Abstract: In a method for producing a microstructure component, which is used in particular as an x-ray phase contrast grating in an x-ray device, a material absorbing x-rays is poured into a mold able at least to be deformed about one bending axis, which is formed by a silicon substrate and which has a plurality of cutouts running in a direction of the thickness of the silicon substrate with dimensions in the micrometer range. The mold into which the material is poured is heated up to a working temperature value lying above the room temperature and below a melting temperature value of the material which is poured into it and is formed into a final contour as per specifications.

Abstract: A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.

Abstract: A method for producing a microstructure component, a microstructure component and an x-ray device are disclosed. In the method, a plurality of punctiform injection structures are inserted in a grid in a first substrate direction and a second substrate direction, standing at right angles thereto, into a first surface of a wafer-like silicon substrate. The injection structures are lengthened into drilled holes in the depth direction of the silicon substrate in a first etching step. A second surface of the silicon substrate is then at least partly removed for rear-side opening of the drilled holes in a second etching step and in a third etching step, an etching medium acting anisotropically is poured alternately through the drilled holes from both surfaces of the silicon substrate, so that drilled holes arranged next to one another in the first substrate direction connect to form a column running in the first substrate direction.

Abstract: In a method for producing a microstructure component, which is used in particular as an x-ray phase contrast grating in an x-ray device, a material absorbing x-rays is poured into a mold able at least to be deformed about one bending axis, which is formed by a silicon substrate and which has a plurality of cutouts running in a direction of the thickness of the silicon substrate with dimensions in the micrometer range. The mold into which the material is poured is heated up to a working temperature value lying above the room temperature and below a melting temperature value of the material which is poured into it and is formed into a final contour as per specifications.

Abstract: A power measurement cell comprises at least one thermoelement (30) and at least two heating elements (20, 21, 25). A first heating element (20, 21) can be heated by a measurement signal. A temperature can be measured by means of the thermoelement (30). The two heating elements (20, 21, 25) have a very small spacing. The at least one thermoelement (30) and the two heating elements (20, 21, 25) have a high thermal coupling.

Abstract: A measuring device used for registering a test signal originating from a circuit structure applied to a wafer. The measuring device provides at least one test probe and at least one test transformer. The at least one test transformer is connected to the at least one test probe in an electrically conductive manner. In this context, the test transformer is arranged on the test probe.

Abstract: A measuring device used for registering a test signal originating from a circuit structure applied to a wafer. The measuring device provides at least one test probe and at least one test transformer. The at least one test transformer is connected to the at least one test probe in an electrically conductive manner. In this context, the test transformer is arranged on the test probe.

Abstract: A power measurement cell comprises at least one thermoelement (30) and at least two heating elements (20, 21, 25). A first heating element (20, 21) can be heated by a measurement signal. A temperature can be measured by means of the thermoelement (30). The two heating elements (20, 21, 25) have a very small spacing. The at least one thermoelement (30) and the two heating elements (20, 21, 25) have a high thermal coupling.