Patents by Inventor Anand N. Iyer
Anand N. Iyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11673226Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.Type: GrantFiled: June 7, 2019Date of Patent: June 13, 2023Assignee: Applied Materials, Inc.Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
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Publication number: 20220281070Abstract: A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the presence of the slurry, generating relative motion between the substrate and the polishing pad, measuring a removal rate for the substrate, comparing a the measured removal rate to a target removal rate and determining whether to increase or decrease the removal rate based on the comparison, determining whether to increase or decrease a temperature of an interface between the polishing pad and the substrate based on the indication of the relative charge of the abrasive agent and on whether to increase or decrease the removal rate, and controlling a temperature of the interface as determined to modify the removal rate.Type: ApplicationFiled: February 22, 2022Publication date: September 8, 2022Inventors: Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Anand N. Iyer, Huyen Tran, Patrick A. Higashi
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Publication number: 20220281061Abstract: A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the presence of the slurry, generating relative motion between the substrate and the polishing pad, measuring a removal rate for the substrate, comparing a the measured removal rate to a target removal rate and determining whether to increase or decrease the removal rate based on the comparison, determining whether to increase or decrease a temperature of an interface between the polishing pad and the substrate based on the indication of the relative charge of the abrasive agent and on whether to increase or decrease the removal rate, and controlling a temperature of the interface as determined to modify the removal rate.Type: ApplicationFiled: February 22, 2022Publication date: September 8, 2022Inventors: Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Anand N. Iyer, Huyen Tran, Patrick A. Higashi
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Publication number: 20190291238Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.Type: ApplicationFiled: June 7, 2019Publication date: September 26, 2019Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, JR., Wei-Cheng Lee, Jeonghoon Oh
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Patent number: 10322492Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.Type: GrantFiled: July 24, 2017Date of Patent: June 18, 2019Assignee: Applied Materials, Inc.Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
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Publication number: 20180021918Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.Type: ApplicationFiled: July 24, 2017Publication date: January 25, 2018Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
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Publication number: 20140237905Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: May 5, 2014Publication date: August 28, 2014Applicant: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Patent number: 7841925Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: GrantFiled: June 19, 2009Date of Patent: November 30, 2010Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Publication number: 20100112919Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.Type: ApplicationFiled: November 3, 2008Publication date: May 6, 2010Inventors: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung
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Patent number: 7601050Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.Type: GrantFiled: February 15, 2007Date of Patent: October 13, 2009Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au, Gregory E. Menk, Gopalakrishna B. Prabhu, Anand N. Iyer, Garlen C. Leung
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Publication number: 20090253358Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.Type: ApplicationFiled: June 19, 2009Publication date: October 8, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Patent number: 7553214Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.Type: GrantFiled: February 15, 2007Date of Patent: June 30, 2009Assignee: Applied Materials, Inc.Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
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Patent number: 7429210Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: GrantFiled: January 23, 2007Date of Patent: September 30, 2008Assignee: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
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Publication number: 20080182413Abstract: Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.Type: ApplicationFiled: August 15, 2007Publication date: July 31, 2008Inventors: GREGORY E. MENK, Robert L. Jackson, Garlen C. Leung, Gopalakrishna B. Prabhu, Peter McReynolds, Anand N. Iyer
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Patent number: 7179159Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: GrantFiled: May 2, 2005Date of Patent: February 20, 2007Assignee: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung
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Patent number: 6811470Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.Type: GrantFiled: July 12, 2002Date of Patent: November 2, 2004Assignee: Applied Materials Inc.Inventors: Benjamin A. Bonner, Anand N. Iyer, Deepak N. Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong-Sik R. Kim, Christopher W. Smith, Huanbo Zhang
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Publication number: 20030036339Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.Type: ApplicationFiled: July 12, 2002Publication date: February 20, 2003Applicant: Applied Materials, Inc.Inventors: Benjamin A. Bonner, Anand N. Iyer, Deepak N. Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong-Sik R. Kim, Christopher W. Smith, Huanbo Zhang
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Patent number: 5882536Abstract: A method of removing a silver cladding from high temperature superconducting material clad in silver (HTS) is disclosed. The silver clad HTS is contacted with an aqueous solution of HNO.sub.3 followed by an aqueous solution of NH.sub.4 OH and H.sub.2 O.sub.2 for a time sufficient to remove the silver cladding from the superconducting material without adversely affecting the superconducting properties of the superconducting material. A portion of the silver cladding may be masked with a material chemically impervious to HNO.sub.3 and to a combination of NH.sub.4 OH and H.sub.2 O.sub.2 to preserve the Ag coating. A silver clad superconductor is disclosed, made in accordance with the method discussed.Type: GrantFiled: October 12, 1995Date of Patent: March 16, 1999Assignee: The University of ChicagoInventors: Uthamalingam Balachandran, Anand N. Iyer, Jiann Yuan Huang