Abstract: An electrically insulating substrate has an array of holes formed in it for accepting electrically conducting support pins, each pin having a light-emitting element mounted on the upper pin end. Each upper pin end is surrounded by an insulating ring and a conducting ring, the light emitting element being connected electrically between the conducting pin and the conducting ring. Electrical connections are made via a printed wiring pattern on each surface of the substrate. Optical collimating elements are formed in a wafer having openings that surround each of the conducting rings with a small clearance, the wafer engaging and being insulated from the substrate with the printed wiring.

Abstract: A photocoupler is disclosed comprising a pair of coplanar elements spaced from each other so as to define an opening therebetween, a light emitter secured to one of the elements and a light receiver disposed opposite the light emitter and secured to the other element. The light from the light emitter is transmitted to the receiver by an optical element, such as a lens, having a central projection which extends into the opening between the two elements and accurately positions the optical element with respect to the light emitter and receiver for optimum light transmission therebetween.