Abstract: The various embodiments described herein include methods, devices, and systems for fabricating and operating diodes. In one aspect, an electrical circuit includes: (1) a diode component having a particular energy band gap; (2) an electrical source electrically coupled to the diode component and configured to bias the diode component in a particular state; and (3) a heating component thermally coupled to a junction of the diode component and configured to selectively supply heat corresponding to the particular energy band gap.

Abstract: A method and apparatus related to developing electromagnetic emission and power models for a target device using photonic emissions thereof are provided. Data of photonic emissions of a target device during a first period of time with the target device in one or more modes is recorded. Data of electromagnetic emissions of the target device during the first period of time with the target device in the one or more modes is also recorded. The recorded data of the photonic emissions and the recorded data of the electromagnetic emissions are correlated to establish one or more electromagnetic emission models for the target device. The one or more electromagnetic emission models enable predictive analysis of emissions by the target device.

Abstract: The various embodiments described herein include methods, devices, and systems for fabricating and operating diodes. In one aspect, an electrical circuit includes: (1) a diode component having a particular energy band gap; (2) an electrical source electrically coupled to the diode component and configured to bias the diode component in a particular state; and (3) a heating component thermally coupled to a junction of the diode component and configured to selectively supply heat corresponding to the particular energy band gap.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: The various embodiments described herein include methods for testing low temperature components. In some embodiments, a cryogenic testing system includes: (1) a cryostat chamber configured to maintain a sample at temperatures below a threshold temperature, where the sample includes a two-dimensional array of components to be tested, the two-dimensional array comprising a first number (n) of columns and a second number (m) of rows; (2) a probe card including: (a) a set of n column connectors configured to couple to respective columns of the two-dimensional array; and (b) a set of m row connectors configured to couple to respective rows of the two-dimensional array; and (3) a cryogenic connector for communicatively coupling the probe card to a processing unit outside of the cryostat chamber.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: A method and apparatus related to developing electromagnetic emission and power models for a target device using photonic emissions thereof are provided. Data of photonic emissions of a target device during a first period of time with the target device in one or more modes is recorded. Data of electromagnetic emissions of the target device during the first period of time with the target device in the one or more modes is also recorded. The recorded data of the photonic emissions and the recorded data of the electromagnetic emissions are correlated to establish one or more electromagnetic emission models for the target device. The one or more electromagnetic emission models enable predictive analysis of emissions by the target device.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: A method and apparatus related to developing electromagnetic emission and power models for a target device using photonic emissions thereof are provided. Data of photonic emissions of a target device during a first period of time with the target device in one or more modes is recorded. Data of electromagnetic emissions of the target device during the first period of time with the target device in the one or more modes is also recorded. The recorded data of the photonic emissions and the recorded data of the electromagnetic emissions are correlated to establish one or more electromagnetic emission models for the target device. The one or more electromagnetic emission models enable predictive analysis of emissions by the target device.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: A computer-implemented device and method for identifying hardware Trojans and defects based on light emissions from Integrated Circuits (ICs) is provided. A measured emissions map is received based on light emissions captured from a sacrificial test IC. The sacrificial test IC is a partially manufactured IC fabricated to include a set of frontend layers of an IC architecture but not a set of backend layers of the IC architecture. The sacrificial test IC also includes a sacrificial layer for powering devices in the partially manufactured IC without the set of backend layers. An expected emissions map is derived from the sacrificial test IC and the measured emissions map is compared with the expected emissions map to identify deviations from the IC architecture in the frontend layers.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: Techniques facilitating integrated circuit identification and reverse engineering are provided. A computer-implemented method can comprise identifying, by a system operatively coupled to a processor, an element within a first elementary cell of one or more elementary cells of an integrated circuit. The method can also comprise matching, by the system, the element with respective elements across the one or more elementary cells including the first elementary cell. The respective elements can be replicas of the element. Further, matching the element with respective elements can be based on a layout analysis of the integrated circuit.

Abstract: A computer-implemented device and method for identifying hardware Trojans and defects based on light emissions from Integrated Circuits (ICs) is provided. A measured emissions map is received based on light emissions captured from a sacrificial test IC. The sacrificial test IC is a partially manufactured IC fabricated to include a set of frontend layers of an IC architecture but not a set of backend layers of the IC architecture. The sacrificial test IC also includes a sacrificial layer for powering devices in the partially manufactured IC without the set of backend layers. An expected emissions map is derived from the sacrificial test IC and the measured emissions map is compared with the expected emissions map to identify deviations from the IC architecture in the frontend layers.

Abstract: A method and apparatus related to developing electromagnetic emission and power models for a target device using photonic emissions thereof are provided. Data of photonic emissions of a target device during a first period of time with the target device in one or more modes is recorded. Data of electromagnetic emissions of the target device during the first period of time with the target device in the one or more modes is also recorded. The recorded data of the photonic emissions and the recorded data of the electromagnetic emissions are correlated to establish one or more electromagnetic emission models for the target device. The one or more electromagnetic emission models enable predictive analysis of emissions by the target device.