Patents by Inventor Anand Kumar Ramachandran

Anand Kumar Ramachandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250224105
    Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.
    Type: Application
    Filed: September 16, 2024
    Publication date: July 10, 2025
    Inventors: Srinath K. Aanegola, Parameswari V. L. Gundavarapu, Andrew F. Scarlata, Chinmaya Rajiv Dandekar, Anand Kumar Ramachandran, Pushpak Paris Yabrer
  • Patent number: 12092305
    Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: September 17, 2024
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Srinath K. Aanegola, Parameswari V. L. Gundavarapu, Andrew F. Scarlata, Chinmaya Rajiv Dandekar, Anand Kumar Ramachandran, Pushpak Paris Yabrer
  • Publication number: 20220262540
    Abstract: The disclosed concept pertains to thermoplastic based materials, e.g., thermoplastic based composites, that are suitable replacements for known thermoset based materials, e.g., unsaturated polyesters, as insulators for circuit protection in electrical contact/non-contact applications, such as, but not limited to, housings, casings, enclosures, encapsulated or over-molded parts. In certain embodiments, the thermoplastic based materials house miniature circuit breakers, and arc and ground fault circuit breakers.
    Type: Application
    Filed: February 17, 2021
    Publication date: August 18, 2022
    Applicant: EATON INTELLIGENT POWER LIMITED
    Inventors: PRASATH BALAMURUGAN GANESAN, ANAND KUMAR RAMACHANDRAN, JAVED A. MAPKAR, JEFFREY COX
  • Publication number: 20210262652
    Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 26, 2021
    Inventors: Srinath K. Aanegola, Parameswari V. L. Gundavarapu, Andrew F. Scarlata, Chinmaya Rajiv Dandekar, Anand Kumar Ramachandran, Pushpak Paris Yabrer