Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a substrate having interior surfaces that define a trench within an upper surface of the substrate. One or more dielectric materials are disposed within the trench. A source region disposed within the substrate and a drain region is disposed within of the substrate and separated from the source region along a first direction. A gate structure is over the upper surface of the substrate between the source region and the drain region. The upper surface of the substrate has a first width directly below the gate structure that is larger than a second width of the upper surface of the substrate within the source region or the drain region. The first width and the second width are measured along a second direction that is perpendicular to the first direction.

Abstract: An electrical connector includes an insulative housing and a plurality of contacts retained within the housing as a contact module. The housing includes a base and a mating tongue forwardly extending from the base. The contacts are arranged with two rows contacting sections respectively exposed upon two opposite surfaces of the mating tongue, and one row mounting sections for mounting to a same plane of a printed circuit board. Each contact has a linking section between the contacting section and the mounting section. The contacts are grouped by one grounding contact associated with a pair of neighboring differential pair signal contacts in an isosceles triangular configuration wherein the grounding contact is located at the top apex. The linking section of grounding contact of the outermost group is widened compared with those of the remaining contacts for lowering the corresponding impedance.

Abstract: A method for manufacturing a semiconductor device includes forming a structure protruding from a substrate, forming a dielectric layer covering the structure, forming a dummy layer covering the dielectric layer, and performing a planarization process to completely remove the dummy layer. A material of the dummy layer has a slower removal rate to the planarization process than a material of the dielectric layer.

Abstract: A method for machine learning based artifact rejection is provided. The method may include applying a machine learning model to identify artefactual independent components in transcranial magnetic stimulation electroencephalogram data collected during a transcranial magnetic stimulation procedure. Clean transcranial magnetic stimulation electroencephalogram data is generated by removing, from the transcranial magnetic stimulation electroencephalogram data, the artefactual independent components. Real-time adjustments to parameters of the transcranial magnetic stimulation procedure may be performed based on the clean transcranial magnetic stimulation electroencephalogram data. Related systems and articles of manufacture, including computer program products, are also provided.

Abstract: A micro LED display panel defines a display area and a border area surrounding the display area. The micro LED display panel includes a TFT array substrate, a plurality of micro LEDs on the TFT array substrate, a common electrode on the TFT array substrate, the common electrode covering and electrically coupling to all of the micro LEDs; a metal layer on a side of the common electrode away from the TFT array substrate and electrically coupling to the common electrode, and a black photoresist layer on a side of the metal layer away from the TFT array substrate. The black photoresist layer defines through holes. Each through hole extends through both the black photoresist layer and the metal layer and aligns with one micro LED. The metal layer and the black photoresist layer cover the display area and the border area.

Abstract: Various embodiments of the present application are directed to an embedded memory boundary structure with a boundary sidewall spacer, and associated forming methods. In some embodiments, an isolation structure is formed in a semiconductor substrate to separate a memory region from a logic region. A memory cell structure is formed on the memory region and a dummy structure is formed on the isolation structure. A boundary sidewall spacer is formed covering the dummy structure. A protecting dielectric layer is formed on a top surface of the boundary sidewall spacer. The boundary sidewall spacer and the protecting dielectric layer provide a smooth boundary sidewall that is not subject to damage during formation of the logic device structure and, hence, is not subject to trapping high ? etch residue during formation of the logic device structure with HKMG technology.

Abstract: A smart wearable device includes a detection apparatus and a case, the detection apparatus specifically includes one set of measuring parts and a plurality of sets of light emitting parts; the one set of measuring parts and the plurality of sets of light emitting parts are inlaid into the case and arranged into a polygon, where each of the plurality of sets of light emitting parts and the one set of measuring parts each occupies one of a plurality of angles of the polygon, and a central position of the polygon is at a specified distance to each angle of the polygon. A specific embodiment of the present invention provides a smart wearable device. One set of measuring parts and a plurality of sets of light emitting parts are disposed into a case and arranged into a polygon.

Abstract: The invention discloses a preparation method of a WC cemented carbide with adjustable alignment of plate-shape grains. According to the theoretical composition of the cemented carbide, the weighed W powder is composed of two raw W materials with significantly different particle sizes in a certain mass ratio. Also graphite powder and Co powder are weighed. W—C—Co powder is subjected to planetary ball milling with controlled process parameters; then, after plasma-assisted ball milling, W—C—Co composite powder composed of small-sized lamellar W sheets and large-sized lamellar W sheet is obtained; Finally dense cemented carbide containing plate-shape WC grains is obtained by press molding of the ball milled power and in-situ carbonization through sintering at a high temperature. The invention not only provides simple preparation process with low energy consumption, but also can regulate the degree of orientated alignment of the plate-shape WC in the sintered block.

Abstract: Disclosed are a dynamic lightning protection method and system. The method includes detecting lightning in real time and tracking a position of a thunderstorm; and performing dynamic lightning protection and control on an electrical grid according to an electrical grid control strategy before the thunderstorm reaches or affects the electrical grid. Further disclosed is a dynamic lightning protection system.

Abstract: The present disclosure provides a method, an apparatus, and a medium for calculating capacities of a plurality of photovoltaic power stations. The method includes: receiving a plurality of historical weather data sets from the plurality of weather monitoring stations; determining a scene year based on the plurality of historical weather data sets; receiving an actual generating capacity of each photovoltaic power station predicted by a power system dispatch center; extracting weather data of each photovoltaic power station in the scene year from the corresponding historical weather data set; obtaining an available generating capacity of each photovoltaic power station in the scene year based on the weather data; and determining a capacity of each photovoltaic power station in the scene year according to the actual generating capacity and the available generating capacity of each photovoltaic power station.

