Patents by Inventor Andrés CIFUENTES

Andrés CIFUENTES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Extrudable photocrosslinkable hydrogel and method for its preparation
    Patent number: 11918703
    Abstract: The present invention relates to an extrudable photocrosslinkable hydrogel comprising a biochemically modified extracellular matrix (ECM) with an electroconductive nanomaterial embedded; a photoinitiator and a solvent, the method for its preparation starting from decellularized extracellular matrices (dECMs) and its applications for preparing electroconductive scaffolds, electroconductive extrudable hydrogels for in situ defect-filling, conductive grafts, in situ or in vitro printed tissues or organs, adhesives for different tissues, or bone adhesives.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 5, 2024
    Assignee: Universidad de los Andes
    Inventors: Carolina Muñoz Camargo, Juan Carlos Cruz Jiménez, Julián Andrés Serna Méndez, Laura Rueda Gensini, Javier Felipe Cifuentes Rueda, Daniela Natalia Céspedes Valenzuela
  • Miniaturized OCT package and assembly thereof
    Patent number: 9976844
    Abstract: A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: May 22, 2018
    Assignee: Medlumics S.L.
    Inventors: Juan Lloret Soler, Juan Sancho Durá, José Luis Rubio Guivernau, Eduardo Margallo Balbás, William Kennedy Landles, Andrés Cifuentes, Blair Ungar, Kirill Zinoviev
  • MINIATURIZED OCT PACKAGE AND ASSEMBLY THEREOF
    Publication number: 20160238371
    Abstract: A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
    Type: Application
    Filed: February 3, 2016
    Publication date: August 18, 2016
    Inventors: Juan LLORET SOLER, Juan SANCHO DURÁ, José Luis RUBIO GUIVERNAU, Eduardo MARGALLO BALBÁS, William Kennedy LANDLES, Andrés CIFUENTES, Blair UNGAR, Kirill ZINOVIEV