Abstract: A carbon-doped hard mask includes a dielectric material containing carbon which is released from the hard mask during a metal etching process. The released carbon is deposited on and bonds to sidewalls of the metal structure during the metal etching process to passivate the sidewalls of the metal structure and prevent lateral etching of the sidewalls during the metal etching process. The released carbon also prevents accumulation of metal residue in open fields.

Abstract: A carbon-doped hard mask includes a dielectric material containing carbon which is released from the hard mask during a metal etching process. The released carbon is deposited on and bonds to sidewalls of the metal structure during the metal etching process to passivate the sidewalls of the metal structure and prevent lateral etching of the sidewalls during the metal etching process. The released carbon also prevents accumulation of metal residue in open fields.

Abstract: A carbon-doped hard mask includes a dielectric material containing carbon which is released from the hard mask during a metal etching process. The released carbon is deposited on and bonds to sidewalls of the metal structure during the metal etching process to passivate the sidewalls of the metal structure and prevent lateral etching of the sidewalls during the metal etching process. The released carbon also prevents accumulation of metal residue in open fields.

Abstract: A carbon-doped hard mask includes a dielectric material containing carbon which is released from the hard mask during a metal etching process. The released carbon is deposited on and bonds to sidewalls of the metal structure during the metal etching process to passivate the sidewalls of the metal structure and prevent lateral etching of the sidewalls during the metal etching process. The released carbon also prevents became relation to metal residue in open fields.

Abstract: According to the present invention, there is provided a method for fabricating a field effect transistor having reduced hot electron effects. In one embodiment, the method comprises the steps of disposing a gate oxide layer on a semiconductor substrate; disposing a gate material on the gate oxide layer; masking a portion of the gate material; anisotropically etching a gate structure into the gate material such that a trench is formed in the semiconductor substrate; implanting a source structure in the semiconductor substrate, the source structure having a first doping region superjacent a second doping region, the second doping region being lightly doped relative to the first doping region.