Abstract: A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.

Abstract: A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.

Abstract: A non-isolated power supply is configured to receive an input voltage and supply an output voltage, and includes a supply line, a return line, a first semiconductor switch coupled in series in the supply line, and a second semiconductor switch coupled in series in the return line. The first and second semiconductor switches are each configured to operate in an ON state and an OFF state. The differential current sensor is configured to sense differential current between the supply line and the return line. The fault detection logic is coupled to the differential current sensor, the first semiconductor switch, and the second semiconductor switch, and is configured to detect when the differential current exceeds a predetermined current magnitude, and command the first and second semiconductor switches to operate in the OFF state upon detecting that the differential current exceeds the predetermined current magnitude.

Abstract: A non-isolated power supply is configured to receive an input voltage and supply an output voltage, and includes a supply line, a return line, a first semiconductor switch coupled in series in the supply line, and a second semiconductor switch coupled in series in the return line. The first and second semiconductor switches are each configured to operate in an ON state and an OFF state. The differential current sensor is configured to sense differential current between the supply line and the return line. The fault detection logic is coupled to the differential current sensor, the first semiconductor switch, and the second semiconductor switch, and is configured to detect when the differential current exceeds a predetermined current magnitude, and command the first and second semiconductor switches to operate in the OFF state upon detecting that the differential current exceeds the predetermined current magnitude.