Patents by Inventor ANAND RAMASWAMY

ANAND RAMASWAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210399799
    Abstract: An optical transceiver can be calibrated using an internal receiver side eye scan generator, and calibration values (e.g., modulator values) can be stored in memory for recalibration of the optical transceiver. The eye scan generator can receive data from the transmitter portion via an integrated and reconfigurable loopback path. At a later time, different calibration values can be accessed in memory and used to recalibrate the optical transceiver or update the calibrated values using the receive-side eye scan generator operating in loopback mode.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Inventors: Robert S. Guzzon, Sean P. Woyciehowsky, Roberto Marcoccia, Anand Ramaswamy, John Garcia, Sudharsanan Srinivasan
  • Patent number: 11153009
    Abstract: An optical device such as an optical transceiver can include a cascaded built-in self-test structure that can be configured in testing mode using an active power mode and can sufficiently attenuate light away from a loopback path in an inactive power mode. The optical device can include a wafer top emitter that can be used to tune a light source for testing and calibration of optical components while the built-in self-test structure is in active mode.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: October 19, 2021
    Assignee: Juniper Networks, Inc.
    Inventors: John Parker, John Garcia, Brandon Gomez, Molly Piels, Anand Ramaswamy
  • Patent number: 11070288
    Abstract: An optical transceiver can be calibrated using an internal receiver side eye scan generator, and calibration values (e.g., modulator values) can be stored in memory for recalibration of the optical transceiver. The eye scan generator can receive data from the transmitter portion via an integrated and reconfigurable loopback path. At a later time, different calibration values can be accessed in memory and used to recalibrate the optical transceiver or update the calibrated values using the receive-side eye scan generator operating in loopback mode.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: July 20, 2021
    Assignee: Juniper Networks, Inc.
    Inventors: Robert S. Guzzon, Sean P. Woyciehowsky, Roberto Marcoccia, Anand Ramaswamy, John Garcia, Sudharsanan Srinivasan
  • Publication number: 20210199691
    Abstract: Described are various configurations for performing efficient optical and electrical testing of an opto-electrical device using a compact opto-electrical probe. The compact opto-electrical probe can include electrical contacts arranged for a given electrical contact layout of the opto-electrical device, and optical interface with a window in a probe core that transmits light from the opto-electrical device. An adjustable optical coupler of the probe can be mechanically positioned to receive light from the device's emitter to perform simultaneous optical and electrical analysis of the device.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Inventors: Molly Piels, Anand Ramaswamy, Brandon Gomez
  • Publication number: 20210028323
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 28, 2021
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Robert Koch
  • Patent number: 10833213
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: November 10, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Robert Koch
  • Publication number: 20200333540
    Abstract: An example photonic integrated circuit includes a transmitter circuit with a optical communication path to an optical coupler configured to couple with an optical fiber. The optical communication path has a propagation direction away from the transmitter circuit and towards the optical coupler. A counter-propagating tap diverts light sent by a light source backward against the propagation direction of the optical communication path. A photodiode receives the diverted light and measures its power level. The photodiode generates a feedback signal for the optical coupler and provides the feedback signal to the optical coupler. The optical coupler receives the feedback signal and adjusts a coupling alignment of the optical communication path to the optical fiber based on the feedback signal, which indicates the measured power level of the diverted counter-propagating light.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 22, 2020
    Inventors: Brandon W. Buckley, Brian Robert Koch, John Garcia, Jared Bauters, Sudharsanan Srinivasan, Anand Ramaswamy
  • Patent number: 10739539
    Abstract: An example photonic integrated circuit includes a transmitter circuit with a optical communication path to an optical coupler configured to couple with an optical fiber. The optical communication path has a propagation direction away from the transmitter circuit and towards the optical coupler. A counter-propagating tap diverts light sent by a light source backward against the propagation direction of the optical communication path. A photodiode receives the diverted light and measures its power level. The photodiode generates a feedback signal for the optical coupler and provides the feedback signal to the optical coupler. The optical coupler receives the feedback signal and adjusts a coupling alignment of the optical communication path to the optical fiber based on the feedback signal, which indicates the measured power level of the diverted counter-propagating light.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 11, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Brandon W. Buckley, Brian Robert Koch, John Garcia, Jared Bauters, Sudharsanan Srinivasan, Anand Ramaswamy
  • Publication number: 20190378941
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Application
    Filed: August 22, 2019
    Publication date: December 12, 2019
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Robert Koch
  • Patent number: 10431703
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: October 1, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Robert Koch
  • Publication number: 20190212505
    Abstract: An example photonic integrated circuit includes a transmitter circuit with a optical communication path to an optical coupler configured to couple with an optical fiber. The optical communication path has a propagation direction away from the transmitter circuit and towards the optical coupler. A counter-propagating tap diverts light sent by a light source backward against the propagation direction of the optical communication path. A photodiode receives the diverted light and measures its power level. The photodiode generates a feedback signal for the optical coupler and provides the feedback signal to the optical coupler. The optical coupler receives the feedback signal and adjusts a coupling alignment of the optical communication path to the optical fiber based on the feedback signal, which indicates the measured power level of the diverted counter-propagating light.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 11, 2019
    Inventors: Brandon W. Buckley, Brian Robert Koch, John Garcia, Jared Bauters, Sudharsanan Srinivasan, Anand Ramaswamy
  • Patent number: 10310180
    Abstract: Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: June 4, 2019
    Assignee: Aurrion, Inc.
