Abstract: Determining if a hermetically sealed MEMs device loses hermeticity during operation. In one embodiment, the MEMs device is an accelerometer. A test signal having an associated frequency above an operational frequency range for the accelerometer is provided to the accelerometer at an input during operation of the accelerometer for sensing an acceleration. The output signal of the accelerometer is filtered at least above the operational frequency range of the accelerometer producing a test output signal. The test output signal is then compared to a predetermined threshold to determine if the amplitude of the test output signal differs from the threshold. If the amplitude of the test output signal differs from the predetermined threshold, an error signal is produced indicating that hermeticity of the accelerometer has been lost.

Abstract: A MEMS device with movable MEMS structure and electrodes is produced by fabricating electrodes and shielding the electrodes with diamond buttons during subsequent fabrication steps, such as the etching of sacrificial oxide using vapor HF. In some embodiments, the diamond buttons are removed after the movable MEMS structure is released.

Abstract: A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

Abstract: Error sources related to aerodynamics of an inertial sensor resonator are detected by modulating the distance between the resonator and the underlying substrate and sensing modulated error signals in the accelerometer that are induced by such modulation. Compensating signals may be provided to substantially cancel errors caused by such error sources.

Abstract: A LED current control system for use with an LED drive system which includes LED strings connected in series with respective current sink circuits, each of which causes a current to be conducted by the LED string to which it is connected. The drive system includes 3 or more ‘dimming’ inputs with which the LED string currents can be adjusted. The LED current control system comprises at least one minimum circuit which receives two or more dimming inputs and produces an output which is proportional to the lesser of the inputs, a multiplier circuit which receives the outputs of the minimum circuits and at least one other dimming input and produces an output ILED which is proportional to the product of the received signals, and a sink control circuit which receives ILED and controls the current sink circuits such that the string currents vary with ILED.

Abstract: Various embodiments of the present invention provide a two-wire (e.g., unshielded twisted pair) bus system that is simple (e.g., no microcontroller required in slave devices), synchronous with embedded clock information, inexpensive, automotive EMC compliant, and has sufficient speed and bandwidth for a large number of slave devices/peripherals, and also provides various protocols that can be used in various communication systems such as a two-wire bus system. The two-wire bus optionally may be self-powered, i.e., the master device may provide power to the slave devices over the two-wire bus.

Abstract: Apparatus and methods for electronic circuit protection are disclosed. In one embodiment, an apparatus comprises a well having an emitter and a collector region. The well has a doping of a first type, and the emitter and collector regions have a doping of a second type. The emitter region, well, and collector region are configured to operate as an emitter, base, and collector for a first transistor, respectively. The collector region is spaced away from the emitter region to define a spacing. A first spacer and a second spacer are positioned adjacent the well between the emitter and the collector. A conductive plate is positioned adjacent the well and between the first spacer and the second spacer, and a doping adjacent the first spacer, the second spacer, and the plate consists essentially of the first type.

Abstract: Apparatuses and methods for providing transient electrical event protection are disclosed. In one embodiment, an apparatus comprises a detection and timing circuit, a current amplification circuit, and a clamping circuit. The detection and timing circuit is configured to detect a presence or absence of a transient electrical event at a first node, and to generate a first current for a first duration upon detection of the transient electrical event. The current amplification circuit is configured to receive the first current from the detection and timing circuit and to amplify the first current to generate a second current. The clamping circuit is electrically connected between the first node and a second node and receives the second current for activation. The clamping circuit is configured to activate a low impedance path between the first and second nodes in response to the second current, and to otherwise deactivate the low impedance path.

Abstract: Electronic circuitry comprising operational circuits of active switching type requiring timing signals, and conductive means for distributing said timing signals to the operational circuits, wherein the timing signal distribution means includes a signal path that has different phases of a drive signal are supplied via active means at different positions about the signal path where that path exhibits endless electro-magnetic continuity without signal phase inversion or has interconnections with another signal path having different substantially unidirectional signal flow where there is no endless electromagnetic continuity between those signal paths and generally has non-linear associated circuit means where the signal path is of a transmission line nature.

