Abstract: In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

Abstract: In an embodiment a sensor arrangement for measuring a temperature includes at least one double-sided printed circuit board, wherein the circuit board has a top side and a bottom side, at least one first solder pad and at least one second solder pad being arranged on the top side and on the bottom side, respectively, at least one sensor device mechanically and electrically connected directly to the top side of the circuit board, and an insulation enveloping at least the sensor device on the top side of the circuit board completely.

Abstract: A sensor including a sensor element and electrical leads, whereby the sensor element is connected to the electrical leads. Further, a housing is provided, whereby the housing has an opening, and the sensor element is arranged in the housing such that the electrical leads protrude from the opening. The housing is filled with epoxy resin and the epoxy resin fixes the sensor element and the electrical leads in the housing.

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening, and a silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing, wherein the silicone resin is a hard silicone material, and wherein the hard silicone material is more rigid than a soft silicone material.

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.

Abstract: In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.

Abstract: A sensor including a sensor element and electrical leads, whereby the sensor element is connected to the electrical leads. Further, a housing is provided, whereby the housing has an opening, and the sensor element is arranged in the housing such that the electrical leads protrude from the opening. The housing is filled with epoxy resin and the epoxy resin fixes the sensor element and the electrical leads in the housing.

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.