Patents by Inventor Anatoly Agulyansky

Anatoly Agulyansky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount chip capacitor
    Patent number: 7179309
    Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.
    Type: Grant
    Filed: November 3, 2005
    Date of Patent: February 20, 2007
    Assignee: Vishay Sprague, Inc.
    Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, Ilia Skatkov
  • Surface mount chip capacitor
    Patent number: 7085127
    Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.
    Type: Grant
    Filed: March 2, 2004
    Date of Patent: August 1, 2006
    Assignee: Vishay Sprague, Inc.
    Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, Ilia Skatkov
  • Surface mount chip capacitor
    Publication number: 20060061939
    Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.
    Type: Application
    Filed: November 3, 2005
    Publication date: March 23, 2006
    Applicant: Vishay Sprague, Inc.
    Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, IIia Skatkov
  • SURFACE MOUNT CHIP CAPACITOR
    Publication number: 20050195558
    Abstract: The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.
    Type: Application
    Filed: March 2, 2004
    Publication date: September 8, 2005
    Applicant: Vishay Sprague, Inc.
    Inventors: Haim Goldberger, Alex Eidelman, Anatoly Agulyansky, IIia Skatkov