Patents by Inventor Antai Xu
Antai Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7997684Abstract: A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.Type: GrantFiled: November 14, 2008Date of Patent: August 16, 2011Assignee: FUJIFILM Dimatix, Inc.Inventors: Kevin von Essen, Antai Xu, Andreas Bibl, John A. Higginson
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Patent number: 7631962Abstract: A printhead assembly including one or more nozzles is described that can include a droplet ejection module. In one embodiment, the droplet ejection module includes a liquid supply assembly, a housing and a droplet ejection body. The liquid supply assembly includes a self-contained liquid reservoir and a liquid outlet. The housing is configured to permanently connect to the liquid supply assembly and includes a liquid channel configured to receive a liquid from the liquid outlet of the liquid supply assembly and to deliver the liquid to a droplet ejection body. The droplet ejection body is permanently connected to the housing and includes one or more liquid inlets configured to receive liquid from the housing and one or more nozzles configured to selectively eject droplets.Type: GrantFiled: December 16, 2005Date of Patent: December 15, 2009Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, John A. Higginson, Kevin Von Essen, Antai Xu
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Publication number: 20090066758Abstract: A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.Type: ApplicationFiled: November 14, 2008Publication date: March 12, 2009Applicant: FUJIFILM DIMATIX, INC.Inventors: Kevin Von Essen, Antai Xu, Andreas Bibl, John A. Higginson
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Patent number: 7452057Abstract: A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.Type: GrantFiled: April 28, 2005Date of Patent: November 18, 2008Assignee: FUJIFILM Dimatix, Inc.Inventors: Kevin Von Essen, Antai Xu, Andreas Bibl, John A. Higginson
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Publication number: 20060158489Abstract: A printhead assembly including one or more nozzles is described that can include a droplet ejection module. In one embodiment, the droplet ejection module includes a liquid supply assembly, a housing and a droplet ejection body. The liquid supply assembly includes a self-contained liquid reservoir and a liquid outlet. The housing is configured to permanently connect to the liquid supply assembly and includes a liquid channel configured to receive a liquid from the liquid outlet of the liquid supply assembly and to deliver the liquid to a droplet ejection body. The droplet ejection body is permanently connected to the housing and includes one or more liquid inlets configured to receive liquid from the housing and one or more nozzles configured to selectively eject droplets.Type: ApplicationFiled: December 16, 2005Publication date: July 20, 2006Inventors: Andreas Bibl, John Higginson, Kevin Essen, Antai Xu
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Publication number: 20050243130Abstract: A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.Type: ApplicationFiled: April 28, 2005Publication date: November 3, 2005Inventors: Kevin Essen, Antai Xu, Andreas Bibl, John Higginson
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Patent number: 6680436Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.Type: GrantFiled: March 29, 2001Date of Patent: January 20, 2004Assignee: Seagate Technology LLCInventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson
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Publication number: 20020046860Abstract: A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.Type: ApplicationFiled: March 29, 2001Publication date: April 25, 2002Inventors: Antai Xu, Robert Michael Echols, Eng Siong David Yeh, Michael John Peterson
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Patent number: 5340641Abstract: An electrical overstress responsive composite is formed on an electrically insulative substrate, has a pair of electrodes associated with the substrate and defining a gap between the electrodes and over the interposed portion of the substrate, a pattern of closely spaced electrically conductive elements span said gap and are affixed to said substrate, and a dielectric resin overlies said conductive elements and also spans said gap. The dielectric resin may include conductive and/or semiconductive fine particles. The composite presents a high resistance to a low voltage applied across said electrodes and a low resistance to a high voltage applied across said electrodes.Type: GrantFiled: February 1, 1993Date of Patent: August 23, 1994Inventor: Antai Xu
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Patent number: 5278535Abstract: A thin flexible laminate for overlay application on the pins of a connector or other circuit element, having an electrically insulating substrate, a conductive lamina of apertured pin receiving pads and a separate ground strip adjacent the pads, and an electrically insulating cover lamina, the substrate and cover having apertures aligned with the pad apertures, the cover having second apertures exposing adjacent edges of said pads and ground strip, with an electrical overstress pulse responsive composite material positioned in the second apertures and bridging the pads and the ground strip.Type: GrantFiled: August 11, 1992Date of Patent: January 11, 1994Assignee: G&H Technology, Inc.Inventors: Antai Xu, Roger C. Stephenson