Abstract: The invention refers to a photopolymerizable precursor of a pressure-sensitive thermosettable adhesive, said precursor comprising: (i) from about 30% to about 80% by weight with respect to the mass of the precursor of a photopolymerizable component, comprising a monomeric or prepolymeric syrup, said component exhibiting an overall solubility parameter of between 10 and 11 and comprising (A) at least 30% by weight with respect to the mass of the photopolymerizable component (i) of one or more ethylenically unsaturated monomers with a solubility parameter of between 10 and 11.5 and less than 10% by weight with respect to the mass of component (i) of one or more ethylenically unsaturated compounds with a solubility parameter of more than 11.5, or (B) at least 50% by weight with respect to the mass of the photopolymerizable compound (i) of one or more ethylenically unsaturated monomers with a solubility parameter of between 9.5 and 11.