Patents by Inventor An Wei

An Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10659067
    Abstract: An alkali-metal vapor cell atomic clock system, including a first atomic vapor cell and a second atomic vapor cell. A digital signal processor outputs a first time sequence to control a first laser signal, and the digital signal processor outputs a second time sequence to control a second laser signal. Thereby, the first atomic vapor cell and the second atomic vapor cell can alternately lock a crystal oscillator. A Dick effect is reduced by alternately locking the crystal oscillator, which enables the alkali-metal vapor cell atomic clock system to have more stable frequency output. Because the crystal oscillator has low costs, the alkali-metal vapor cell atomic clock system has advantages of low costs and high stability.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: May 19, 2020
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Jian-Wei Zhang, Xiao-Lin Sun, Peng-Fei Cheng, Ya-Ni Zuo, Li-Jun Wang
  • Patent number: 10656473
    Abstract: A curved display panel includes a first substrate and a second substrate cell-assembled to each other, a spacer layer disposed between the first substrate and the second substrate and configured to support the first substrate and the second substrate so as to form a gap, and a liquid crystal layer disposed in the gap, wherein the spacer layer includes a plurality of spacer groups, each of the plurality of spacer groups includes a first spacer provided on the first substrate and a second spacer provided on the second substrate, the plurality of spacer groups have supporting area on the first substrate as same as supporting area on the second substrate. A curved display device is further provided.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: May 19, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Ruilin Bi, Qiang Xiong, Kui Zhang, Xiongzhou Wei, Chao Liu
  • Patent number: 10657251
    Abstract: A malware detection system configured to detect suspiciousness in obfuscated content. A multi-stage static detection logic is utilized to detect obfuscation, make the obfuscated content accessible, identify suspiciousness in the accessible content and filter non-suspicious non-obfuscated content from further analysis. The multi-stage static detection logic includes a controller, a de-constructor, and a post-processor. The controller is configured to receive content while the de-constructor configured to receive content from the controller and deconstruct the content using the analysis technique selected by the controller. The post-processor is configured to receive the de-constructed content from the de-constructor, determine whether a specimen within the de-constructed content is suspicious, and remove non-suspicious content from further analysis.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: May 19, 2020
    Assignee: FireEye, Inc.
    Inventors: Amit Malik, Shivani Deshpande, Abhishek Singh, Wei Zheng
  • Patent number: 10654150
    Abstract: A grinding disk and a method of manufacturing the same are provided. The grinding disk includes a graphite base and a silicon carbide film, the silicon carbide film covering the graphite base, and the silicon carbide film has a surface grain size of 5 ?m to 80 ?m. By a hot-wall chemical vapor deposition system, a highly dense silicon carbide film is formed on a surface of the graphite base. The grinding disk may replace a conventional metallographic grinding and polishing disk, and is improved in characteristics such as hydrophobicity and abrasion resistance.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: May 19, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Chien Tsai, Hao-Wen Cheng, Jin-Bao Wu, Ming-Sheng Leu
  • Patent number: 10658255
    Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 19, 2020
    Assignee: ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
    Inventors: Tsung-Yu Lin, Pei-Yu Wang, Chung-Wei Hsu
  • Patent number: 10659983
    Abstract: A user equipment (UE) is configured with at least one bandwidth part (BWP) specific configuration information. The UE receives a configuration information specific to the bandwidth part (BWP). The configuration information configures an initial value of a beam failure detection (BFD) timer and a beam failure indication (BFI) count threshold. The UE starts or re-starts the BFD timer from the initial value when receiving a beam failure indication (BFI) from a lower sublayer, and counts a number of the received BFIs using a BFI counter. The UE resets the BFI counter to zero when receiving a reconfiguration information. The reconfiguration information, that is specific to the BWP, re-configures at least one of the initial value of the BFD timer and the BFI count threshold.
    Type: Grant
    Filed: March 9, 2019
    Date of Patent: May 19, 2020
    Assignee: FG Innovation Company Limited
    Inventors: Chia-Hung Wei, Chie-Ming Chou, Chien-Chun Cheng, Yu-Hsin Cheng, Hung-Chen Chen, Heng-Li Chin
  • Patent number: 10653735
    Abstract: Use of Mesembryanthemum crystallinum L. callus extract in the manufacture of a medicament or a skin care product, wherein the medicament or skin care product is for at least one of delaying skin cell aging, nursing skin, repairing skin, treating skin cancer, and preventing skin cancer.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: May 19, 2020
    Assignee: TCI CO., LTD.