Abstract: A voltage reference circuit comprises a plurality of ?VBE cells, each comprising four bipolar junction transistors (BJTs) connected in a cross-quad configuration and arranged to generate a ?VBE voltage. The plurality of ?VBE cells are stacked such that their ?VBE voltages are summed. A last stage is coupled to the summed ?VBE voltages and arranged to generate one or more VBE voltages which are summed with the ?VBE voltages to provide a reference voltage. This arrangement serves to cancel out first-order noise and mismatch associated with the two current sources present in each ?VBE cell, such that the voltage reference circuit provides ultra-low 1/f noise in the bandgap voltage output.

Abstract: A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die.

Abstract: Detecting and/or mitigating the presence of particle contaminants in a MEMS device involves including MEMS structures that in normal operation are robust against the presence of particles but which can be made sensitive to that presence during a test mode prior to use, e.g.

Abstract: Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

Abstract: An inertial sensor includes driving piezoelectric transducers for enabling an oscillation of a resonator, sensing piezoelectric transducers for enabling a detection of a movement of the inertial sensor, and piezoelectric compensating elements substantially equidistantly among the driving and the sensing piezoelectric transducers, wherein the compensating elements and the resonator form corresponding capacitors having capacitive gaps, and wherein, during the oscillation of the resonator, changes in electrostatic charges stored in the capacitors are measured with the compensating elements and are modified so as to modify the oscillation of the resonator.

Abstract: A method for linearizing a non-linear system element includes acquiring data representing inputs and corresponding outputs of the non-linear system element. A model parameter estimation procedure is applied to the acquired data to determine model parameters of a model characterizing input-output characteristics of the non-linear element. An input signal representing a desired output signal of the non-linear element is accepted and processed to form a modified input signal according to the determined model parameters. The processing includes, for each of a series of successive samples of the input signal, applying an iterative procedure to determining a sample of the modified input signal according to a predicted output of the model of the non-linear element. The modified input signal is provided for application to the input of the non-linear element.

Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

Abstract: An amplifier system has an amplifier for amplifying a plurality of input signals from a plurality of different channels, and a plurality of demodulators each operatively coupled with the amplifier for receiving amplified input signals from the amplifier. Each demodulator is configured to demodulate a single amplified input channel signal from a single channel of the plurality of different channels. The system thus also has a plurality of filters, coupled with each of the demodulators, for mitigating the noise.

Abstract: An amplifier includes an amplifier section having selectable signal paths to provide discrete gain settings, and logic to incrementally select the signal paths. The logic may be configured to increment the gain in response to digital gain control signals or an analog gain control signal. Another amplifier has an input section with one or more input cells and an output section with one or more output cells. Either the input section or the output section includes at least two cells that may be selected to provide discrete gain settings. A loop amplifier is configured in a feedback arrangement with the input section. The input and output sections may have multiple selectable cells to provide coarse and fine gain steps. The gain of the loop amplifier may be coordinated with the gain of the input section to provide constant bandwidth operation.

Abstract: A stage of a pipelined analog-to-digital converter can include first and second pluralities of digital-to-analog converters (DACs), the first plurality sufficient in number to produce a residue from the stage, the second plurality having their outputs added into an analog output of the stage. A mapping circuit can exchange inputs between selected ones of the first and second pluralities of DACs, and a calibration circuit can provide first and second calibration signals to the selected one of the first plurality and another of the second plurality of DACs. The calibration signals can correlate to each other, but be uncorrelated to an analog input and digital output of the stage, and have unequal and partially offsetting effects on the stage's residue. A correction circuit can correct the digital output of the stage for circuit path errors based on a correlation between the calibration signals and an output of a succeeding stage.

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.