Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.

Abstract: Disclosed are an anti-idiotype antibody that specifically binds to an idiotope site of an anti-c-Met antibody, the use of the anti-idiotype antibody for detecting the anti-c-Met antibody, and methods, polypeptides, polynucleotides, compositions, and vaccines related thereto.

Abstract: Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

Abstract: An apparatus and method for evaluating statistical interference concerning a multi-source noise environment of an electromagnetic (EM) zone are disclosed. The apparatus for evaluating statistical interference may include a receiver to receive an EM wave in a preset frequency band, a spectrum analyzer to analyze the received EM wave and to measure interference in the preset frequency band, a frequency selector to select an interest frequency in the frequency band based on a level of the measured interference, an amplitude probability distribution (APD) measurement unit to measure an APD of an interference signal with respect to the interest frequency, and a comparator to compare the measured APD to a preset limit and to draw a probability of the limit or higher of interference occurring.

Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

Abstract: A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.

Abstract: The present invention relates to a pharmaceutical composition for preventing and treating an inflammatory disease, including a mixture of extracts from Trachelospermi Caulis and Paeonia Suffruticosa Andrews as an active ingredient and method for preparing the same. Also, a quasi-drug composition, a health functional food composition and a cosmetic composition, all based on the mixture, are provided for preventing or improving inflammation. In addition, the present invention relates to a method for treating an inflammatory disease by administering the pharmaceutical composition to a subject suspected of having the inflammatory disease. Containing the extract mixture, the composition exhibits excellent anti-inflammatory activity and edema-suppressing activity, compared to individual extracts, and thus can be applied to the prevention, treatment or improvement of an inflammatory disease.

Abstract: Disclosed are a radio secure reader and a radio secure tag for supporting a secure mode and a normal mode. The radio secure reader for controlling an operation mode of the radio secure tag may include a reader modem to receive the operation mode from the radio secure tag, and a reader processing unit to identify the received operation mode as a normal mode or a secure mode, and to control the radio secure tag based on the identified operation mode.

Abstract: In integrated circuit chips that are used for RFID, a method of calibrating an operation frequency that is generated in an operation frequency generator and a semiconductor wafer including a calibration circuit are provided. The method of calibrating an operation frequency of integrated circuit chips includes: supplying DC power to the integrated circuit chips; selecting an integrated circuit chip to perform calibration of an operation frequency; receiving an operation frequency that is generated in the selected integrated circuit chip; calculating a difference between a phase of the operation frequency and a phase of a calibration target frequency; generating a frequency calibration value of the operation frequency using the phase difference; transmitting a control signal including the frequency calibration value to the integrated circuit chip; and releasing a selection of the integrated circuit chip in which calibration of the operation frequency is complete.

Abstract: In integrated circuit chips that are used for RFID, a method of calibrating an operation frequency that is generated in an operation frequency generator and a semiconductor wafer including a calibration circuit are provided. The method of calibrating an operation frequency of integrated circuit chips includes: supplying DC power to the integrated circuit chips; selecting an integrated circuit chip to perform calibration of an operation frequency; receiving an operation frequency that is generated in the selected integrated circuit chip; generating a frequency calibration value by comparing the operation frequency with a calibration target frequency; transmitting a control signal including the frequency calibration value to the integrated circuit chip; and releasing a selection of the integrated circuit chip in which calibration of the operation frequency is complete.

Abstract: Disclosed is a method of generating an activation code of a Radio Frequency Identification (RFID) tag including calculating K satisfying a condition that N is set to exceed 2k-1 and to be equal to or less than 2k, when classifying N number of objects through a plurality of RFID tags; and classifying the N number of objects by recording a code corresponding to each of the N number of objects in a K-bit region in an activation code of each RFID tag.

Abstract: A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.

Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

Abstract: Provided are a method and apparatus for stopping power supply to a radio frequency identification (RFID) system. The apparatus includes: a power supplier supplying power to a high RFID tag; an input unit rectifying and boosting an input predetermined frequency band signal and outputting a direct-current (DC) voltage signal; a wake-up determiner comparing a voltage of the DC voltage signal output from the input unit with a predetermined reference voltage and outputting a HIGH signal or a LOW signal; and a switch stopping power supply to the high RFID tag if the wake-up determiner outputs the LOW signal.

Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

Abstract: Disclosed is a synchronization method between a reader and tag according to an example embodiment, the method including: transmitting, by the reader, a first write command message to the tag at a first time; detecting, by the tag, the first write command message from the reader at a second time and transmitting a first response message to the reader in response to the first write message; transmitting, by the reader, a second write command message including first time information of the first time to the tag; and correcting, by the tag, a clock offset using a difference between the first time and the second time.

Abstract: A mobile terminal including an input unit configured to receive an instruction from a first user to perform a video call communication with at least a second user, a display unit, a voice recognition module configured to recognize input voice statements conducted during the video call communication between the first and second users, and a controller configured to perform the video call communication between the first and second users based on the instruction from the first user, to control the display unit to display images of the first and second users, to detect a voice statement from the first user designating the second user by examining the voice statements recognized by the voice recognition module, and to emphatically display the image of the second user compared with the image of the first user based on the detected voice statement from the first user.

Abstract: In a radio frequency identification (RFID) security reader, by integrating an encryption module that encrypts transmission data and a decryption module that decrypts reception data from an RFID security tag to restore the reception data to original data to a modem, an input/output time period of a processor module that processes a communication protocol in an RFID security system is minimized.

Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.