Abstract: A process for regeneration of an iron-copper chloride etching solution is disclosed which involves dividing the solution into at least two streams, one of which is supplied into a zone between the cathode and an anode made from a porous material permeable to elemental chlorine, at a rate ensuring laminary movement of the solution along the surface of the electrodes, while another stream is supplied into a zone after the anode at a rate ensuring turbulent movement of the solution along the anode surface. On the cathode the electrochemical reduction of ions of bivalent copper to metallic copper occurs and on the anode oxidation of ions of bivalent iron to ions of trivalent iron occurs, as well as chloride ions to elemental chlorine which diffuses through pores of the anode into the after-anode zone and oxidizes ions of bivalent iron. As a result, evolution of gaseous chlorine from the regenerating system is substantially avoided.