Patents by Inventor Andre Martinez

Andre Martinez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190321476
    Abstract: Provided are pharmaceutical agent carriers (e.g., multifunctional polyphosphazenes). Such polymers can be useful as delivery carriers for pharmaceutical agents. Specifically they can be useful for prolonging serum half-life, reducing immunogenicity, and facilitating intracellular and cytosolic delivery of pharmaceutical agents. Also provided are compositions comprising pharmaceutical agent carriers and methods of delivering pharmaceutical agents using the compositions.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 24, 2019
    Inventors: Alexander K. ANDRIANOV, Alexander MARIN, Thomas R. FUERST, Andre MARTINEZ
  • Publication number: 20180311175
    Abstract: Provided are pharmaceutical agent carriers (e.g., multifunctional polyphosphazenes). Such polymers can be useful as delivery carriers for pharmaceutical agents. Specifically they can be useful for prolonging serum half-life, reducing immunogenicity, and facilitating intracellular and cytosolic delivery of pharmaceutical agents. Also provided are compositions comprising pharmaceutical agent carriers and methods of delivering pharmaceutical agents using the compositions.
    Type: Application
    Filed: October 28, 2016
    Publication date: November 1, 2018
    Inventors: Alexander K. ANDRIANOV, Alexander MARIN, Thomas R. FUERST, Andre MARTINEZ
  • Patent number: 4990464
    Abstract: An improved technique for forming silicon-on insulator films for use in integrated circuits. The technique provides an improved encapsulation layer to enable in a reproducible way the zone melt recrystallization of such films. The encapsulation layer consists of a first layer of a doped SiO.sub.2 (silicate glass) on which a further layer of Si.sub.3 N.sub.4 is deposited. The doped SiO.sub.2 forms a fusible glassy material which is rendered semi-liquid and flows at the temperatures used in recrystallization. The softening of the encapsulation material accommodates volume expansion and eliminates the biaxial stresses in the layered structure. The Si.sub.3 N.sub.4 layer adds mechanical strength to the SiO.sub.2 layer and improves the wetting angle.
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: February 5, 1991
    Assignee: North American Philips Corp.
    Inventors: Helmut Baumgart, Andre Martinez