Abstract: A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.

Abstract: An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.

Abstract: An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.

Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.

Abstract: A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.

Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.

Abstract: A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.