Abstract: A data transmission method applied in a display, which includes a display panel, is provided. The data transmission method includes the following steps of: providing a host controller and n display drivers, n is a natural number greater than 1; providing a communication link under mobile industry processor interface (MIPI), connecting the host controller to the n display drivers; determining n virtual channel values Vc1-Vcn corresponding to the respective n display drivers; employing the host controller for providing a command with a virtual channel parameter through the communication link under MIPI; when the virtual channel parameter corresponds to an ith virtual channel values Vci, an ith display driver executing corresponding operations in response to the command, while the rest n?1 display drivers ignoring the command, wherein i is a natural number smaller than or equal to n.

Abstract: Provided is a lens module, including a lens barrel; and a set of lenses received in the lens barrel. The set of lenses at least includes first and second lenses. The first and second lenses cooperate with each other in a direction from an object side to an image side. A surface of the first lens facing towards the second lens includes a first abutting surface extending horizontally toward an optical axis, and a first oblique surface extending obliquely from the first abutting surface in a direction facing towards the optical axis and towards the object side. The second lens includes a second abutting surface attached to the first abutting surface, and a second oblique surface extending obliquely from the second abutting surface in the direction facing towards the optical axis and towards the object side. The first oblique surface is spaced apart from the second oblique surface.

Abstract: Aspects of the disclosure provide a method. The method includes providing a substrate having a structure formed on the substrate, and forming a spacer layer on the structure. Then, the method includes forming a mask layer over the spacer layer. The mask layer includes a first layer, a second layer over the first layer, and a third layer over the second layer. Further, the method includes patterning the third layer of the mask layer, and etching the first layer and the second layer of the mask layer with a dry etching process using the third layer as an etch mask to form an opening that exposes a portion of the spacer layer. Then, the method includes removing the second layer using a wet etchant before a formation of a backfill material layer in the opening and over the first layer.

Abstract: A method for forming a FinFET device structure is provided. The method for foiming a FinFET device structure includes forming a fin structure and a fin isolation structure over a substrate, and forming a metal stack over the fin structure and the fin isolation structure. The method for forming a FinFET device structure also includes partially removing the metal stack so that a top surface of the fin isolation structure is exposed, and forming a dielectric material over the metal stack and covering the top surface of the fin isolation structure. The method for forming a FinFET device structure further includes patterning the dielectric material and the metal stack to form a metal gate structure and an insulating structure over the metal gate structure.

Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of photodiodes is formed from a front-side of a substrate. A plurality of boundary deep trench isolation (BDTI) trenches having a first depth and a plurality of multiple deep trench isolation (MDTI) trenches having a second depth are formed from a back-side of the substrate. A stack of dielectric layers is formed in the BDTI trenches and the MDTI trenches. A plurality of color filters is formed overlying the stack of dielectric layers corresponding to the plurality of photodiodes.

Abstract: A packet-transmission method, a local edge device and a machine-readable storage medium are provided. The method includes: receiving a first notification message from an opposite edge device, parsing out a first host route from the first notification message, and adding a first forwarding table entry to a software forwarding table, wherein the first forwarding table entry includes a correspondence between the first host route and an interface receiving the first notification message; inquiring, after receiving a packet, a hardware forwarding table according to a destination address of the packet, if there is no forwarding table entry matched with the destination address in the hardware forwarding table, inquiring the software forwarding table according to the destination address of the packet, if there is a forwarding table entry matched with the destination address in the software forwarding table, sending the packet according to the forwarding table entry matched with the destination address.

Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.

Abstract: A computer system including program instructions to receive a message at a source gateway of the local network, the message includes message data corresponding to a plurality of message elements, assign a unique group ID based on the type of message received at the source gateway, extract a message format from the received message, the message format defines how the message data is organized with respect to the message elements, and associate the extracted message format with the unique group ID. The computer system further including program instructions to store locally, the extracted message format together with the associated unique group ID, establish a dedicated connection between the source gateway and a target gateway of the remote network based on the unique group ID, encode the message based on the extracted message format, and send the encoded message from the source gateway to the target gateway across the dedicated connection.

Abstract: An optical image capturing module is provided, including a circuit assembly and a lens assembly. The circuit assembly may include a circuit substrate, a plurality of image sensor elements, a plurality of signal transmission elements, and a multi-lens frame. The image sensor elements may be connected to the circuit substrate. The signal transmission elements may be electrically connected between the circuit substrate and the image sensor elements. The multi-lens frame may be manufactured integrally, be covered on the circuit substrate and the image sensor elements, and surround the image sensor elements and the signal transmission elements. The lens assembly may include a lens base, a fixed-focus lens assembly, an auto-focus lens assembly, and a driving assembly. The lens base may be fixed to a multi-lens frame. The fixed-focus lens assembly and the auto-focus lens assembly may have at least two lenses with refractive power.

Abstract: A method for cleaning a reticle includes rotating the reticle, providing a cleaning liquid to clean the reticle, detecting a static charge value on the reticle during rotating the reticle, and reducing static charges on the reticle in response to the detected static charge value. Hence, the electrostatic discharge (ESD) occurred to the reticle can be prevented.