Abstract: A method and interface for automated loop checking of an industrial process control and automation system comprises importing wiring diagrams and alarm setpoints to operating software executing on a hand-held device from a database. The operating software uses the wiring diagrams and alarm setpoints to build an I/O loop check file. The method further includes, installing a dongle adapted to simulate I/O signals on a first terminal block. The dongle making an electrical connection to at least one I/O loop. The method further includes transmitting via a communication link the I/O loop check file to the dongle and instructing the dongle to perform an I/O loop test on the at least one I/O loop by simulating I/O signals based on the I/O loop check file. The results of the I/O loop test is transmitted via the communication link the results to the operating software.

Abstract: A method for notifying a sender of an email communication having a link provided therein, to include permission for accessing the link includes receiving an indication of a completion of a formation of an email communication. The method also includes identifying at least one link provided within the email communication. The method further includes sending a notification to the sender that the at least one link is provided within the email communication.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: Recurring events, such as meetings, are often created with a finite number of recurring iterations. The number of iterations is often only a guess and may include superfluous iterations, and in doing so allocate resources that cannot be use for another purpose. In other cases, two few iterations are initially selected, which often go unnoticed until the time for the next, but absent, iteration of the event has occurred. By automatically generating a prompt or automatically creating additional iterations, an event may be created with a number of iterations and a timely prompt provided to determine if the event should be extended and, if so, extending the event.

Abstract: Calls that can be secure (e.g., are conducted with end-to-end encryption) may originate with some or all of the call being unsecured. Then, upon a triggering event such as a user deciding that sensitive information will be discussed or a “sniffer” determining that the call is being monitored by a spoofed endpoint, triggers a transition of the call from an unsecure connection to a secure connection without terminating and reestablishing the call. Accordingly, an unsecure call, such as one utilizing Transmission Control Protocol (TCP) signaling and Real-Time Transport Protocol (RTP) and transitioned to Transport Layer Security (TLS) and Secure RTP (SRTP) to allow a previously unsecured call to become secured with end-to-end encryption.

Abstract: Systems and methods disclosed herein provide intelligent redirection and notification of feature activation. Intelligent redirection includes user configurable rules/conditions for specifying destinations for call redirection. Intelligent redirection may also include notifying the caller of the redirection (including redirection options) and a new destination for the call. Intelligent notification of feature activation includes determining users affected by a feature activation (e.g., target user(s)) and notifying the target user(s) of when the call feature is activated. The intelligent feature notification may also include allowing the target user(s) to accept/reject the activation of the call feature. The intelligent feature notification may further include allowing a user to querying for information related to any call features activated by or on them.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: The technology disclosed herein enables presentation of call identification information based on user presence. In a particular embodiment, a method includes receiving a communication request directed to an endpoint of a user and determining a presence status of the user from a presence system. In response to determining that the presence status indicates the user is not present, the method includes transferring the communication request to the endpoint and preventing the endpoint from presenting call identification information associated with the communication request.

Abstract: The technology disclosed herein enables meeting participants on a meeting invite to be updated across calendar systems. In a particular embodiment, a method includes, in a first calendar system, receiving a notification that a meeting invite for a meeting between a first participant and a second participant is forwarded to a third participant. The first calendar system maintains a first copy of the meeting invite on behalf of the first participant and a second calendar system maintains a second copy of the meeting invite on behalf of the second participant. In response to the notification, the method provides updating the first copy to include the third participant and directing the second calendar system to update the second copy to include the third participant.

Abstract: Systems and methods include receiving, with a processor of a computer system, a request for an out-of-office period from a user of an electronic calendar application; determining, with the processor, based on the request for the out-of-office period, a start time and an end time of the out-of-office period; determining, with the processor, based on the start time and the end time, one or more conflicting events on a calendar associated with the user; generating, with the processor, a set of actions for each conflicting event; receiving, with the processor, a response to the set of actions for each conflicting event; and performing, with the processor, one or more of the actions of the set of actions for each conflicting event based on the response.

Abstract: Systems and methods disclosed herein provide intelligent redirection and notification of feature activation. Intelligent redirection includes user configurable rules/conditions for specifying destinations for call redirection. Intelligent redirection may also include notifying the caller of the redirection (including redirection options) and a new destination for the call. Intelligent notification of feature activation includes determining users affected by a feature activation (e.g., target user(s)) and notifying the target user(s) of when the call feature is activated. The intelligent feature notification may also include allowing the target user(s) to accept/reject the activation of the call feature. The intelligent feature notification may further include allowing a user to querying for information related to any call features activated by or on them.

Abstract: An apparatus is configured to be installed on a terminal block to make an electrical connection to at least one I/O loop. The apparatus includes a terminal section having at least one pair of electrical terminals. The electrical terminals are arranged to be connected to the terminal block and to the I/O loop. The apparatus further includes an electronic section electrically connected to the terminal section adapted to communicate with the I/O loop through the terminal section.

Abstract: A method and interface for automated loop checking of an industrial process control and automation system comprises importing wiring diagrams and alarm setpoints to operating software executing on a hand-held device from a database. The operating software uses the wiring diagrams and alarm setpoints to build an I/O loop check file. The method further includes, installing a dongle adapted to simulate I/O signals on a first terminal block. The dongle making an electrical connection to at least one I/O loop. The method further includes transmitting via a communication link the I/O loop check file to the dongle and instructing the dongle to perform an I/O loop test on the at least one I/O loop by simulating I/O signals based on the I/O loop check file. The results of the I/O loop test is transmitted via the communication link the results to the operating software.

Abstract: A system and method for the automated checking of I/O loops of a process automation system is disclosed that includes a dongle configured to be installed on a terminal block and make an electrical connection to at least one I/O loop. Operating software communicates with the dongle and to a database of I/O loop data. The operating software constructs an I/O loop check file using the database of I/O loop data and downloads the I/O loop check file to the dongle, where the dongle uses the I/O loop check file to test the I/O loop.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: Ceramic boards with thermal expansion similar to that of silicon can be used to support semiconductor chips in a fan out wafer level packaging process. The ceramic board can include sintered ceramic sheets with embedded vias and interconnect lines, together with passive components such as resistors, capacitors and inductors.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.