Publication number: 20240297119
Abstract: An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.
Type:
Application
Filed:
December 22, 2021
Publication date:
September 5, 2024
Inventors:
Srikant Nekkanty, Karumbu Meyyappan, Andres Ramirez Macias, Zhe Chen, Jeffory L. Smalley, Zhichao Zhang, Steven A. Klein, Eric Erike