Abstract: A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.

Abstract: A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.

Abstract: The invention relates to a composition for electrolytic nickel plating. In order to provide an improved composition, it is proposed that it comprises one or a plurality of nickel ion sources and a mono-, di- or tri-hydroxybenzene compound, preferably a hydroquinone compound or the salts thereof or mixtures thereof.

Abstract: The invention relates to a composition for electrolytic nickel plating. In order to provide an improved composition, it is proposed that it comprises one or a plurality of nickel ion sources and a mono-, di- or tri-hydroxybenzene compound, preferably a hydroquinone compound or the salts thereof or mixtures thereof.

Abstract: The invention relates to a method for producing a nickel-phosphorus alloy in which a metallic substrate is dipped into an aqueous electrolyte containing at least nickel cations, hypophosphite ions, stabilisers and complexing agents, characterised in that the electrolyte additionally contains pyrones of formula I or the derivatives or salts thereof, wherein R1 represents a hydrogen atom or a hydroxyl group, R2 a methyl group, an ethyl group or a hydroxymethyl group, R3 a hydrogen atom or a hydroxyl group, and R4 a hydrogen atom, a hydroxyl group or a methyl ketone group, and to a corresponding electrolyte.

Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.

Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition.

Abstract: The invention relates to a method of preparing facial metal tricarbonyl compounds and further coordinated facial metal tricarbonyl compounds in water or an aqueous medium. The invention further relates to the use of said facial metal tricarbonyl compounds in the labelling of biologically active substrates and other ligands, and to a kit for preparing a facial metal tricarbonyl compound or further coordinated facial metal tricarbonyl compounds.