    Inventors: Anand Ramaswamy, Jonathan Edgar Roth, Erik Norberg, Brian Koch
  • Patent number: 10281663
    Abstract: An example photonic integrated circuit includes a transmitter circuit with a optical communication path to an optical coupler configured to couple with an optical fiber. The optical communication path has a propagation direction away from the transmitter circuit and towards the optical coupler. A counter-propagating tap diverts light sent by a light source backward against the propagation direction of the optical communication path. A photodiode receives the diverted light and measures its power level. The photodiode generates a feedback signal for the optical coupler and provides the feedback signal to the optical coupler. The optical coupler receives the feedback signal and adjusts a coupling alignment of the optical communication path to the optical fiber based on the feedback signal, which indicates the measured power level of the diverted counter-propagating light.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: May 7, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: Brandon W. Buckley, Brian Robert Koch, John Garcia, Jared Bauters, Sudharsanan Srinivasan, Anand Ramaswamy
  • Patent number: 10142712
    Abstract: Embodiments describe transceiver architectures to enable ‘loopback’ operation, thereby allowing or on-chip or intra module characterization of the transceiver. This includes but is not limited to tests such as bit error rate (BER) characterization, received power characterization and calibration of filters (MUX, DMUX etc.) present in the transceiver. Embodiments may also describe architectures for superimposing low-speed data on to the signal coming out of a transmitter, which in turn enables low frequency communication between network elements in the external link.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: November 27, 2018
    Assignee: Aurrion, Inc.
    Inventors: John M. Garcia, Anand Ramaswamy, Gregory Alan Fish
  • Publication number: 20180219112
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Application
    Filed: March 21, 2018
    Publication date: August 2, 2018
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Robert Koch
  • Publication number: 20180191433
    Abstract: Embodiments of the invention comprise a photonic integrated circuit (PIC) including an optical device and a silicon integrated circuit (IC) (such as an application specific IC (ASIC)) including a controller for the optical device. The PIC and silicon IC are integrated on a shared substrate. The PIC further includes one or more monitor photodiodes (MPDs) that are monolithically integrated with the optical device; the monolithic integration of several optical components enables ratiometric control of the optical device. Simplified control processes are executed based on the detected MPD photocurrents, on the function of the optical device (e.g., whether the device as an SOA, modulator, or attenuator), and on the application of the optical device.
    Type: Application
    Filed: March 1, 2018
    Publication date: July 5, 2018
    Inventors: John M. Garcia, Erik Johan Norberg, Anand Ramaswamy, Robert Silvio Guzzon
  • Patent number: 9960297
    Abstract: Embodiments of the invention describe apparatuses, optical systems, and methods related to utilizing optical cladding layers. According to one embodiment, a hybrid optical device includes a silicon semiconductor layer and a III-V semiconductor layer having an overlapping region, wherein a majority of a field of an optical mode in the overlapping region is to be contained in the III-V semiconductor layer. A cladding region between the silicon semiconductor layer and the III-V semiconductor layer has a spatial property to substantially confine the optical mode to the III-V semiconductor layer and enable heat dissipation through the silicon semiconductor layer.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: May 1, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Erik Johan Norberg, Anand Ramaswamy, Brian Koch
  • Publication number: 20170366880
    Abstract: Embodiments describe transceiver architectures to enable ‘loopback’ operation, thereby allowing or on-chip or intra module characterization of the transceiver. This includes but is not limited to tests such as bit error rate (BER) characterization, received power characterization and calibration of filters (MUX, DMUX etc.) present in the transceiver. Embodiments may also describe architectures for superimposing low-speed data on to the signal coming out of a transmitter, which in turn enables low frequency communication between network elements in the external link.
    Type: Application
    Filed: May 19, 2017
    Publication date: December 21, 2017
    Applicant: Aurrion, Inc.
    Inventors: John M. Garcia, Anand Ramaswamy, Gregory Alan Fish
  • Publication number: 20170205577
    Abstract: Embodiments of the invention describe apparatuses, systems, and methods of thermal management for photonic integrated circuits (PICs). Embodiments include a first device and a second device comprising including waveguides, wherein the first and second devices have different thermal operating conditions. A first region is adjacent to a waveguide of the first device, wherein its optical mode is to be substantially confined by the first region, and wherein the first region has a first thermal conductivity to dissipate heat based on the thermal operating condition of the first device. A second region is adjacent to a waveguide of the second device, wherein its optical mode is to be substantially confined by the second region, and wherein the second region has a second thermal conductivity to dissipate heat based on the thermal operating condition of the second device. In some embodiments, thermal cross talk is reduced without significantly affecting optical performance.
    Type: Application
    Filed: April 4, 2017
    Publication date: July 20, 2017
    Inventors: Anand Ramaswamy, Jonathan Edgar Roth, Erik Norberg, Brian Koch
  • Patent number: 9693122
    Abstract: Embodiments describe transceiver architectures to enable ‘loopback’ operation, thereby allowing or on-chip or intra module characterization of the transceiver. This includes but is not limited to tests such as bit error rate (BER) characterization, received power characterization and calibration of filters (MUX, DMUX etc.) present in the transceiver. Embodiments may also describe architectures for superimposing low-speed data on to the signal coming out of a transmitter, which in turn enables low frequency communication between network elements in the external link.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: June 27, 2017
    Assignee: Aurrion, Inc.
    Inventors: John M. Garcia, Anand Ramaswamy, Gregory Alan Fish