Patents by Inventor Andre Berger

Andre Berger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230390485
    Abstract: Provided herein are methods and systems for use with peristaltic pumps. More particularly, provided herein are peristaltic pump systems that include a dampener for reducing the pulsations of the flowrate from the peristaltic pump system to produce, mix, transfer and/or manufacture pharmaceutical compositions and formulations, including pharmaceutical compositions and formulations comprising lipids and RNA.
    Type: Application
    Filed: March 7, 2023
    Publication date: December 7, 2023
    Inventors: Robert Daniel OVADIA, Christopher Andrew Petry, Fredric John Lim, Heinrich Haas, Sebastian Hoerner, Ferdia Bates, Tobias Kind, Peer Andre Berger
  • Patent number: 11539151
    Abstract: A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: December 27, 2022
    Inventors: Christian Arnold, Tobias Kässer, Michael Franz, Tobias Janocha, Andre Berger, Ralf Kröner, Ulrich Mahr, Benjamin Falk
  • Publication number: 20200412036
    Abstract: A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 31, 2020
    Applicant: Tesat-Spacecom GmbH & Co. KG
    Inventors: Christian Arnold, Tobias Kässer, Michael Franz, Tobias Janocha, Andre Berger, Ralf Kröner, Ulrich Mahr, Benjamin Falk