Abstract: A multilayer glass panel may be cut using a laser cutting technique. In some examples, the technique involves directing a laser beam into to panel to form a separation line. The separation line includes a plurality of spaced-apart defect columns extending at least partially through a first glass substrate but not through a second glass substrate. The plurality of spaced-apart defect columns each include a plurality of spaced-apart filamentation flaws. The example method can also involve separating a portion of the first glass substrate from the second glass substrate along the separation line to thereby configure the multilayer panel with a shelf defined by a portion of the second glass substrate extending outwardly from the separation line.

Abstract: Provided is a laser processing device for processing a workpiece with a processing beam formed by at least a portion of a provided laser radiation, the laser processing device comprising: an analysis device for analyzing a radiation, the radiation being based on the laser radiation; and a control device configured to adjust at least one parameter of the processing beam based on the analysis of the radiation.

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).