Patents by Inventor An Zhao

An Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11557358
    Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines and bit lines and arranged in strings and configured to retain a threshold voltage. Each of the memory cells is configured to be erased in an erase operation occurring during an erase time period. A control circuit is configured to adjust at least a portion of the erase time period in response to determining the erase operation is a segmented erase operation and is resumed after being suspended. The control circuit applies an erase signal having a plurality of voltage segments temporally separated from one another during the erase time period to each of the strings while simultaneously applying a word line erase voltage to selected ones of the word lines to encourage erasing of the memory cells coupled to the selected ones of the word lines in the segmented erase operation.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: January 17, 2023
    Assignee: SanDisk Technologies LLC
    Inventors: Dengtao Zhao, Deepanshu Dutta, Ravi Kumar
  • Patent number: 11558687
    Abstract: An interactive control method and device of earphones, an earphone and a storage medium are disclosed. The earphones include a first earphone and a second earphone. The method comprises: acquiring putting-on sequential order information or taking-off sequential order information of the first earphone and/or the second earphone; determining a first functional instruction corresponding to the putting-on sequential order information or a second functional instruction corresponding to the taking-off sequential order information according to a preset correspondence between the putting-on sequential order information or the taking-off sequential order information and functional instructions of a mobile terminal; and sending the first functional instruction or the second functional instruction to the mobile terminal, so that the mobile terminal executes the first functional instruction or the second functional instruction to realize a first interaction function or a second interaction function with the earphones.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: January 17, 2023
    Assignee: GOERTEK INC.
    Inventor: Jifu Zhao
  • Patent number: 11557489
    Abstract: Disclosed herein are cavity structures in integrated circuit (IC) package supports, as well as related methods and apparatuses. For example, in some embodiments, an IC package support may include: a cavity in a dielectric material, wherein the cavity has a bottom and sidewalls; conductive contacts at the bottom of the cavity, wherein the conductive contacts include a first material; a first peripheral material outside the cavity, wherein the first peripheral material is at the sidewalls of the cavity and proximate to the bottom of the cavity, and the first peripheral material includes the first material; and a second peripheral material outside the cavity, wherein the second peripheral material is at the sidewalls of the cavity and on the first peripheral material, and the second peripheral material is different than the first peripheral material.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji Yong Park, Kyu Oh Lee, Cheng Xu
  • Patent number: 11554343
    Abstract: A movable carbon capture system applied to agriculture-harmonious buildings, which includes a carbon capture unit and a high-concentration CO2 supply unit which are respectively integrated, wherein the carbon capture unit comprises a CO2 adsorption chamber and an air pump, and the high-concentration CO2 supply unit comprises a vacuum pump and an air storage cavity; an air inlet of the CO2 adsorption chamber is connected to the indoor environment, an exhaust port of the CO2 adsorption chamber is connected to an atmosphere outlet, an air outlet of the CO2 adsorption chamber is connected with an air inlet of the vacuum pump, an air outlet of the vacuum pump is connected with an air inlet of the air storage cavity, an air outlet of the air storage cavity is connected with a greenhouse air supply port, and the greenhouse air supply port is connected with a greenhouse.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: January 17, 2023
    Assignee: TIANJIN UNIVERSITY
    Inventors: Shuai Deng, Kailong Wu, Bowen Liu, Li Zhao, Shuangjun Li, Mengchao Chen, Lijin Chen, Jie Zhao
  • Patent number: 11558758
    Abstract: This disclosure relates to methods and devices for mitigating overheating in a user equipment device (UE). The UE is configured to communicate over each of LTE and 5G NR and may be configured to communicate through 5G NR over each of a Sub-6 GHz and a millimeter Wave (mmW) frequency band. The UE is configured to establish an ENDC connection with an enB and one or more gNBs. The UE implements intelligent transmission modification and cell measurement adjustments to mitigate overheating and reduce battery drain.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: January 17, 2023
    Assignee: Apple Inc.
