Patents by Inventor An-Ping Tseng

An-Ping Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11810863
    Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: November 7, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: An-Ping Tseng, Chi-Fu Wu, Hao-Yu Wu, Ming-Hung Wu, Chun-Yang Tai, Tsutomu Fukai
  • Patent number: 10903136
    Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: January 26, 2021
    Assignee: TDK Taiwan Corp.
    Inventors: Ming-Hung Wu, Chi-Fu Wu, An-Ping Tseng, Hao-Yu Wu
  • Patent number: 10811332
    Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 20, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Ming-Hung Wu, Chi-Fu Wu, An-Ping Tseng, Hao-Yu Wu
  • Publication number: 20200185327
    Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.
    Type: Application
    Filed: June 4, 2019
    Publication date: June 11, 2020
    Inventors: An-Ping TSENG, Chi-Fu WU, Hao-Yu WU, Ming-Hung WU, Chun-Yang TAI, Tsutomu FUKAI
  • Publication number: 20190139860
    Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 9, 2019
    Inventors: Ming-Hung WU, Chi-Fu WU, An-Ping TSENG, Hao-Yu WU
  • Publication number: 20190139854
    Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.
    Type: Application
    Filed: October 31, 2018
    Publication date: May 9, 2019
    Inventors: Ming-Hung WU, Chi-Fu WU, An-Ping TSENG, Hao-Yu WU
  • Publication number: 20160262267
    Abstract: A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by patterned dry film electroplating is easily controlled less than 50 ?m so that the micro conduction holes formed after the laser drilling each has a diameter greatly shrunk less than 50 ?m so as to highly increase density of the micro conduction holes, thereby facilitating in burial of the buried element with the high density pin count. Additionally, by disposing the micro conduction holes in the same elevation, optically aligning a fixing position for the buried element can be controlled precisely.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 8, 2016
    Inventors: Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng
  • Patent number: 9439292
    Abstract: A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by patterned dry film electroplating is easily controlled less than 50 ?m so that the micro conduction holes formed after the laser drilling each has a diameter greatly shrunk less than 50 ?m so as to highly increase density of the micro conduction holes, thereby facilitating in burial of the buried element with the high density pin count. Additionally, by disposing the micro conduction holes in the same elevation, optically aligning a fixing position for the buried element can be controlled precisely.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: September 6, 2016
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng
  • Patent number: 9301405
    Abstract: A method for manufacturing microthrough-hole includes electroplating a metal layer on a carrier plate, patterning the metal layer to form a first circuit having copper pads, covering the first circuit with a photoresist layer and not covering the copper window between two of the copper pads, etching the metal layer beneath the copper window and removing the photoresist layer, sequentially forming an insulation layer and a second circuit on the first circuit and the copper window, the second circuit layer having a stop pad corresponding to the copper window, removing the carrier plate, upward drilling through the insulation layer between the stop pad and the copper window to form a microthrough-hole beneath the stop pad, and forming a conductive layer in the microthrough-hole to form the microthrough-hole connecting the first and second circuits. The microthrough-hole and its occupied area is greatly reduced, thereby achieving high circuit density.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: March 29, 2016
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yu-Te Lu, Yung-Lin Chia, An-Ping Tseng
  • Patent number: 5868093
    Abstract: An improved amphibious vehicle comprising a confined housing of a vehicle is provided. The confined housing is provided with a central connecting chamber under a cabinet adjacent to the central portion. An engine room and a floating cell are respectively provided in the front and rear, positions of the central connecting chamber. A thrust propeller is disposed under the tail portion of the floating cell. Characterized in that except the central connecting chamber, the engine room, and the floating cell which are indispensable components to the confined housing of the improved vehicle, the confined housing is further provided with a plurality of hollow cells among the confined housing other than those operating space required for maintenance conducted by the technician. Each of the hollow cells is filled with an imperious foam material to increase the floating capability such that the improved amphibious vehicle can readily float on the water.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: February 9, 1999
    Inventor: An-Ping Tseng
  • Patent number: 5626197
    Abstract: An improved road scraper includes a second scraping device mounted at a rear end of a road scraper of a known construction having a first scraping device. Between the road scraper and the second scraping device are disposed a vertical displacement mechanism and a horizontal displacement mechanism. By the actions of these mechanisms, the second scraping device may be extended outwardly from one side of the road scraper for scraping a greater width of the road.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: May 6, 1997
    Inventor: An-Ping Tseng