Patents by Inventor Ana M. Yepes

Ana M. Yepes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless communication technology, apparatuses, and methods
    Patent number: 11955732
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20230145401
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 11, 2023
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Methods and devices for dynamically avoiding radio frequency interference
    Patent number: 11558158
    Abstract: A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Michael Shusterman, John Fallin, Ana M. Yepes, Dong-Ho Han, Nasser A. Kurd, Tomer Levy, Ehud Reshef, Arik Gihon, Ido Ouzieli, Yevgeni Sabin, Maor Tal, Zhongsheng Wang, Amit Zeevi
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20220384956
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 1, 2022
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asi, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11424539
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • METHODS AND DEVICES FOR DYNAMICALLY AVOIDING RADIO FREQUENCY INTERFERENCE
    Publication number: 20220150006
    Abstract: A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 12, 2022
    Inventors: Michael SHUSTERMAN, John FALLIN, Ana M. YEPES, Dong-Ho HAN, Nasser A. KURD, Tomer LEVY, Ehud RESHEF, Arik GIHON, Ido OUZIELI, Yevgeni SABIN, Maor TAL, Zhongsheng WANG, Amit ZEEVI
  • Package on antenna package
    Patent number: 11233018
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: January 25, 2022
    Assignee: INTEL CORPORATION
    Inventors: Sidharth Dalmia, Ana M. Yepes, Pouya Talebbeydokhti, Miroslav Baryakh, Omer Asaf
  • Wi-gig signal radiation via ground plane subwavelength slit
    Patent number: 10686482
    Abstract: A metal chassis for a mobile device is configured to transmit a signal of a wavelength. A first side of the chassis faces the inside of the mobile device and includes a first aperture that has a dimension that comprises a first subwavelength width of a slot in the chassis. A second side of the chassis faces free space and includes a second aperture that has a dimension that comprises a second subwavelength width of the slot in the chassis. A channel connects the first aperture and the second aperture. The slot has a length dimension and the channel may be centered along the length dimension. The channel is configured to support a transverse electromagnetic mode for propagation of the signal from the first aperture through the channel to the second aperture. As a part of a mobile device the chassis acts as a secondary radiator for the mobile device.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: June 16, 2020
    Assignee: Intel Corporation
    Inventors: Yaniv Michaeli, Menashe Soffer, Omer Asaf, Ana M. Yepes, Manish A. Hiranandani, Anand S. Konanur
  • PACKAGE ON ANTENNA PACKAGE
    Publication number: 20200185342
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 11, 2020
    Inventors: Sidharth DALMIA, Ana M. YEPES, Pouya TALEBBEYDOKHTI, Miroslav BARYAKH, Omer ASAF
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Package on antenna package
    Patent number: 10566298
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 18, 2020
    Assignee: Intel IP Corporation
    Inventors: Sidharth Dalmia, Ana M. Yepes, Pouya Talebbeydokhti, Miroslav Baryakh, Omer Asaf
  • Integration of millimeter wave antennas in reduced form factor platforms
    Patent number: 10522898
    Abstract: Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: December 31, 2019
    Assignee: INTEL CORPORATION
    Inventors: Min Keen Tang, Ana M. Yepes, Yaniv Michaeli, Menashe Soffer
  • Device, system and method to interconnect circuit components on a transparent substrate
    Patent number: 10269716
    Abstract: Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 23, 2019
    Assignee: INTEL CORPORATION
    Inventors: Vijay Kasturi, Ana M. Yepes, Chung-Hao Chen, Bradley A. Jackson
  • INTEGRATION OF MILLIMETER WAVE ANTENNAS IN REDUCED FORM FACTOR PLATFORMS
    Publication number: 20190058240
    Abstract: Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.
    Type: Application
    Filed: August 30, 2016
    Publication date: February 21, 2019
    Inventors: MIN KEEN TANG, ANA M. YEPES, YANIV MICHAELI, MENASHE SOFFER
  • PACKAGE ON ANTENNA PACKAGE
    Publication number: 20190035749
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Application
    Filed: April 1, 2016
    Publication date: January 31, 2019
    Applicant: INTEL CORPORATION
    Inventors: Sidharth DALMIA, Ana M. YEPES, Pouya TALEBBEYDOKHTI, Miroslav BARYAKH, Omer ASAF
  • DEVICE, SYSTEM AND METHOD TO INTERCONNECT CIRCUIT COMPONENTS ON A TRANSPARENT SUBSTRATE
    Publication number: 20180005947
    Abstract: Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 4, 2018
    Inventors: Vijay KASTURI, Ana M. YEPES, Chung-Hao CHEN, Bradley A. JACKSON
  • WI-GIG SIGNAL RADIATION VIA GROUND PLANE SUBWAVELENGTH SLIT
    Publication number: 20170250720
    Abstract: A metal chassis for a mobile device is configured to transmit a signal of a wavelength. A first side of the chassis faces the inside of the mobile device and includes a first aperture that has a dimension that comprises a first subwavelength width of a slot in the chassis. A second side of the chassis faces free space and includes a second aperture that has a dimension that comprises a second subwavelength width of the slot in the chassis. A channel connects the first aperture and the second aperture. The slot has a length dimension and the channel may be centered along the length dimension. The channel is configured to support a transverse electromagnetic mode for propagation of the signal from the first aperture through the channel to the second aperture. As a part of a mobile device the chassis acts as a secondary radiator for the mobile device.
    Type: Application
    Filed: December 21, 2016
    Publication date: August 31, 2017
    Inventors: Yaniv Michaeli, Menashe Soffer, Omer Asaf, Ana M. Yepes, Manish A. Hiranandani, Anand S. Konanur
  • Parallel via to improve the impedance match for embedded common mode filter design
    Patent number: 9571059
    Abstract: A parallel via design is disclosed to improve the impedance match for embedded common mode choke filter designs. Particularly suited to such designs on four-layer printed circuit boards, the parallel via design effectively suppresses the reflection of the differential pair. By connecting the vias in parallel, the inductance of the entire via structure is reduced while its capacitance is simultaneously increased. By properly choosing the number of parallel vias and the spacing between them, the impedance of the parallel vias can be well controlled within the frequency range of interest. Consequently, the impedance match can be improved and the return loss of a four-layer printed circuit board common mode choke filter design is reduced.
    Type: Grant
    Filed: March 28, 2015
    Date of Patent: February 14, 2017
    Assignee: INTEL CORPORATION
    Inventors: Jianfang Olena Zhu, Chung-Hao Joseph Chen, Ana M. Yepes
  • Slim external wireless storage drive
    Patent number: D796502
    Type: Grant
    Filed: December 26, 2015
    Date of Patent: September 5, 2017
    Assignee: Intel Corporation
    Inventors: Reese Bowes, Sayan Lahiri, Bo Qiu, Jianfang Olena Zhu, Brian A. Wilk, Kevin J. Daniel, Ana M. Yepes, Guodong Zhang
  • High capacity external storage drive
    Patent number: D801334
    Type: Grant
    Filed: December 26, 2015
    Date of Patent: October 31, 2017
    Assignee: Intel Corporation
    Inventors: Reese Bowes, Sayan Lahiri, Bo Qiu, Jianfang Olena Zhu, Brian A. Wilk, Kevin J. Daniel, Ana M. Yepes, Guodong Zhang