    Inventors: Alosious Pradeep Prabhakar, Wen Zhao, Lakshmi N. Kavuri, Li Su, Sagar B. Shah, Sriram Subramanian, Vijay Venkataraman, Vishwanth Kamala Govindaraju, Shiva Krishna Narra, Sanjeevi Balasubramanian, Wei Zhang, Madhukar K. Shanbhag, Sandeep K. Sunkesala, Srinivasan Nimmala, Muthukumaran Dhanapal, Tarakkumar G. Dhanani, Sree Ram Kodali, Ioannis Pefkianakis, Dhruv Khati, Franco Travostino, Thanigaivelu Elangovan, Madhusudan Chaudhary, Geoffrey R. Hall
  • Patent number: 11557579
    Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
  • Patent number: 11556817
    Abstract: Provided are a computer program product, system, and method for using a machine learning module to rank technical solutions to user described technical problems to provide to a user. A solutions database is searched to determine a result set of answer files having keywords related to keywords of a technical problem in a user description. The result set of answer files, the user description of the technical problem, user profile information, and technical specifications of the computing system are provided as input to a machine learning module. The machine learning module outputs ranks of the answer files in the result set. A subset of answer files in the result set is selected based on ranks of the answer files in the result set and returned to the user.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: January 17, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cecilia Carranza Lewis, Peter Hung Quach, Samantha Jean Wareing, Nicholas Ikaika Bostwick, David C. Reed, Chen Zhao
  • Patent number: 11554364
    Abstract: A method of forming a catalyst is provided herein. The method comprises combining a binder, a support, and an active metal to form a slurry composition. The method further comprises applying the slurry composition using an additive manufacturing process to form a green part. The method further comprises exposing the green part to heat at a temperature of from about 10° C. to about 150° C. to form the hardened part. The method further comprises applying a ceramic-based coating material to the hardened part to form the catalyst.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: January 17, 2023
    Assignee: UT-BATTELLE, LLC
    Inventors: Xianhui Zhao, James W. Klett, Soydan Ozcan, Halil Tekinalp, Justin Figley
  • Patent number: 11556648
    Abstract: In some implementations there may be provided a system. The system may include a processor and a memory. The memory may include program code which causes operations when executed by the processor. The operations may include analyzing a series of events contained in received data. The series of events may include events that occur during the execution of a data object. The series of events may be analyzed to at least extract, from the series of events, subsequences of events. A machine learning model may determine a classification for the received data. The machine learning model may classify the received data based at least on whether the subsequences of events are malicious. The classification indicative of whether the received data is malicious may be provided. Related methods and articles of manufacture, including computer program products, are also disclosed.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: January 17, 2023
    Assignee: Cylance Inc.
    Inventors: Xuan Zhao, Aditya Kapoor, Matthew Wolff, Andrew Davis, Derek A. Soeder, Ryan Permeh
  • Patent number: 11557353
    Abstract: An optimal detection voltage obtaining method, a reading control method and an apparatus are provided.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: January 17, 2023
    Assignee: MAXIO TECHNOLOGY (HANGZHOU) CO., LTD.
    Inventors: Xuhang Zhang, Xiaofan Yu, Zihua Xiao, Ye Jin, Quan Cai, Xiaomin Luo, Lihong Zhao, Rui Cao
  • Patent number: 11558479
    Abstract: The present disclosure provides an access method, an internet of things platform, an application device and a service device. The access method applied to the internet of things platform includes: receiving an operation request message transmitted by an application device for accessing a service device, where the operation request message carries position information of the application device; determining whether the application device is capable of establishing connection with the service device according to the position information of the application device; when determining that the application device is capable of establishing connection with the service device, transmitting an operation response message carrying instruction information to the application device, where the instruction information is used to instruct the application device to access the service device.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: January 17, 2023
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventor: Junjie Zhao
  • Patent number: 11554414
    Abstract: A laser-solid-forming manufacturing device includes a laser emitter, a magnetic field generator, and a forming platform. The laser emitter emits a laser beam which acts on a feedstock to form a molten pool. The magnetic field generator includes a spiral copper coil, a first electrode and a second electrode. The spiral copper coil is formed by spirally winding a copper tube. The first and second electrodes are arranged at respective ends of the copper tube and are used for loading a voltage to generate a magnetic field in the spiral copper coil. At any time, the spiral copper coil sleeves an action point of the laser beam and the feedstock. A corresponding laser-solid-forming manufacturing method is also presented.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: January 17, 2023
    Assignee: SHANGHAI UNIVERSITY
    Inventors: Zhongming Ren, Jiang Wang, Jianwen Nie, Chaoyue Chen, Wei Liu, Ruixin Zhao
  • Patent number: 11556775
