Abstract: A hydrodynamic focusing device comprises first and second flow channels; a wall at least partially defining an envelopment region connected in-line between the first and second flow channels which collectively define a flow direction extending therethrough; and a chimney comprising a body and a sample fluid inlet, extending from the wall and into the envelopment region. The sample fluid inlet faces at least partially perpendicular to the flow direction in the envelopment region, such that the sample fluid inlet is configured to supply a sample fluid into the envelopment region in a direction that is at least partially perpendicular to the flow direction. The body and the sample fluid inlet each have an elongate profile which has a rounded leading edge facing the first flow channel and opposing long edges connecting the leading and trailing edges and tapered towards the trailing edge.

Abstract: The invention describes a foil of polymeric material comprising a plurality of patch portions and a grid portion arranged between said patches. Each patch portion is connected to the grid portion by means of one or more connecting elements. Each patch portion is separated from the grid portion in the X-Y plane by means of a release portion, said release portion having a tensile strength in the X-Y plane which is lower than the tensile strength of both said patch portions and said grid portion, such that—upon exertion of a tensile force between said patch portions and said grid portion—said foil ruptures preferentially at said release portion. The invention relates to a method for the production of cell-capture chips using said foil, and a cell capture chip produced by said method.

Abstract: A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed.

Abstract: The invention describes a foil of polymeric material comprising a plurality of patch portions and a grid portion arranged between said patches. Each patch portion is connected to the grid portion by means of one or more connecting elements. Each patch portion is separated from the grid portion in the X-Y plane by means of a release portion, said release portion having a tensile strength in the X-Y plane which is lower than the tensile strength of both said patch portions and said grid portion, such that—upon exertion of a tensile force between said patch portions and said grid portion—said foil ruptures preferentially at said release portion. The invention relates to a method for the production of cell-capture chips using said foil, and a cell capture chip produced by said method.

Abstract: A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed.

Abstract: A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed.