Abstract: The present invention relates to a battery comprising: -i) at least two electrochemical elements (d) connected to one another by a connection part (c), each electrochemical element comprising a container, -ii) a material arranged between said at least two electrochemical elements, and -iii) at least one disconnection device, said device comprising: a heat-activatable element (a) able to deform when its temperature reaches a threshold value, the heat-activatable element being arranged such that, when its temperature reaches said threshold value, it disconnects the connection part (c) from at least one electrochemical element (d) through its deformation, said heat-activatable element not contributing to the conduction of electric current when an electric current flows through said electrochemical elements, said heat-activatable element being placed in contact with the connection part (c) and with a current output terminal.

Abstract: The harvester comprises a pendular unit comprising a beam that is elastically deformable in bending, a mount clamping a proximal end of the beam, and an inertial mass mounted at a free, distal end of the beam. The beam converts into an oscillating electric signal a mechanical energy produced by pendular unit oscillations. The beam comprises a flexible structure including a central core, a piezoelectric layer on at least one face of the central core, and at least one surface electrode on an external face of the piezoelectric layer. The central core of the flexible structure is made of a semiconductor material adapted to form an integrated circuit substrate. The substrate made of a semiconductor material of the central core includes monolithic integrated structures, and the arrangement, over the extend of the central core substrate, of said integrated structures forms in the longitudinal direction a plurality of successive areas having different bending stiffness coefficients from an area to another.

Abstract: An energy harvesting module includes a pendular unit with piezoelectric transducer elastically deformable in bending between a clamped end and a free end coupled to an inertial mass. The piezoelectric transducer includes two coplanar piezoelectric beams arranged side-by-side on either side of a central axis of the transducer, each of the piezoelectric beams including adjacent external and internal arms, arranged side-by-side and formed single-piece. The external arm of each beam has a clamped proximal end and a free distal end, and the internal arm of each beam has a free proximal end supporting the inertial mass, and a free distal end connected to the distal end of the adjacent external arm by a common junction.

Abstract: A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

Abstract: The disclosure provides a composition comprising (a) one or more isolated bacterial metabolites selected from prednicarbate, N-palmitoyl-D-threonine and 3,3-difluoro-5-alpha-androstan-17-beta-yl-acetate, and (b) a pharmaceutically acceptable carrier, and use of such composition for reducing inflammation and/or treating an inflammatory disorder in a subject in need thereof.

Abstract: An energy harvesting module includes a pendular unit with piezoelectric transducer elastically deformable in bending with a clamped end and a free end coupled to an inertial mass. The transducer includes at least one piezoelectric beam configured into two adjacent arms formed single-piece, with external and internal arms arranged side-by-side. The external arm has a clamped proximal end and a free distal end, and the internal arm has a free proximal end supporting the inertial mass, and a free distal end connected to the distal end of the adjacent external arm. An annular mount surrounds the beam at its proximal end and includes the clamp to which is fastened the proximal end of the external arm. The mount includes, in a central region in the vicinity of the clamp, a cavity inside which the inertial mass carried by the free proximal end of the internal arm can oscillate.

Abstract: The pendular unit comprises a piezoelectric transducer beam, and an inertial mass mounted at the free distal end of the beam and comprising two half-masses arranged on either side of the beam. A mechanical connection connects the two half-masses to each other on either side of the beam in such a way as to clamp the beam between the two half-masses to secure the inertial mass to the beam, the assembly being devoid of glue between the half-masses and the beam.

Abstract: Disclosed herein are lightweight cool roof coating compositions and lightweight cool roof coatings. Also disclosed herein are lightweight reflective coating compositions, lightweight reflective coatings, and methods for making and applying the coating compositions of the present disclosure. The lightweight cool roof coating composition of the present disclosure comprises an aqueous polymer emulsion binder; and a pigment-filler component comprising: a reflective pigment, and a silica filler comprising cristobalite, tridymite, and optionally quartz, the silica filler comprising at least 50 wt % cristobalite based on the weight of the silica filler. The lightweight cool roof coating composition has a density (wet) of less than or equal to 1.38 g/cm3 at a Pigment Volume Concentration (PVC) of 42%.

