Patents by Inventor Andew Harvey Barr

Andew Harvey Barr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Partially voided anti-pads
    Patent number: 7348498
    Abstract: A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: March 25, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andew Harvey Barr, Dale John Shidla, Robert William Dobbs
  • Alternating voided areas of anti-pads
    Patent number: 7141742
    Abstract: A printed circuit board includes a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board includes a via signal barrel transecting the first and second conductive planes and a first anti-pad positioned between the first conductive plane and the via signal barrel. The first anti-pad has a first voided area. The printed circuit board includes a second anti-pad positioned between the second conductive plane and the via signal barrel. The second anti-pad has a second voided area. The first voided area does not completely overlap the second voided area.
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: November 28, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andew Harvey Barr, Dale John Shidla, Robert William Dobbs