Abstract: A method of forming a display article includes dispensing a material onto a first substrate, and pre-curing the material to form a dam. The method includes depositing a liquid optically clear adhesive in a first pattern onto the first substrate such that the first pattern is spaced apart from the dam to form a coated first substrate. The method includes depositing the adhesive in a second pattern onto a second substrate to form a coated second substrate, and flipping the coated second substrate upside down. The method includes translating the coated first and second substrates towards one another to eliminate an air gap, contacting the first pattern and the second pattern at a plurality of single points, and compressing the first pattern and the second pattern to eliminate the air gap and air entrained between the coated first and second substrates.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: This invention shows a system and method for phenotype characterization of agricultural crops, comprising at least one support device which can be reconfigured in an autonomous or controlled remote manner. It includes a central embedded microcontroller connected to atmospheric sensors located in the upper body, a microcontroller connected to a multi-spectral camera located at the distal end of the arm. The central microcontroller is connected to a base microcontroller that receives signals from soil sensors. A solar panel provides the energy source to a regulating unit that powers the microcontrollers. The system contains a communication unit that includes a router wirelessly connected to Internet.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: A PN-junction temperature sensing apparatus for applying input signals to a semiconductor device and measuring temperature-dependent output signals has an odd number of current sources (1, 2, n) switches (5, 6, 7) with selectable outputs to connect the current sources (5, 6, 7) with a thermal sensor (12) or a sink diode (13) and an A/D converter (17) to digitize the measured voltage of the thermal sensor (12). A digital processor (18) controls the switches (5, 6, 7) and stores the digitized voltage values in a memory. Provided algorithms allow the usage of these values to provide a calibrated measurement of temperature and also sensor life estimation.

Abstract: An accelerated B-Stage curing process for thermosetting resins and an FBGA assembly process utilizing the accelerated B-Stage curing process in the manufacture of semiconductor devices are disclosed. In an accelerated B-Stage curing process for thermosetting resins, the thermosetting resin is subjected to a heat treatment procedure which is characterized by a predefined treatment temperature and a predefined treatment time, the treatment time comprising a treatment ramp-up time for ramping up resin temperature from current temperature to treatment temperature and a treatment dwell time for holding treatment temperature, the treatment temperature being in the range of over 130 to 190° C., preferably in the range of 150 to 170° C., most preferred in the range of 155 to 165° C. Experience shows that it is beneficial to select the treatment ramp-up time from the range of 1 to 20 min, preferably from the range of 5 to 15 min and most preferred from the range of 6 to 10 min.

Abstract: A PN-junction temperature sensing apparatus for applying input signals to a semiconductor device and measuring temperature-dependent output signals has an odd number of current sources (1, 2, n) switches (5, 6, 7) with selectable outputs to connect the current sources (5, 6, 7) with a thermal sensor (12) or a sink diode (13) and an A/D converter (17) to digitize the measured voltage of the thermal sensor (12). A digital processor (18) controls the switches (5, 6, 7) and stores the digitized voltage values in a memory. Provided algorithms allow the usage of these values to provide a calibrated measurement of temperature and also sensor life estimation.

Abstract: A method for determining an endpoint for an oxygen free plasma stripping process for use in semiconductor wafer processing. The method comprises exciting a gas composition containing a nitrogen gas and a reactive gas to form the oxygen free plasma. The oxygen free plasma reacts with a substrate having a photoresist and/or residues thereon to produce emitted light signals corresponding to an oxygen free reaction product. The endpoint is determined by optically measuring a primary emission signal of the oxygen free reaction product at a wavelength of about 387 nm. The endpoint is determined when the plasma no longer reacts with the photoresist and/or residues on the substrate to produce the emitted light at about 387 nm, an indication that the photoresist and/or residues have been removed from the wafer. Secondary emission signals of the oxygen free reaction product at about 358 nm and 431 nm can also be monitored for determining the endpoint.

Abstract: A temperature probe for use in low pressure processes having an improved thermal response wherein fluid is supplied to a fluid transport passageway in the probe head for creating an increased pressure between the probe head and a semiconductor wafer for increasing the thermal conductivity therebetween.

Abstract: A radiant heating apparatus for reducing the cumulative temperature gradient over a semiconductor workpiece during a low temperature process is comprised of a plurality of reflecting units, wherein each reflecting unit is comprised of a back reflector, a tubular reflector extending from the back reflector towards the workpiece, and a radiant energy source disposed in the tubular reflector in front of the back reflector, wherein a cross section of the tubular reflector is in the shape of a truncated segment of a circle.