Abstract: The harvester comprises a pendular unit comprising a beam that is elastically deformable in bending, a mount clamping a proximal end of the beam, and an inertial mass mounted at a free, distal end of the beam. The beam converts into an oscillating electric signal a mechanical energy produced by pendular unit oscillations. The beam comprises a flexible structure including a central core, a piezoelectric layer on at least one face of the central core, and at least one surface electrode on an external face of the piezoelectric layer. The central core of the flexible structure is made of a semiconductor material adapted to form an integrated circuit substrate. The substrate made of a semiconductor material of the central core includes monolithic integrated structures, and the arrangement, over the extend of the central core substrate, of said integrated structures forms in the longitudinal direction a plurality of successive areas having different bending stiffness coefficients from an area to another.

Abstract: The harvester comprises a pendular unit comprising a beam that is elastically deformable in bending, a mount clamping a proximal end of the beam, and an inertial mass mounted at a free, distal end of the beam. The beam converts into an oscillating electric signal a mechanical energy produced by oscillations of the pendular unit. The piezoelectric beam comprises a flexible structure including: a central core; a piezoelectric layer on at least one face of the central core; and at least one surface electrode on an external face of the piezoelectric layer. The central core of the flexible structure is a semiconductor material adapted to form an integrated circuit substrate, and the flexible structure includes at least part of components of an electric or electronic unit, said components being monolithically integrated within the semiconductor material substrate.

Abstract: A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1 U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1 U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

Abstract: The module comprises, in an envelope tube, a pendular unit comprising a piezoelectric transducer, PZT, beam, an inertial mass coupled to the free end of the beam, and a beam mount secured to the tube and fastened to a clamping part of the beam. The module further includes a symmetrization insert for calibrating and symmetrizing the pendular unit oscillations in transverse and lateral directions. The symmetrization insert is distinct from the beam mount and comprises a peripheral portion secured to the tube independently of the beam mount, and a central portion with an axial through-cavity inside which the beam extends in said region of free travel. The axial cavity extends between opposite travel limitation surfaces, which are symmetrical and capable of coming into contact with the beam in a bending configuration of the beam.

Abstract: The device has a device body with a front face at its distal end, and a means for the anchoring of the medical device to a patient's organ wall. The anchoring means includes a screw with a helix wire wound into a plurality of non-contiguous turns, the screw having a clamped end integral with the front face of the device body and a free end with a beveled end defined by at least one oblique surface. The helix wire includes, at its free distal end, a terminal region whose wire bending stiffness is lower than in a proximal region of the helix turns. The stiffness difference may, in particular, be obtained by varying the wire diameter over different successive portions, with decreasing diameters in a proximal to distal direction.

Abstract: A method of co-manufacturing silicon waveguides, SiN waveguides, and semiconductor structures in a photonic integrated circuit. A silicon waveguide structure can be formed using a suitable process, after which it is buried in a cladding. The cladding is polished, and a silicon nitride layer is disposed to define a silicon nitride waveguide. The silicon nitride waveguide is buried in a cladding, and annealed. Thereafter, cladding above the silicon waveguide structure can be trenched through, and low-temperature operations can be performed to or with an exposed surface of the silicon waveguide structure.

Abstract: A photonics package that incorporates a liquid crystal lens situated between a light source and a waveguide or output element of the package. The liquid crystal lens may focus or collimate light passing through it. This may be useful, for example, to focus light from a light source on or at an entry of a waveguide. Certain embodiments may include or incorporate routing or optical elements between the light source and the liquid crystal lens, and/or on a side of the lens opposite a side on which the light source is located.

Abstract: A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

Abstract: A programmable filter for electronic signals. The filter includes an input that splits power of the input signal along two paths, a first and second path that is phase shifted by ninety degrees in respect of the first path. The first and second path are each modulated to the optical domain, and provided as input to respective filter chains. The in-phase signal can be filtered by IIR or FIR optical filters with configurable operation, as well the shifted signal can be filtered by a second chain of IIR and FIR optical filters with configurable operation. Resulting output from each filter chain is recombined and demodulated from the optical domain. In this manner, the electronic filter can adopt any suitable impulse response, including impulse responses described with complex coefficients. Real parts can be configured by operation of the first filter chain and imaginary parts by operation of the second filter chain.