Patents by Inventor Anand Murugaiah

Anand Murugaiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170225951
    Abstract: A method for exfoliating and/or dispersing hexagonal boron nitride comprises mixing hexagonal boron nitride with a solvent system comprising at least two solvents. The use of a solvent system with at least two solvents provides improved benefits to the exfoliation process compared to the use of individual solvents.
    Type: Application
    Filed: September 10, 2015
    Publication date: August 10, 2017
    Inventors: Kristofer L. Marsh, Richard Barry Kaner, Anand Murugaiah, Hao Qu
  • Publication number: 20160325994
    Abstract: A multi-functional composition including high aspect boron nitride particles providing improved properties such as thermal conductivity, electrical insulation, barrier to moisture, vapor, and gasses, lubrication, friction modification, optical properties, suspension stability, and a system and method for forming such compositions. The high boron nitride particles have an average aspect ratio greater than 300. The multifunctional composition may comprise of a polymer material, fluids, metals, ceramics, glasses, other non-BN fillers and the high aspect ratio boron nitride. Also provided are methods for making such boron nitride particles and compositions.
    Type: Application
    Filed: January 5, 2015
    Publication date: November 10, 2016
    Inventors: Hao QU, Anand MURUGAIAH, Bei XIANG, Chandrashekar RAMAN, Kang YI-LIN
  • Patent number: 9434870
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a graphite, or a combination thereof, a talc, and optionally a silane. The filler composition can further comprise other filler components including, for example, wollastonite, calcium carbonate, or a combination thereof. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: September 6, 2016
    Assignee: Momentive Performance Materials Inc.
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Publication number: 20150275063
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a graphite, or a combination thereof, a talc, and optionally a silane. The filler composition can further comprise other filler components including, for example, wollastonite, calcium carbonate, or a combination thereof. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Application
    Filed: June 10, 2015
    Publication date: October 1, 2015
    Inventors: Chandrashekar Raman, Anand Murugaiah, Bei Xiang, Kang-Yi Lin
  • Publication number: 20150184055
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a graphite, or a combination thereof, a talc, and optionally a silane. The filler composition can further comprise other filler components including, for example, wollastonite, calcium carbonate, or a combination thereof. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Application
    Filed: December 24, 2014
    Publication date: July 2, 2015
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Patent number: 8946333
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 3, 2015
    Assignee: Momentive Performance Materials Inc.
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Publication number: 20140080951
    Abstract: A thermally conductive plastic composition and a system and method for forming such compositions. The thermally conductive composition comprises a polymer material and a thermally conductive filler, such as boron nitride, and exhibits good in-plane thermal conductivity, through-plane conductivity, or both. The system for forming thermally conductive plastic compositions comprises an extruder and an extruder screw comprising fractional mixing elements. The extruder can also comprise a screw with shovel elements located in a region of the system for introducing a thermally conductive filler into the extruder. The system and method allow for the processing of thermally conductive plastic compositions comprising boron nitride and can allow for the processing of boron nitride agglomerates such that the agglomerates remain sufficiently in tact to provide a composition exhibiting both excellent in-plane and through-plane conductivity.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 20, 2014
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah, Don Robert Roden, JR.
  • Publication number: 20140077125
    Abstract: A composition comprising exfoliated boron nitride crystals dispersed in a resin matrix and a method of forming such compositions comprises the in situ exfoliation of boron nitride crystals by compounding boron nitride crystals in a resin material with a hard filler material having a hardness greater than the hardness of the boron nitride crystals.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 20, 2014
    Inventors: Kang Yi Lin, Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Publication number: 20140080952
    Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 20, 2014
    Inventors: Chandrashekar Raman, Bei Xiang, Anand Murugaiah
  • Patent number: 7341702
    Abstract: A process for producing boron nitride of high purity and high thermal conductivity, wherein a oxygen-containing boron compound is reacted with a nitrogen-containing source in the presence of a dopant at a temperature of at least 1000° C. for at least one hour, and wherein the dopant forms metal borate impurities with a vaporizing temperature that is lower than the highest processing temperature in the process.
    Type: Grant
    Filed: November 3, 2005
    Date of Patent: March 11, 2008
    Assignee: Momentive Performance Materials Inc.
    Inventors: Donald William Pultz, Jr., Laurence Maniccia, Chandrashekar Raman, Anand Murugaiah
  • Publication number: 20060140838
    Abstract: A process for producing boron nitride of high purity and high thermal conductivity, wherein a oxygen-containing boron compound is reacted with a nitrogen-containing source in the presence of a dopant at a temperature of at least 1000° C. for at least one hour, and wherein the dopant forms metal borate impurities with a vaporizing temperature that is lower than the highest processing temperature in the process.
    Type: Application
    Filed: November 3, 2005
    Publication date: June 29, 2006
    Inventors: Donald Pultz, Laurence Maniccia, Chandrashekar Raman, Anand Murugaiah