Patents by Inventor Anders P. Pedersen
Anders P. Pedersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9012782Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.Type: GrantFiled: August 6, 2013Date of Patent: April 21, 2015Assignee: Harris CorporationInventors: Anders P. Pedersen, Daniel A. Robison, Alan W. Mast
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Publication number: 20130319746Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.Type: ApplicationFiled: August 6, 2013Publication date: December 5, 2013Applicant: HARRIS CORPORATIONInventors: ANDERS P. PEDERSEN, DANIEL A. ROBISON, ALAN W. MAST
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Patent number: 8572841Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.Type: GrantFiled: March 19, 2008Date of Patent: November 5, 2013Assignee: Harris CorporationInventors: Anders P. Pedersen, Daniel A. Robison, Alan W. Mast
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Patent number: 8217842Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.Type: GrantFiled: September 22, 2011Date of Patent: July 10, 2012Assignee: Harris CorporationInventors: Anders P. Pedersen, Daniel A. Robison, Alan Mast
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Publication number: 20120030931Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.Type: ApplicationFiled: September 22, 2011Publication date: February 9, 2012Applicant: HARRIS CORPORATIONInventors: Anders P. PEDERSEN, Daniel A. ROBISON, Alan MAST
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Patent number: 8044861Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.Type: GrantFiled: June 30, 2008Date of Patent: October 25, 2011Assignee: Harris CorporationInventors: Anders P. Pedersen, Daniel A. Robison, Alan Mast
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Patent number: 7948766Abstract: A method is for making a structural printed wiring board panel that includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: GrantFiled: July 16, 2009Date of Patent: May 24, 2011Assignee: Harris CorporationInventors: Gregory M. Jandzio, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Patent number: 7907417Abstract: A printed circuit board (PCB) is disclose such that the PCB has enhanced structural integrity. The PCB has opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: GrantFiled: January 17, 2008Date of Patent: March 15, 2011Assignee: Harris CorporationInventors: Gregory M. Jandzio, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Publication number: 20090322620Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.Type: ApplicationFiled: June 30, 2008Publication date: December 31, 2009Applicant: Harris CorporationInventors: Anders P. Pedersen, Daniel A. Robison, Alan Mast
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Publication number: 20090265930Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: ApplicationFiled: July 16, 2009Publication date: October 29, 2009Applicant: HARRIS CORPORATIONInventors: Gregory M. Jandzio, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Publication number: 20090236139Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.Type: ApplicationFiled: March 19, 2008Publication date: September 24, 2009Applicant: Harris CorporationInventors: Anders P. PEDERSEN, Daniel A. ROBISON
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Patent number: 7499287Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: GrantFiled: January 17, 2008Date of Patent: March 3, 2009Assignee: Harris CorporationInventors: Gregory M. Jandzio, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Publication number: 20080245552Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: ApplicationFiled: January 17, 2008Publication date: October 9, 2008Applicant: HARRIS CORPORATIONInventors: Gregory M. JANDZIO, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Patent number: 7342801Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.Type: GrantFiled: April 29, 2004Date of Patent: March 11, 2008Assignee: Harris CorporationInventors: Gregory M. Jandzio, Anders P. Pedersen, Gary A. Rief, Walter M. Whybrew
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Patent number: 6937120Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.Type: GrantFiled: April 2, 2003Date of Patent: August 30, 2005Assignee: Harris CorporationInventors: Charles Robert Fisher, Anders P. Pedersen, Walter M. Whybrew
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Patent number: 6894582Abstract: A microwave device includes a circuit board having a microstrip layer, a ground plane, and a dielectric layer therebetween. The circuit board has a shield receiving slot for longitudinally receiving the end of a shield conductor of a coaxial cable. The coaxial cable also has an inner conductor having an end that extends longitudinally outwardly from the end of the shield conductor. The microstrip layer has an inner conductor contact adjacent the shield receiving slot that connects to the end of the inner conductor. The device may include a conductive layer in the shield receiving slot to connect to the ground plane. The shield receiving slot may have a T shape and extend through the circuit board. The device may include a mounting fixture connecting an end of the shield conductor to the circuit board.Type: GrantFiled: February 7, 2003Date of Patent: May 17, 2005Assignee: Harris CorporationInventors: Walter M. Whybrew, Gregory H. Marquardt, Anders P. Pedersen, Jay D. Warshowsky
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Publication number: 20040196122Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.Type: ApplicationFiled: April 2, 2003Publication date: October 7, 2004Applicant: HARRIS CORPORATIONInventors: Charles Robert Fisher, Anders P. Pedersen, Walter M. Whybrew
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Publication number: 20040155724Abstract: A microwave device includes a circuit board having a microstrip layer, a ground plane, and a dielectric layer therebetween. The circuit board has a shield receiving slot for longitudinally receiving the end of a shield conductor of a coaxial cable. The coaxial cable also has an inner conductor having an end that extends longitudinally outwardly from the end of the shield conductor. The microstrip layer has an inner conductor contact adjacent the shield receiving slot that connects to the end of the inner conductor. The device may include a conductive layer in the shield receiving slot to connect to the ground plane. The shield receiving slot may have a T shape and extend through the circuit board. The device may include a mounting fixture connecting an end of the shield conductor to the circuit board.Type: ApplicationFiled: February 7, 2003Publication date: August 12, 2004Applicant: Harris CorporationInventors: Walter M. Whybrew, Gregory H. Marquardt, Anders P. Pedersen, Jay D. Warshowsky