Abstract: An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): wherein, R1 to R3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm?1 to 1630 cm?1 and a signal intensity “b” from 1620 cm?1 to 1560 cm?1, and 0<a/b?1.20; and the quantitative 1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d?1.20.

Abstract: Phosphorous containing compounds, epoxy resins thereof, and laminate composite structures thereof. The phosphorus containing compounds may have a structure according to formula (I): wherein, X is an aromatic hydrocarbon group having 6 to 30 carbon atoms or a bivalent linear or branched alkylene group of 1 to 8 carbon atoms; RA is selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, a napthyl group, and an aromatic phenol group; w is an integer of 1 to 9; R1, R2, R3, and R4 are independently selected from H, C1-C10 alkyl, C1-C10 alkoxy, and C3-C10 cycloalkyl; R5 is selected from the group consisting of C1-C10 alkyl, C1-C10 alkoxy, C3-C10 cycloalkyl, and Ar3; and Ar1 and Ar2 are independently selected.

Abstract: An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): wherein, R1 to R3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm?1 to 1630 cm?1 and a signal intensity “b” from 1620 cm?1 to 1560 cm?1, and 0<a/b?1.20; and the quantitative 1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d?1.20.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L1-Ar-L2- (1), wherein -L1- and -L2- are respectively —O— or —CO—; —Ar— is an arylene group. Formula (1) comprises structural units Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to 40 mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness)0.5.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? D ? f ? ? ? ( % ) = ? Df 1 ? - D ? f 0 ? ? D ? f 0 ? × 1 ? 00 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited. In addition, the difference between the insertion losses of signal transmission before and after water absorption is decreased, so the laminate is suitable for high-end or outdoor high-frequency electronic products.

Abstract: Products of glycidyl ether of a mono or polyhydric phenol as well as methods to manufacture the same. In some instances, the product of glycidyl ether of a mono or polyhydric phenol has an epoxy equivalent weight (“EEW”) and a hydroxyl value (“HV”), wherein the epoxy equivalent weight multiplied by the hydroxyl value (EEWxHV) is a value from 1 to 10. A process for producing the product of glycidyl ether of a mono or polyhydric phenol typically includes reacting an epihalohydrin with a mono or polyhydric phenol in the presence of a catalyst to produce a halohydrin ether; and dehalogenating the halohydrin ether to form the product of glycidyl ether of a mono or polyhydric phenol.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Abstract: A preparation method of a polyurethane resin including the following steps is provided. A liquid polyamine compound is placed in a continuous reaction system, and the liquid polyamine compound is circulated in the continuous reaction system. A solid bis(cyclic carbonate) and a solid catalyst are placed in the continuous reaction system to mix the solid bis(cyclic carbonate), solid catalyst, and liquid polyamine compound to form a heterogeneous mixture. The heterogeneous mixture is heated in the continuous reaction system in a microwave manner, such that the heterogeneous mixture reacts to form a polyurethane resin.

Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Abstract: A preparation method of a polyurethane resin including the following steps is provided. A liquid polyamine compound is placed in a continuous reaction system, and the liquid polyamine compound is circulated in the continuous reaction system. A solid bis(cyclic carbonate) and a solid catalyst are placed in the continuous reaction system to mix the solid bis(cyclic carbonate), solid catalyst, and liquid polyamine compound to form a heterogeneous mixture. The heterogeneous mixture is heated in the continuous reaction system in a microwave manner, such that the heterogeneous mixture reacts to form a polyurethane resin.

Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.