Abstract: In the invention there is being combined the back cavities of two speakers so that one speaker is used as a general speaker and the other one provides a boosting effect to the general speaker. For example, the other speaker can act as a subwoofer to the general speaker. The back cavity of the speaker is extended by a tubular cavity. The tubular cavity can extend to either the front or back panel of the mobile phone, thereby boosting the other speaker located at the respective panel.

Abstract: The object of the invention is a particular accessory and an arrangement for a mobile phone (5) and its hands-free function, for instance in a car. Thanks to the accessory, such as a cradle (16), the characteristics of the mobile phone (5) are changed, preferably for the hands-free function, due a strip (17) which covers at least one of the at least two sound openings (7A, 7B) of the pressure gradient microphone (7) of the mobile phone. The sound opening can be covered also by a special flange of an accessory connector, or by a separate bridge mounted in the cradle. The covering can also be sealed with a rubber seal, for instance.

Abstract: The invention relates to an arrangement for improving leak tolerance in an earpiece (100) of a radio device. The invention can be applied preferably in mobile stations. One idea of the invention is that an acoustic volume (111) is arranged behind the earpiece by taking advantage of the RF shield casing (112, 116) of a radio frequency unit of the device. By means of the invention one can form behind the earpiece an acoustic volume which loads optimally the earpiece without therefore needing to enlarge the size of the device. In an embodiment of the invention one wall of the casing arranged behind the earpiece has been formed by means of an electronic circuit board (112), to which circuit board radio frequency components (117) of an electronic unit have been connected. Then between the casing and the external volume one can preferably form an acoustic path by means of through holes (113, 114) arranged in the circuit board.