    Inventors: Yung-Hsiang Lin, Wei-Wen Kuo, I-Hui Chen, Yi-Chun Chen, Hui-Hsin Shih, Yun-Ching Tsai
  • Patent number: 10655137
    Abstract: Provided is an influenza mucosal vaccine composition and preparation and application thereof. This composition contains an antigen fusion protein which includes an influenza virus antigen and a Type IIb heat-labile enterotoxin A subunit from Escherichia coli. Immunization with this antigen fusion protein induces cellular and humoral immune responses, including systemic and mucosal immune responses, against a specific influenza virus in a subject, and therefore protects the subject from viral infection.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 19, 2020
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Suh-Chin Wu, Shi-Wei Lin, Neos Tang, Ting-Hsung Chen
  • Patent number: 10656302
    Abstract: An example logging tool may include at least one transmitter antenna and at least one receiver antenna. A first high-impedance metamaterial may be disposed between the transmitter antenna and the receiver antenna. The first high-impedance metamaterial may include a periodic arrangement of patches, each of the patches being electrically coupled to a ground plane using a via.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: May 19, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Wei-Bin Ewe, Rencheng Song, Glenn Andrew Wilson
  • Patent number: 10658198
    Abstract: A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: May 19, 2020
    Assignee: Intel Corporation
    Inventors: Li-Sheng Weng, Chi-Te Chen, Wei-Lun Jen, Olivia Chen, Yun Ling
  • Patent number: 10658613
    Abstract: An encapsulation method of an organic light emitting diode, an organic light emitting diode encapsulation structure and an organic light emitting diode display apparatus are provided. The encapsulation method includes: providing an encapsulation cover plate and a base substrate with an organic light emitting diode device; forming a first sealant of the encapsulation cover plate, in which the first sealant includes a plurality of protrusion portions spaced apart with each other; forming a second sealant on the encapsulation cover plate, in which the second sealant includes a plurality of protrusion portions and a height of each of the plurality of protrusion portions of the second sealant is greater than a height of each of the plurality of protrusion portions of the first sealant; and bonding the encapsulation cover plate and the base substrate, in which the second sealant covers the organic light emitting diode device and the first sealant.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: May 19, 2020
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Donghui Yu, Wei Quan
  • Patent number: 10656973
    Abstract: A method of evaluating and selecting an application programming interface (API). The method includes accessing source-code in computer programming languages from an API repository. The method includes training a machine learning classifier using generalized, extracted API-calls to learn variations of API-call programming language syntaxes through usage of the API-call programming language syntaxes in the source-code. The method includes building API-call models suitable for the computer programming languages and building a parameter relations graph based on backtracking data-flow from API-calls that are extracted from public project repositories based on the API-call model. The method includes retrieving sample parameter values from the parameter relations graph. The method includes implementing the sample parameter values in an evaluation interface to evaluate functionality of an API in a software application.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: May 19, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Junhee Park, Mehdi Bahrami, Wei-Peng Chen
  • Patent number: 10659152
    Abstract: The embodiment of the invention provides a measurement method and a measurement device for quality of a power distribution and utilization channel. The method comprises the steps of determining priority of each branch in the power distribution and utilization channel of which the quality is to be measured; and determining quality of the power distribution and utilization channel of each branch according to the priority. The method and the device are used for improving monitoring strength on a whole optical fiber channel, and enhancing application universality.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: May 19, 2020
    Assignee: STATE GRID JIANGSU ELECTRIC POWER CO., LTD NANJING POWERSUPPLY COMPANY
    Inventors: Hong Zhu, Wei Li, Lei Wei, Min Lu, Shaoyong Guo, Qiusheng Li, Yangling Chen, Jingwei Li
  • Patent number: 10655033
    Abstract: A floor coating composition that has a long pot life and dries fast, and a coating made therefrom having good slip resistance and high adhesion strength to the floor.
    Type: Grant
    Filed: September 5, 2015
    Date of Patent: May 19, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Liang Zhang, Haipeng Xu, Zhi Gang Hua, Wei Li, Jingui Jiang, Xiaohong Zhang
  • Patent number: 10660043
    Abstract: A user equipment (UE) may apply transmit power control (TPC) commands and transmit uplink information based on received downlink control information (DCI). A UE may receive multiple DCI messages including multiple TPC commands for an uplink transmission. The power level for the uplink transmission may be adjusted based on the combination of TPC commands. For example, the TPC commands may be considered together (e.g., added, averaged, etc.), the latest TPC command may be used, etc. In some cases, a change in TPC command for an uplink transmission (e.g., from a previous TPC command for the uplink transmission indicated via other DCI) may indicate a change in one or more transmission attributes for the uplink transmission. In some cases, a UE may receive a grant for a prioritized transmission, resulting in discontinuous transmission (DTX) of a previous transmission, which may result in TPC modification by the UE.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: May 19, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Sony Akkarakaran, Peter Gaal, Yi Huang, Wei Yang, Renqiu Wang
  • Patent number: 10658370
    Abstract: A semiconductor device includes a substrate having a semiconductor fin, in which the semiconductor fin has a first sidewall and a second sidewall opposite to the first sidewall; an epitaxy structure in contact with the first sidewall of the semiconductor fin; and a spacer in contact with the second sidewall of the semiconductor fin and the epitaxy structure.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tetsu Ohtou, Ching-Wei Tsai, Kuan-Lun Cheng, Yasutoshi Okuno, Jiun-Jia Huang
  • Patent number: 10658550
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Grant
    Filed: November 10, 2018
    Date of Patent: May 19, 2020
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Patent number: 10658373
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a split gate stack having a main gate and a select gate and forming a logic gate stack having a logic gate over a semiconductor substrate. The main gate and the logic gate is respectively replaced with a metal memory gate and a metal logic gate, in which the main gate and the logic gate are replaced simultaneously.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Ya-Chen Kao
  • Patent number: 10657617
    Abstract: A method and system including a central processing unit (CPU), an accelerator, a communication bus and a system memory device for dynamically processing an image file are described. The accelerator includes a local memory buffer, a data transfer scheduler, and a plurality of processing engines. The data transfer scheduler is arranged to manage data transfer between the system memory device and the local memory buffer, wherein the data transfer includes data associated with the image file. The local memory buffer is configured as a circular line buffer, and the data transfer scheduler includes a ping-pong buffer for transferring output data from the one of the processing engines to the system memory device. The local memory buffer is configured to execute cross-layer usage of data associated with the image file.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: May 19, 2020
    Assignee: GM Global Technology Operations LLC
    Inventors: Shige Wang, Wei Tong, Shuqing Zeng, Roman L. Millett
  • Patent number: D884679
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: May 19, 2020
    Assignee: SHENZHEN SKYWORTH-RGB ELECTRONIC CO., LTD
    Inventors: Fu Lin, Lixing Chen, Zhiyong Chen, Shuxiao Wei, Feixiang Fang, Xinhua Zhang, Xiaohui Zhang, Shusan Yang