Patents by Inventor An Y. Chien

An Y. Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature flexible die attach adhesive and articles using same
    Patent number: 5612403
    Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
    Type: Grant
    Filed: October 16, 1995
    Date of Patent: March 18, 1997
    Assignee: Johnson Matthey, Inc.
    Inventors: My N. Nguyen, Yuan Y. Chien
  • Low temperature flexible die attach adhesive and articles using same
    Patent number: 5489637
    Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
    Type: Grant
    Filed: February 22, 1995
    Date of Patent: February 6, 1996
    Assignee: Johnson Matthey Inc
    Inventors: My N. Nguyen, Yuan Y. Chien
  • Low temperature flexible die attach adhesive and articles using same
    Patent number: 5399907
    Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: March 21, 1995
    Assignee: Johnson Matthey Inc.
    Inventors: My N. Nguyen, Yuan Y. Chien
  • Roundness error and crown electronic measuring system
    Patent number: 5337485
    Abstract: An electronic three-probe measuring system with both compact structure, light and small, and spacial method, which views the dimensional changes in the measuring roundness error step to contain both roundness error and vibration for accurately measuring roundness error, concentricity, crown, shape, taper, sag and vibration of cylindrical rolls used in flat rolled product mills.
    Type: Grant
    Filed: September 21, 1992
    Date of Patent: August 16, 1994
    Inventor: An Y. Chien
  • Low temperature flexible die attach adhesive and articles using same
    Patent number: 5250600
    Abstract: Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
    Type: Grant
    Filed: May 28, 1992
    Date of Patent: October 5, 1993
    Assignee: Johnson Matthey Inc.
    Inventors: My N. Nguyen, Yuan Y. Chien