Abstract: A modular substrate processing system is provided for processing a flexible substrate. The system includes at least two process modules arranged adjacent to each other in a horizontal direction. The process modules include gas cushion rollers adapted for contactless guiding of the flexible substrate and for diverting the flexible substrate in vertical directions.

Abstract: A plasma deposition source for transferring a deposition gas into a plasma phase and for depositing, from the plasma phase, a thin film onto a substrate moving in a substrate transport direction in a vacuum chamber is described. The plasma deposition source includes a multi-region electrode device adapted to be positioned in the vacuum chamber and including at least one RF electrode arranged opposite to the moving substrate, and an RF power generator adapted for supplying RF power to the RF electrode. The RF electrode has at least one gas inlet arranged at one edge of the RF electrode and at least one gas outlet arranged at the opposed edge of the RF electrode. A normalized plasma volume is provided by a plasma volume defined between an electrode surface and an opposite substrate position, divided by an electrode length. The normalized plasma volume is tuned to a depletion length of the deposition gas.

Abstract: According to embodiments described herein, a guiding device for contactless guiding of a web in a web coating process under vacuum conditions is provided. The guiding device includes a curved surface for facing the web and a group of gas outlets disposed in the curved surface and adapted for giving off a gas flow to form a hover cushion between the curved surface and the web. The guiding device further includes a gas distribution system for selectively providing the gas flow to a first subgroup of the gas outlets and for preventing the gas from flowing to a second subgroup of the gas outlets.

Abstract: A system for thin film deposition on a flexible substrate having at least a first deposition region is described. The system includes a first chamber being based on a platform, wherein the first deposition region is within the first chamber, wherein the first chamber has a first support member configuration configured for supporting at least two different substrate guiding systems and wherein one substrate guiding system is supported by the first support member configuration, and wherein the platform is configured for at least two different deposition units and wherein one deposition unit of the at least two different deposition units is enclosed by the first chamber.

Abstract: The invention relates to an arrangement for working substrates by means of plasma (PECVD), wherein at least two electrodes are provided which are located in a common plane and are spaced apart from one another. Between the particular electrodes are provided interspaces which serve as gas inlets or gas outlets.