Patents by Inventor Andre Uhlemann

Andre Uhlemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module with directly attached thermally conductive structures
    Patent number: 8872332
    Abstract: A power module includes a substrate having an electrically insulative member with opposing first and second metallized sides and one or more semiconductor die attached to the first metallized side of the substrate. A plurality of thermally conductive structures are laterally spaced apart from one another and individually attached directly to the second metallized side of the substrate so that the plurality of thermally conductive structures extend outward from the second metallized side.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: October 28, 2014
    Assignee: Infineon Technologies AG
    Inventors: Andre Uhlemann, Alexander Herbrandt, Frank Broermann
  • Power Module with Directly Attached Thermally Conductive Structures
    Publication number: 20130285234
    Abstract: A power module includes a substrate having an electrically insulative member with opposing first and second metallized sides and one or more semiconductor die attached to the first metallized side of the substrate. A plurality of thermally conductive structures are laterally spaced apart from one another and individually attached directly to the second metallized side of the substrate so that the plurality of thermally conductive structures extend outward from the second metallized side.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Andre Uhlemann, Alexander Herbrandt, Frank Broermann
  • Semiconductor device including cladded base plate
    Patent number: 8519532
    Abstract: A semiconductor device includes a semiconductor chip coupled to a substrate and a base plate coupled to the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: August 27, 2013
    Assignee: Infineon Technologies AG
    Inventors: Andreas Lenniger, Andre Uhlemann, Olaf Hohlfeld
  • SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
    Publication number: 20130062750
    Abstract: A semiconductor device includes a semiconductor chip coupled to a substrate and a base plate coupled to the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 14, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Lenniger, Andre Uhlemann, Olaf Hohlfeld