Abstract: A supply line guide for guiding a plurality of supply lines in a vacuum chamber of a processing system is described. The supply line guide includes a guiding arrangement including a plurality of connected elements, wherein the connected elements are angle-adjustable relative to each other. Further, the supply line guide includes a flexible tube provided around the guiding arrangement.

Abstract: A carrier for supporting at least one substrate during a sputter deposition process is provided. The carrier includes a carrier body and an insulating portion provided at the carrier body. The insulating portion provides a surface of an electrically insulating material, wherein the surface is configured to face one or more sputter deposition sources during the sputter deposition process.

Abstract: A carrier for carrying a substrate in a deposition chamber is described. The carrier includes a frame for vertically holding the substrate, wherein the frame has a substantially rectangular shape with a bottom frame part; a fixing means for firmly fixing the substrate to the carrier, wherein the fixing means is located in a center region of the bottom frame part; and one or more support members for supporting but not firmly fixing the substrate. Further, a method for carrying a substrate during deposition is described.

Abstract: Carriers for substrates and to methods for assembling the same in the field of vacuum deposition of thin films. In particular, a carrier for a substrate to be coated in a vacuum chamber includes a first frame comprising two vertical sections and two horizontal sections being dimensioned to surround the substrate; a second dimensioned to define an area of the substrate to be coated, and to cover at least a first part of the first frame to prevent the first part of the first frame from being coated when the second frame is mounted to the first frame. The second frame is detachably mounted to the first frame.