Patents by Inventor Andreás Hilliger

Andreás Hilliger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing stress in integrated circuits
    Patent number: 6815234
    Abstract: A semiconductor chip in which stress on the effective stress on the substrate is reduced in order to reduce bowing. To reduce the effective stress, a stress compensation layer is provided on the backside of the chip. The stress compensating layer produces a stress opposite of that produced by the IC. Thus the overall or effective stress on the substrate is reduced.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: November 9, 2004
    Assignee: Infineon Technologies Aktiengesellschaft
    Inventors: Uwe Wellhausen, Stefan Gernhardt, Rainer Bruchhaus, Andreás Hilliger, Jing Yu Lian, Nicolas Nagel