    Abstract: Described herein are systems and methods for compressing and speeding up dense matrix multiplications as found, for examples, in the fully connected and recurrent layers of neural networks for embedded large vocabulary continuous speech recognition (LVCSR). For compression, trace norm regularization technique embodiments were introduced and studied for training low rank factored versions of matrix multiplications. Compared to standard low rank training, the methods more consistently lead to good accuracy versus number of parameter trade-offs and can be used to speed-up training of large models. Faster inference may be further enabled on ARM processors through kernels optimized for small batch sizes, resulting in speed ups over the currently used library. Beyond LVCSR, the techniques are also generally applicable to embedded neural networks with large fully connected or recurrent layers.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: January 17, 2023
    Assignee: Baidu USA LLC
    Inventors: Markus Kliegl, Siddharth Goyal, Kexin Zhao, Kavya Srinet, Mohammad Shoeybi
  • Patent number: 11558607
    Abstract: Embodiments provide methods and devices (encoder and/or decoder) of coding a picture. A History Based Motion Vector Prediction (HMVP) list for a current Coding Tree Unit (CTU) row within a tile of a picture is initialized and a CTU of the current CTU row is processed based on the initialized HMVP list.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: January 17, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Anand Meher Kotra, Jianle Chen, Semih Esenlik, Biao Wang, Han Gao, Zhijie Zhao
  • Patent number: 11558985
    Abstract: The present disclosure provides a frequency converter. The frequency converter includes a box body and a bottom box. A bottom portion of the box body is fixedly connected with a top portion of the bottom box. A top portion of a left side of the box body and a bottom portion of the left side of the box body are fixedly connected to a respective fan. A top portion of a left side of an inner wall of the box body and a top portion of the left side of the inner wall of the box body are fixedly connected to a respective annular plate. One end of an output shaft of each fan is fixedly connected to a rotating rod. One end of each rotating rod away from the fan passes through the box body and extends to an interior of the box body.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: January 17, 2023
    Assignee: CHINA UNIVERSITY OF PETROLEUM BLUE SKY (QINGDAO) PETROLEUM TECHNOLOGY CO., LTD.
    Inventors: Kaikai Li, Huidong Lu, Chuan Yan, Enfang Xu, Weizhong Wei, Jiasheng Zhang, Shouyuan Zhao, Liuzhu Zhang, Xinran Li, Maofeng Yang
  • Patent number: 11557333
    Abstract: Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: January 17, 2023
    Assignee: Tahoe Research, Ltd.
    Inventors: Chong J. Zhao, James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains
  • Patent number: 11557369
    Abstract: A memory device includes a memory array comprising a plurality of memory elements and a memory controller coupled to the memory array. The memory controller when in operation receives an indication of a defect in the memory array determines a first location of the defect when the defect is affecting only one memory element of the plurality of memory elements, determines a second location of the defect when the defect is affecting two or more memory elements of the plurality of memory elements, and performs a blown operation on a defective memory element at the second location when the defect is affecting two or more memory elements of the plurality of memory elements.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: January 17, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Nicola Ciocchini, Peng Zhao
  • Patent number: 11553794
    Abstract: A furniture item includes a main body with an electrical device installed thereon. A power line electrically connects the electrical device to an external power source and is concealed in a power line channel formed in one or more of the walls of the main body. A switch may be connected to the main body and electrically connected to the electrical device, for controlling the electrical device. A main body door moveable from a first position to a second position may trigger the switch to enable and disable electrical connection between the external power source and the electrical device.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 17, 2023
    Assignee: eMoMo Technology Co., Ltd.
    Inventors: Wei Zhou, Yushu Zhao, Ming Kong, Jingzhi Chen
  • Patent number: 11558361
    Abstract: A mesh network system suitable for connection to a cloud server is provided. The system includes: a first node device, configured to store a first private key and encrypt to-be-verified data according to the first private key to generate first encrypted data; and a second node device, configured to receive the first encrypted data and send the first encrypted data to the cloud server. After sending the first encrypted data, the second node device obtains, from the cloud server, second encrypted data generated by encrypting a first key according to the first public key. The second node device sends the second encrypted data to the first node device. The first node device decrypts the second encrypted data according to the first private key to obtain the first key from the second encrypted data, and performs encrypted communication with the cloud server according to the first key.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 17, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Jing-Jun Wu, Cui Ding, Zuo-Hui Peng, Zhao-Ming Li, Guo-Feng Zhang
  • Patent number: D975840
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: January 17, 2023
    Assignee: DONGGUAN QUANDING MEDICAL SUPPLIES CO., LTD
    Inventor: Xiaoting Zhao