Patents by Inventor Ando Welling
Ando Welling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11278959Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: GrantFiled: May 7, 2015Date of Patent: March 22, 2022Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBHInventor: Ando Welling
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Patent number: 11278958Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: GrantFiled: May 7, 2015Date of Patent: March 22, 2022Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBHInventor: Ando Welling
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Patent number: 9550234Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: GrantFiled: May 7, 2015Date of Patent: January 24, 2017Assignee: GIESECKE & DEVRIENT GMBHInventor: Ando Welling
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Patent number: 9542634Abstract: A method for the production of a portable data carrier having an integrated circuit and a contact field galvanically connected to the integrated circuit. In an area defined by the contact field, the portable data carrier is shaped and the contact field is embodied such that a direct contacting of the contact field by a contacting component embodied in accordance with the USB standard is possible. The portable data carrier in its final form is produced in chip card technology. Alternatively, an element is produced in chip card technology, which element features the integrated circuit and the contact filed, and data and/or program code required for the operation of the portable data carrier are loaded into the integrated circuit. Subsequently the element is permanently connected to a carrier.Type: GrantFiled: August 11, 2005Date of Patent: January 10, 2017Assignee: GIESECKE & DEVRIENT GMBHInventors: Andreas Linke, Thomas Tarantino, Ando Welling, Johann Angerer, Kolja Vogel
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Patent number: 9403211Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: GrantFiled: April 19, 2011Date of Patent: August 2, 2016Assignee: GIESECKE & DEVRIENT GmbHInventor: Ando Welling
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Publication number: 20150239044Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventor: Ando WELLING
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Publication number: 20150239047Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventor: Ando WELLING
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Publication number: 20150245496Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventor: Ando WELLING
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Patent number: 9027839Abstract: A portable data carrier (2) and a method for its production, including an apparatus (4) for storing and processing data, an antenna (6) for transmitting energy and information which is connected to the apparatus (4), as well as a plastic surrounding the apparatus (4) and the antenna (6), where the plastic of the portable data carrier is transparent or partially transparent and the antenna (6) has at least one security feature.Type: GrantFiled: August 1, 2007Date of Patent: May 12, 2015Assignee: Giesecke & Devrient GmbHInventors: Franz Sziljer, Albert Ojster, Ando Welling, Peter Huber, Thomas Tarantino
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Publication number: 20130033840Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.Type: ApplicationFiled: April 19, 2011Publication date: February 7, 2013Applicant: GIESECKE & DEVRIENT GmbHInventor: Ando Welling
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Publication number: 20090308935Abstract: The present invention relates to a portable data carrier (2) and a method for its production, consisting of an apparatus (4) for storing and processing data, an antenna (6) for transmitting energy and information which is connected to the apparatus (4), as well as a plastic surrounding the apparatus (4) and the antenna (6), characterized in that the plastic of the portable data carrier is transparent or partially transparent and the antenna (6) has at least one security feature.Type: ApplicationFiled: August 1, 2007Publication date: December 17, 2009Inventors: Franz Sziljer, Albert Ojster, Ando Welling, Peter Huber, Thomas Tarantino
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Publication number: 20070289126Abstract: The invention relates to a method for the production of a portable data carrier (1) having an integrated circuit (10) and a contact field (7) galvanically connected to the integrated circuit (10). In the area of the contact field (7) the portable data carrier (1) is shaped in such a way and the contact field (7) is embodied in such a way that a direct contacting of the contact field (7) by a contacting element embodied in accordance with the USB standard is possible. The portable data carrier (1) in its final form is produced in chip card technology. Alternatively, an element is produced in chip card technology, which element features the integrated circuit (10) and the contact field (7), and data and/or program code required for the operation of the portable data carrier (1) are loaded into the integrated circuit (10). Subsequently the element is permanently connected to a carrier (3).Type: ApplicationFiled: August 11, 2005Publication date: December 20, 2007Inventors: Andreas Linke, Thomas Tarantino, Ando Welling, Johann Angerer, Kolja Vogel
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Patent number: 7207107Abstract: A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.Type: GrantFiled: November 14, 2002Date of Patent: April 24, 2007Assignee: Giesecke & Devrient GmbHInventors: Juergen Usner, Ando Welling
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Patent number: 7154758Abstract: The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).Type: GrantFiled: May 7, 2002Date of Patent: December 26, 2006Assignee: Giesecke & Devrient GmbHInventors: Ando Welling, Matthias Bergmann, Joachim Hoppe
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Patent number: 7000845Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.Type: GrantFiled: May 6, 2002Date of Patent: February 21, 2006Assignee: Giesecke & Devrient GmbHInventors: Ando Welling, Matthias Bergmann, Joachim Hoppe
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Publication number: 20050125997Abstract: A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.Type: ApplicationFiled: November 14, 2002Publication date: June 16, 2005Applicant: Giesecke & Devrient GmbHInventors: Juergen Usner, Ando Welling
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Patent number: 6839963Abstract: A circuit unit having a circuit unit comprising an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layers (9, 17) separated by insulating layers (11). To inter-connect the individual coil layer section (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.Type: GrantFiled: December 9, 1999Date of Patent: January 11, 2005Assignee: Giesecke & Devrient GmbHInventors: Yahya Haghiri-Tehrani, Ando Welling
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Publication number: 20040214364Abstract: The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).Type: ApplicationFiled: June 8, 2004Publication date: October 28, 2004Inventors: Ando Welling, Matthias Bergmann, Joachim Hoppe
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Publication number: 20040206829Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.Type: ApplicationFiled: June 8, 2004Publication date: October 21, 2004Inventors: Ando Welling, Matthias Bergmann, Joachim Hoppe
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Patent number: 6283378Abstract: The invention relates to a data carrier (1) having an integrated circuit (7) and at least one insulating supporting substrate (10) on which a transfer element (2) for transferring data to an external device is disposed. The integrated circuit (7) can alternatively be mounted in the data carrier (1) directly or packed in an electronic module (4). For establishing an electric connection between the integrated circuit (7) or electronic module (4) and the transfer element (2), the data carrier (1) has electroconductive surfaces (3, 17) opposite the two main faces of the electronic module (4) or integrated circuit (7). The electroconductive surfaces (3, 17) are connected with the opposing contact surfaces (5) of the electronic module (4) or the contacts (8) of the integrated circuit (7) and connected in pairs with the electroconductive surfaces (3, 17) disposed on the other side of the electronic module (4) or integrated circuit (7).Type: GrantFiled: May 5, 2000Date of Patent: September 4, 2001Assignee: Giesecke & Dervrient GmbHInventor: Ando Welling