junxin WEI, Shuaishuai ZHANG, Zhenhao YUAN, Yizhi ZHANG, Ran LI, Xinxin LIU, Yi JIA, Tao WANG
  • Publication number: 20250047290
    Abstract: Some embodiments include a first oscillator circuit including a first input node to receive a connection from a first resonator, and a first output node to provide a first oscillating signal; a second oscillator circuit including a second input node to receive a connection from a second resonator, and a second output node to provide a second oscillating signal; a frequency measurement circuit coupled to the first output node and the second output node; a code generator including an input node coupled to an output node of the frequency measurement circuit, and an output node to provide a code; and a timing signal generator including a node coupled to the output node of the code generator, an input node coupled to the output node of the first oscillator circuit, an output node to provide an output oscillating signal.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Renzhi Liu, Sarah Shahraini, Timo Huusari, Richard Dorrance, Charles Augustine, Brent R. Carlton
  • Publication number: 20250042091
    Abstract: A method for generating a 3D printing file includes: layering a 3D model into a plurality of sliced layers, and obtaining contour data of each of the sliced layers; determining a straight line X=X0 corresponding to an abscissa X0 of an intersection point of a preset seamline on the current layer of the sliced layers; determining coordinates of a seam point in accordance with the straight line X=X0 and contour data of the current layer, adding the coordinates of the seam point into the contour data of the current layer to update the contour data of the current layer, and setting the seam point as a start printing point of the current layer; and generating the 3D printing file of the 3D model in accordance with updated contour data of each of the plurality of layers. A 3D printing device, a computer device, and a storage medium are also provided.
    Type: Application
    Filed: November 10, 2022
    Publication date: February 6, 2025
    Inventors: Danjun AO, Jingke TANG, HONG LIU
  • Publication number: 20250047299
    Abstract: A system and method to compress application control data, such as weights for a layer of a convolutional neural network, is disclosed. A multi-core system for executing at least one layer of the convolutional neural network includes a storage device storing a compressed weight matrix of a set of weights of the at least one layer of the convolutional network and a decompression matrix. The compressed weight matrix is formed by matrix factorization and quantization of a floating point value of each weight to a floating point format. A decompression module is operable to obtain an approximation of the weight values by decompressing the compressed weight matrix through the decompression matrix. A plurality of cores executes the at least one layer of the convolutional neural network with the approximation of weight values to produce an inference output.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 6, 2025
    Inventor: Tianfang LIU