Patents by Inventor Anand VERMA

Anand VERMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240386044
    Abstract: Support for a product may be provided using an interactive chat interface. The interface may provide recommendations for actions the user may take to address the issue. A support assistant tree may be used in providing information to the user via the user interface. The user interface may include options selectable by the user to traverse the support assistant tree. For example, a server may initially record the state of the user as being at the root node of the support assistant tree. Each child node of the root node may be associated with an answer to a question or an option. When the user selects the associated answer or option, the server provides information related to the corresponding node and updates the recorded state of the user to be the corresponding node. The process may be repeated until a leaf node is reached.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 21, 2024
    Inventors: Rupam Ojha, Ajay Anand Verma, Srinivasan Ramanathan, Priyanka Aggarwal, Mohit Pratap Singh, Rohit Kumar, Sudhir Verma
  • Patent number: 12069936
    Abstract: The present invention concerns a method for deposition layers of an electronic device by slot-die deposition. Preferably, the method comprises slot-die deposition of formulation for providing compact inorganic layers, mesoporous inorganic layers, a carbon layer and a layer comprising organic-inorganic perovskite. In a preferred embodiment, the layers of a monolithic perovskite solar cell are entirely deposited by slot-die deposition. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: August 20, 2024
    Assignees: EMPA EIDGENÖSSISCHE MATERIALPRÜFUNGS-UND FORSCHUNGSANSTALT, SOLARONIX S.A.
    Inventors: Anand Verma, David Martineau, Frank Nüesch, Jacob Heier, Tobias Meyer
  • Patent number: 12033812
    Abstract: The present invention concerns a method for producing layers of an electronic device and to a method for producing electronic devices. The method comprises co-firing a plurality of different overlapping or superposed films comprising metal oxides, precursors of the aforementioned and/or carbon, in addition to organic components. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: July 9, 2024
    Assignees: EMPA EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT, SOLARONIX S.A.
    Inventors: Anand Verma, David Martineau, Frank Nuesch, Jacob Heier, Tobias Meyer
  • Publication number: 20240180026
    Abstract: The invention concerns a perovskite composition for a functional layer of an optoelectronic device, comprising an organic precursor of a metal-halide perovskite, an inorganic material, a matrix polymer, and at least one organic solvent. The invention also concerns an optoelectronic device, in which all functional layers may be inkjet-printed, and a method for producing the device.
    Type: Application
    Filed: April 4, 2021
    Publication date: May 30, 2024
    Inventors: Anand VERMA, Tobias MEYER
  • Patent number: 11526367
    Abstract: Systems and methods for translation of a digital document to an equivalent interactive User Interface (UI), receive the digital document containing content; detect a selection and placement of a plurality of form fields, based at least in part on the content; construct a UI template and corresponding object graph, based at least in part on the selection and placement of each of the plurality of form fields; wherein the UI template represents the content of the digital document according to a predefined document schema; and wherein the object graph is defined by one or more dependencies and one or more validations associated with the selection and placement of each of the plurality of form fields; parse the UI template; and render the UI template as an interactive UI for distribution to an end user based at least in part on a predefined rendering library.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: December 13, 2022
    Assignee: Morgan Stanley Services Group Inc.
    Inventors: Arun Nair, Anand Verma, Tushar Agarwal
  • Publication number: 20220374249
    Abstract: Systems and methods for translation of a digital document to an equivalent interactive User Interface (UI), receive the digital document containing content; detect a selection and placement of a plurality of form fields, based at least in part on the content; construct a UI template and corresponding object graph, based at least in part on the selection and placement of each of the plurality of form fields; wherein the UI template represents the content of the digital document according to a predefined document schema; and wherein the object graph is defined by one or more dependencies and one or more validations associated with the selection and placement of each of the plurality of form fields; parse the UI template; and render the UI template as an interactive UI for distribution to an end user based at least in part on a predefined rendering library.
    Type: Application
    Filed: May 21, 2021
    Publication date: November 24, 2022
    Applicant: Morgan Stanley Services Group Inc.
    Inventors: Arun NAIR, Anand Verma, Tushar Agarwal
  • Publication number: 20210225597
    Abstract: The present invention concerns a method for producing layers of an electronic device and to a method for producing electronic devices. The method comprises co-firing a plurality of different overlapping or superposed films comprising metal oxides, precursors of the aforementioned and/or carbon, in addition to organic components. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 22, 2021
    Inventors: Anand Verma, David Martineau, Frank Nuesch, Jacob Heier, Tobias Meyer
  • Publication number: 20210210685
    Abstract: The present invention concerns a method for deposition layers of an electronic device by slot-die deposition. Preferably, the method comprises slot-die deposition of formulation for providing compact inorganic layers, mesoporous inorganic layers, a carbon layer and a layer comprising organic-inorganic perovskite. In a preferred embodiment, the layers of a monolithic perovskite solar cell are entirely deposited by slot-die deposition. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 8, 2021
    Applicants: EMPA EIDGENÖSSISCHE MATERIALPRÜFUNGS- UND FORSCHUNGSANSTALT, SOLARONIX S.A.
    Inventors: Anand VERMA, David MARTINEAU, Frank NÜESCH, Jacob HEIER, Tobias MEYER