Abstract: An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate towards a periphery of the support. Also included is a protective and sealing casing attached to the support and hermetically sealed with respect to the latter by a peripheral metal bead. A main part of the casing is intended to be placed opposite the support which is provided with hollow conducting elements passing through the thickness of the casing. Electrically conducting metal tracks radiate from external upper ends of the elements towards the periphery of the casing and the internal lower end of the elements are connected to at least one electrical connection track provided on the support via a metal hybridization ball.

Abstract: This electrical or electronic component with sealed encapsulation comprises:

Abstract: This electrical or electronic component with sealed encapsulation comprises: a support (1) intended to house one or more electrical or electronic components (5) from which electrically conducting tracks (6) radiate towards the periphery of the said support; and a protective and sealing casing (2) attached to the said support and hermetically sealed with respect to the latter by means of a peripheral metal bead (7), the main part of the casing, intended to be placed opposite the said support (1), being provided with hollow conducting elements (3) which pass right through the thickness of the said casing, and from the external upper end of which elements (3) electrically conducting metal tracks (9) radiate towards the periphery of the casing, the internal lower end of which elements (3) being connected to at least one electrical connection track (6) provided on the said support via a metal hybridization ball (8).

Abstract: The device includes at least two diode arrays which contain some diodes which are defective. The defective diodes are compensated in that the respective diodes of the two arrays are aligned in pairs along the scanning direction, with each of the pairs containing at least one good diode. The device also comprises a programmed memory for controlling two switches and for accomplishing a winding or serpentine readout of the arrays. The device is well adapted for landscape scanning.

Abstract: A semiconductor device comprises a substrate made of an alloy having the formula Cd.sub.x Hg.sub.1-x Te where x is a non-zero number less than 1. The substrate has P type conductivity and a doping agent such as mercury is diffused into the substrate to form a region of N type conductivity therein. Before diffusion of the mercury into the substrate, a protective layer of cadmium telluride CdTe is applied to the surface of the substrate and the doping agent is diffused into the substrate through the protective layer. The device finds application as a photovoltaic detector of infrared radiation.