Patents by Inventor Andre Robinson

Andre Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12027925
    Abstract: A method of making an electromagnetic coil for use in a high-temperature electromagnetic machine includes pre-coating magnet wire with a high-temperature insulation precursor to produce pre-coated magnet wire, winding, while applying in-situ a glass-ceramic slurry, the pre-coated magnet wire into a predetermined coil shape to produce a wet-wound green coil, and thermally processing the wet-wound green coil to produce a processed coil. In some instances, a second layer of a high-temperature insulation may be applied to the processed coil to produce a further insulated processed coil, and then thermally processing the further insulated processed coil to produce a further processed electromagnetic coil.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: July 2, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Mahdi Mohajeri, Eric Passman, Bahram Jadidian, James Piascik, Robert Dietrich, Andre Robinson, Jimmy Wiggins, Tom McHugh, Yongbae Jung
  • Publication number: 20240072621
    Abstract: A method of making an electromagnetic coil for use in a high-temperature electromagnetic machine includes pre-coating magnet wire with a high-temperature insulation precursor to produce pre-coated magnet wire, winding, while applying in-situ a glass-ceramic slurry, the pre-coated magnet wire into a predetermined coil shape to produce a wet-wound green coil, and thermally processing the wet-wound green coil to produce a processed coil. In some instances, a second layer of a high-temperature insulation may be applied to the processed coil to produce a further insulated processed coil, and then thermally processing the further insulated processed coil to produce a further processed electromagnetic coil.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Mahdi Mohajeri, Eric Passman, Bahram Jadidian, James Piascik, Robert Dietrich, Andre Robinson, Jimmy Wiggins, Tom McHugh, Yongbae Jung
  • Publication number: 20230105957
    Abstract: A method for determining a health indication of a mechanical component includes: receiving, by a processor of a multi-sensor node device having a plurality of sensors, a configuration defining activation of the plurality of sensors based on a type of mechanical component to which the multi-sensor node device is coupled and based on a level of energy harvesting available at the multi-sensor node device; determining to activate a first sensor based on the received configuration; collecting data from the first sensor relating to a first parameter of the mechanical component; determining to activate a second sensor based on determining that the data collected from the first sensor indicates a threshold is exceeded; collecting data from the second sensor relating to a second parameter of the mechanical component; determining an initial health indication of the mechanical component; and transmitting the determined initial health indication to a remote computing system.
    Type: Application
    Filed: April 14, 2022
    Publication date: April 6, 2023
    Applicant: Honeywell International Inc.
    Inventors: Andre ROBINSON, Balasubramanya RAJU BK, Manu SHASTRY CR, Raghavendra MUNIRAJU, Raviprakash THOTADAKUMBRI VENKATARAO
  • Publication number: 20060024575
    Abstract: A sealed battery pack is provided that prevents liquid, dust and gas from compromising the reliability of the rechargeable cell and circuitry disposed within the pack. A rechargeable cell and printed circuit board are coupled together and are placed into a five sided housing. In one embodiment, one of the sides is longer that the others to accommodate electrical contacts for coupling to a host device. Once the cell/board assembly is positioned in the housing, plastic is drawn through the housing using an insert molding process to seal and encapsulate the cell and board within the housing. The seal provided by the insert molding process ensures that liquid, gas and dust do not penetrate the pack.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 2, 2006
    Inventors: Andre Robinson, Due Huynh, James Robinson