Abstract: A refrigerator includes a rear assembly panel coupled with an assembly cover panel that includes at least one vent. At least one circulation fan is positioned between the rear assembly panel and the assembly cover panel and is proximate the at least one vent. A filter is positioned between the rear assembly panel and the assembly cover panel and is coupled to a photocatalyst to form an activated carbon filter. A light-emitting diode (LED) panel assembly includes a plurality of LEDs positioned on the rear assembly panel and is positioned to project light on the activated carbon filter. An air circulation path extends through the at least one vent and the activated carbon filter and is configured to direct air along the air circulation path, and the activated carbon filter is configured to filter airborne bacteria and particulate matter from the air as the air passes through the activated carbon filter.

Abstract: A refrigerator includes a rear assembly panel coupled with an assembly cover panel that includes at least one vent. At least one circulation fan is positioned between the rear assembly panel and the assembly cover panel and is proximate the at least one vent. A filter is positioned between the rear assembly panel and the assembly cover panel and is coupled to a photocatalyst to form an activated carbon filter. A light-emitting diode (LED) panel assembly includes a plurality of LEDs positioned on the rear assembly panel and is positioned to project light on the activated carbon filter. An air circulation path extends through the at least one vent and the activated carbon filter and is configured to direct air along the air circulation path, and the activated carbon filter is configured to filter airborne bacteria and particulate matter from the air as the air passes through the activated carbon filter.

Abstract: A refrigerator includes a cabinet coupled to one or more doors forming a storage compartment. The refrigerator additionally includes a first fan assembly positioned on an interior surface of a first cabinet wall, and a second fan assembly positioned on the interior surface of a second cabinet wall. The first and second fan assemblies each include: two or more circulation fans; a filter coupled to a photocatalyst to form an activated filter; and a plurality of UV LEDs positioned to project light on the activated filter. An air circulation path is configured to direct air born bacteria and particulate matter within the storage compartment contemporaneously into the first and second fan assemblies using the two or more circulation fans and circulate filtered air into the storage compartment through the activated filter disposed in the air circulation path.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A process for cleaning an integrated circuit package surface, comprising the steps of introducing the integrated circuit inside a plasma chamber; and of exposing the integrated circuit to a physical plasma obtained starting from a gas consisting of pure argon or any other noble gas having, in the plasma state, the behavior of a halogen, for example helium. The argon pla sma is obtained using the following energization parameters: energization time, 12-13 seconds; energization power, 140-160 W; plasma chamber pressure, 190-210 millitorr; and energization frequency, between 1 kHz and 100 GHz.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters.

Abstract: A process for manufacturing semiconductor packages comprising, respectively, a substrate, a chip which forms an integrated circuit and is attached to one region of the substrate, electrical connection means connecting the chip to a group of external electrical connection regions lying on one face of the substrate, as well as an encapsulation encasement. The process consists in producing, in a matrix configuration, a multiplicity of groups of connection regions (104a) on a common substrate plate (102), corresponding to as many chip attachment regions (109), in attaching a chip (103) to each attachment region (109) of the common substrate plate, in electrically connecting each chip (103) to the associated electrical connection regions (104a), so as to obtain an assembly (111) consisting of the substrate plate and the connected chips.