Patents by Inventor An-Yen Wu

An-Yen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171952
    Abstract: An anti-counterfeiting two-piece type electromagnetic induction sealing liner includes an adhesive layer, an electromagnetic induction heating layer, a weak adhesive layer, a backing layer and an information tag sequentially composited from bottom to top. The information tag is built-in with an information chip and an antenna circuit electrically connected to the information chip. The present disclosure is capable of enhancing an anti-counterfeiting ability of a product when used.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 23, 2024
    Inventor: YEN-WU YANG
  • Publication number: 20240167185
    Abstract: A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 23, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chiu-Yen Chiu, Li-Ju Chen, Sheng-Hui Wu, Chia-Chen Fang
  • Publication number: 20240165181
    Abstract: A composition for inhibiting intestinal permeability, treating leaky gut related diseases and/or preventing leaky gut related diseases including a Chinese herbal compound material or a Chinese herbal compound extract is provided. The Chinese herbal compound material includes Ganoderma, red jujube, longan and lotus seed. Moreover, the Chinese herbal compound extract includes a Ganoderma extract, a red jujube extract, a longan extract and a lotus seed extract.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 23, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: I-Hong PAN, Kuei-Chang LI, Zong-Keng KUO, Chu-Hsun LU, Yen-Wu HSIEH, Shu-Fang WEN
  • Patent number: 11986926
    Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: May 21, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
  • Publication number: 20240162602
    Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 16, 2024
    Inventors: Chia-Ping TSENG, Ker-Yih KAO, Chia-Chi HO, Ming-Yen WENG, Hung-I TSENG, Shu-Ling WU, Huei-Ying CHEN
  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Patent number: 11981573
    Abstract: A method for selectively chemically reducing CO2 to form CO includes providing a catalyst, and contacting H2 and CO2 with the catalyst to chemically reduce CO2 to form CO. The catalyst includes a metal oxide having a chemical formula of FexCoyMn(1-x-y)Oz, in which 0.7?x?0.95, 0.01?y?0.25, and z is an oxidation coordination number.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: May 14, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Ching Wu, Hsi-Yen Hsu, Chao-Huang Chen, Yuan-Peng Du
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240143967
    Abstract: An anti-counterfeiting electromagnetic induction sealing liner includes, from top to bottom order, a composite function layer, an electromagnetic induction heating layer, and an adhesion layer combined together. The composite function layer includes, from top to bottom order, an information layer and a support layer combined together. The information layer has therein an information chip and an antenna circuit electrically connected to the information chip. The composite function layer has a structurally weak region. The structurally weak region crosses the antenna circuit. The anti-counterfeiting electromagnetic induction sealing liner seals a container mouth and has an information read/write function. Therefore, the information layer is destroyed the first time the container mouth is opened, thereby improving the anti-counterfeiting function.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventor: YEN-WU YANG
  • Publication number: 20240145421
    Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
  • Publication number: 20240142833
    Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Wei-Yen Chiu, Ming-Jou Tai, You-Cheng Lu, Yi-Shiuan Cherng, Yi-Hsiu Wu, Chia-Hao Tsai, Yung-Hsun Wu
  • Publication number: 20240147726
    Abstract: A method of forming a memory structure is provided. The method includes providing a substrate, wherein the substrate has a plurality of isolation structures, and the isolation structures include a plurality of first protrusions protruding above the substrate; replacing the first protrusions with a plurality of second protrusions to define a plurality of predetermined regions of floating gates between the second protrusions. The replacing step includes forming an insulation filling material between the first protrusions and on the substrate, and performing a patterning process to the insulation filling and the first protrusions to form second protrusions to define the predetermined regions of the floating gates, and forming a plurality of floating gates in the predetermined regions of the floating gates.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Bo-Lun WU, Po-Yen HSU, Tse-Mian KUO
  • Patent number: 11974506
    Abstract: A spin-orbit torque device is disclosed, which includes: a magnetic layer; and a non-magnetic layer adjacent to the magnetic layer and comprising a spin-Hall material, wherein the spin-Hall material comprises NixCu1-x alloy, and x is in a range from 0.4 to 0.8.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: April 30, 2024
    Assignees: NATIONAL TAIWAN UNIVERSITY, ACADEMIA SINICA
    Inventors: Po-Hsun Wu, Ssu-Yen Huang, Chia-Ling Chien, Danru Qu
  • Publication number: 20240134250
    Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having a first elastic piece connecting area, a lower elastic piece disposed on the first elastic piece connecting area, and a first terminal disposed in the base body. The first terminal has: a first conductive part disposed in the base body; a first terminal connecting part disposed on one side of the first conductive part and extending toward a direction away from the first conductive part, wherein a part of the first terminal connecting part protrudes from the first elastic piece connecting area and is contacted and connected with the lower elastic piece; and an engaging part disposed on one side of the first terminal connecting part and extending toward a direction away from the first terminal connecting part.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Lanto Electronic Limited
    Inventors: Wen-Yen HUANG, Fu-Yuan WU, Shang-Yu HSU, Meng-Ting LIN, BingBing MA, Jie DU
  • Publication number: 20240131808
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Application
    Filed: December 7, 2022
    Publication date: April 25, 2024
    Inventors: TENG-YEN WANG, SHUN-SHENG KO, MIAO-CHANG WU, TUNG-YING LIN, CHAO-HONG HSU
  • Publication number: 20240111116
    Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 4, 2024
    Applicant: Lanto Electronic Limited
    Inventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
  • Publication number: 20240114683
    Abstract: A method of manufacturing a memory device includes providing a substrate and sequentially forming a stack layer and a hard mask layer on the substrate. The method includes forming a first patterned mandrel and a plurality of second patterned mandrels on the hard mask layer, wherein the first patterned mandrel is adjacent to and spaced apart from an end of the second patterned mandrels in the first direction. The method further includes using the first patterned mandrel and the second patterned mandrels as masks, patterning the hard mask layer and the stack layer sequentially to form a dummy structure and a plurality of word lines separated from each other on the substrate. A portion of the stack layer corresponding to the first mandrel is formed into the dummy structure, and a portion of the stack layer corresponding to the second patterned mandrels is formed into the word lines.
    Type: Application
    Filed: October 3, 2022
    Publication date: April 4, 2024
    Inventors: Tsung-Wei LIN, Kun-Che WU, Chun-Yen LIAO, Chun-Sheng WU
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20240100134
    Abstract: The present invention relates to chimeric and fusion proteins and their compositions, and the use of such proteins and compositions in the prevention and/or treatment diseases or conditions requiring plasminogen supplementation. In one aspect, the invention provides a chimeric or fusion protein comprising plasminogen and an Fc region of an antibody.
    Type: Application
    Filed: January 20, 2022
    Publication date: March 28, 2024
    Applicant: Monash University
    Inventors: James C. Whisstock, Ruby HP Law, Adam J. Quek, Christoph Hagemeyer, Mikael Martino, Guojie Wu, Yen-Zhen Lu
  • Publication number: 20240103244
    Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Applicant: Lanto Electronic Limited
    Inventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du